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    UNIT SUBSTRATE FOR OPTICAL DEVICE AND OPTICAL DEVICE PACKAGE HAVING SAME
    62.
    发明申请
    UNIT SUBSTRATE FOR OPTICAL DEVICE AND OPTICAL DEVICE PACKAGE HAVING SAME 审中-公开

    公开(公告)号：US20190097090A1

    公开(公告)日：2019-03-28

    申请号：US16144857

    申请日：2018-09-27

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Moon Hyun KIM

    IPC: H01L33/48 ,  H01L33/58

    Abstract: Disclosed is a unit substrate for an optical device, the unit substrate including: an optical device-mounting region provided on an upper surface of the unit substrate; and first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween. A lower surface of the unit substrate is electrically connected to the mounting region, and side and upper surfaces of the unit substrate are electrically isolated from the mounting region such that an optical device is capable of operating in an environment with low electrical resistance.

    PRE-CUT SUBSTRATE AND UNIT CHIP SUBSTRATE COMPRISING HEMISPHERICAL CAVITY
    65.
    发明申请
    PRE-CUT SUBSTRATE AND UNIT CHIP SUBSTRATE COMPRISING HEMISPHERICAL CAVITY 审中-公开
    预切割基板和包含HEMISPHERICAL CAVITY的单元芯片基板

    公开(公告)号：US20160380167A1

    公开(公告)日：2016-12-29

    申请号：US14753847

    申请日：2015-06-29

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Young Woon JEON ,  Kyong Su YOO

    IPC: H01L33/58 ,  H05K1/18 ,  H05K1/02 ,  H01L33/48 ,  H01L33/62

    CPC classification number: H05K1/182 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/97

    Abstract: Disclosed are an uncut chip plate and a chip substrate. The uncut chip plate includes: conductive portions laminated in one direction to constitute the uncut chip plate; insulation portions alternately laminated with the conductive portions to electrically isolate the conductive portions; and cavities formed at a predetermined depth in a hemispherical concave shape in regions including each of the insulation portions in a corresponding relationship with unit chip substrates defined on an upper surface of the uncut chip plate. According to the present invention, an optical element chip package exhibiting a high illuminance in a central portion can be realized through the use of an easy-to-process planar lens. Furthermore, as compared with a case where a hemispherical lens is used, it is possible to reduce the thickness of the chip package. This makes it possible to reduce the thickness of a device to which the chip package is applied.

    Abstract translation: 公开了未切割的芯片板和芯片基板。 未切割的芯片板包括：在一个方向上层叠以构成未切割的芯片板的导电部分; 绝缘部分与导电部分交替地层叠以电绝缘导电部分; 以及在与所述未切割的芯片板的上表面上限定的单位芯片基板对应的关系中，包括每个所述绝缘部分的区域以预定深度形成半球形凹形的空腔。 根据本发明，可以通过使用易于处理的平面透镜来实现在中心部分中呈现高照度的光学元件芯片封装。 此外，与使用半球形透镜的情况相比，可以减小芯片封装的厚度。 这使得可以减小应用芯片封装的器件的厚度。

    ANODIC OXIDATION FILM STRUCTURE
    67.
    发明申请
    ANODIC OXIDATION FILM STRUCTURE 有权

    公开(公告)号：US20250011939A1

    公开(公告)日：2025-01-09

    申请号：US18712704

    申请日：2022-11-21

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Young Heum EOM ,  Shin Goo KANG

    IPC: C23C28/00 ,  C23C14/16 ,  C25D5/02 ,  C25D7/04 ,  C25D11/24 ,  G01R1/073

    Abstract: The present invention provides an anodic oxidation film structure and a manufacturing method therefor, the anodic oxidation film structure comprising: a body made of an anodic oxidization film obtained by anodic oxidation on a parent metal and then removing the parent metal; a through-hole which is formed through the body and has a larger inner width than that of a pore formed during the anodic oxidation; and a metal layer provided on the inner wall of the through-hole, and thus improving the mechanical and/or electrical characteristics of the inner wall of the through-hole.

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