Methods and Systems for Plasma Etching Using Bi-Modal Process Gas Composition Responsive to Plasma Power Level

    公开(公告)号:US20170271166A1

    公开(公告)日:2017-09-21

    申请号:US15615768

    申请日:2017-06-06

    IPC分类号: H01L21/3065 H01L21/308

    摘要: A substrate is disposed on a substrate holder within a process module. The substrate includes a mask material overlying a target material with at least one portion of the target material exposed through an opening in the mask material. A bi-modal process gas composition is supplied to a plasma generation region overlying the substrate. For a first period of time, a first radiofrequency power is applied to the bi-modal process gas composition to generate a plasma to cause etching-dominant effects on the substrate. For a second period of time, after completion of the first period of time, a second radiofrequency power is applied to the bi-modal process gas composition to generate the plasma to cause deposition-dominant effects on the substrate. The first and second radiofrequency powers are applied in an alternating and successive manner for an overall period of time to remove a required amount of exposed target material.

    Methods and Systems for Plasma Etching Using Bi-Modal Process Gas Composition Responsive to Plasma Power Level

    公开(公告)号:US20170125253A1

    公开(公告)日:2017-05-04

    申请号:US14932265

    申请日:2015-11-04

    IPC分类号: H01L21/3065 H01L21/308

    摘要: A substrate is disposed on a substrate holder within a process module. The substrate includes a mask material overlying a target material with at least one portion of the target material exposed through an opening in the mask material. A bi-modal process gas composition is supplied to a plasma generation region overlying the substrate. For a first period of time, a first radiofrequency power is applied to the bi-modal process gas composition to generate a plasma to cause etching-dominant effects on the substrate. For a second period of time, after completion of the first period of time, a second radiofrequency power is applied to the bi-modal process gas composition to generate the plasma to cause deposition-dominant effects on the substrate. The first and second radiofrequency powers are applied in an alternating and successive manner for an overall period of time to remove a required amount of exposed target material.

    Systems and methods for reverse pulsing
    65.
    发明授权
    Systems and methods for reverse pulsing 有权
    用于反向脉冲的系统和方法

    公开(公告)号:US09583357B1

    公开(公告)日:2017-02-28

    申请号:US15139045

    申请日:2016-04-26

    摘要: Systems and methods for reverse pulsing are described. One of the methods includes receiving a digital signal having a first state and a second state. The method further includes generating a transformer coupled plasma (TCP) radio frequency (RF) pulsed signal having a high state when the digital signal is in the first state and having a low state when the digital signal is in the second state. The method includes providing the TCP RF pulsed signal to one or more coils of a plasma chamber, generating a bias RF pulsed signal having a low state when the digital signal is in the first state and having a high state when the digital signal is in the second state, and providing the bias RF pulsed signal to a chuck of the plasma chamber.

    摘要翻译: 描述了用于反向脉冲的系统和方法。 方法之一包括接收具有第一状态和第二状态的数字信号。 该方法还包括当数字信号处于第一状态时产生具有高状态的变压器耦合等离子体(TCP)射频(RF)脉冲信号,并且当数字信号处于第二状态时具有低状态。 该方法包括将TCP RF脉冲信号提供给等离子体室的一个或多个线圈,当数字信号处于第一状态时产生具有低状态的偏置RF脉冲信号,并且当数字信号处于 并且将偏压RF脉冲信号提供给等离子体室的卡盘。

    SYNCHRONIZATION OF RF GENERATORS
    66.
    发明公开

    公开(公告)号:US20240331976A1

    公开(公告)日:2024-10-03

    申请号:US18740449

    申请日:2024-06-11

    IPC分类号: H01J37/32

    摘要: Systems and methods for synchronization of radio frequency (RF) generators are described. One of the methods includes receiving, by a first RF generator, a first recipe set, which includes information regarding a first plurality of pulse blocks for operating the first RF generator. The method further includes receiving, by a second RF generator, a second recipe set, which includes information regarding a second plurality of pulse blocks for operating a second RF generator. Upon receiving a digital pulsed signal, the method includes executing the first recipe set and executing the second recipe set. The method further includes outputting a first one of the pulse blocks of the first plurality based on the first recipe set in synchronization with a synchronization signal. The method includes outputting a first one of the pulse blocks of the second plurality based on the second recipe set in synchronization with the synchronization signal.

    SENSOR DATA COMPRESSION IN A PLASMA TOOL
    67.
    发明公开

    公开(公告)号:US20230207267A1

    公开(公告)日:2023-06-29

    申请号:US17926574

    申请日:2021-05-10

    IPC分类号: H01J37/32

    CPC分类号: H01J37/32183 H01J37/32926

    摘要: Systems and methods for compressing data are described. One of the methods includes receiving a plurality of measurement signals from one or more sensors coupled to a radio frequency (RF) transmission path of a plasma tool. The RF transmission path is from an output of an RF generator to an electrode of a plasma chamber. The method includes converting the plurality of measurement signals from an analog form to a digital form to sample data and processing the data to reduce an amount of the data. The amount of the data is compressed to output compressed data. The method includes sending the compressed data to a controller for controlling the plasma tool.

    SYSTEMS AND METHODS FOR MULTI-LEVEL PULSING IN RF PLASMA TOOLS

    公开(公告)号:US20220216038A1

    公开(公告)日:2022-07-07

    申请号:US17605982

    申请日:2020-04-24

    IPC分类号: H01J37/32

    摘要: Systems and methods for multi-level pulsing are described. The systems and methods include generating four or more states. During each of the four or more states, a radio frequency (RF) generator generates an RF signal. The RF signal has four or more power levels, and each of the four or more power levels corresponds to the four or more states. The multi-level pulsing facilitates a finer control in processing a substrate.

    ETCHING ISOLATION FEATURES AND DENSE FEATURES WITHIN A SUBSTRATE

    公开(公告)号:US20210358757A1

    公开(公告)日:2021-11-18

    申请号:US17298931

    申请日:2019-11-22

    摘要: Systems and methods for etching different features in a substantially equal manner are described. One of the methods includes applying a low frequency bias signal during a low TCP state and applying a high frequency bias signal during a high TCP state. The application of the low frequency bias signal during the low TCP state facilitates generation of hot neutrals, which are used to increase an etch rate of etching dense features compared to an etch rate for etching isolation features. The application of the high frequency bias signal during the high TCP state facilitates generation of ions to increase an etch rate of etching the isolation features compared to an etch rate of etching the dense features. After applying the low frequency bias signal during the low TCP state and the high frequency bias signal during the high TCP state, the isolation and dense features are etched similarly.