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105 条记录 (耗时 0.031 秒)

    RFID tag
    61.
    发明授权
    RFID tag 失效
    RFID标签

    公开(公告)号：US07486191B2

    公开(公告)日：2009-02-03

    申请号：US11378623

    申请日：2006-03-20

    申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matumura

    发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matumura

    IPC分类号： G08B13/14

    CPC分类号： G06K19/07749 ,  G06K19/077 ,  G06K19/07728 ,  H01Q1/2208 ,  H01Q9/16 ,  Y10T156/10 ,  Y10T156/1754

    摘要： The present invention relates to an RFID tag performing exchange of information with an external device without contact, and is to improve the resistance to bending while avoiding an increase in the thickness of the RFID tag. A circuit chip is bonded to a base portion of a base with a thermosetting adhesive. The base is folded, and an ultraviolet curing adhesive is applied on the circuit chip. The fold-back portions of the base are folded back onto the circuit chip, to which portions ultraviolet light is irradiated, as a result, both of the surfaces of the circuit chip are bonded to the base with the adhesives.

    摘要翻译： RFID标签技术领域本发明涉及RFID标签，其与外部设备进行信息交换而不接触，并且提高耐弯曲性，同时避免RFID标签的厚度增加。 电路芯片用热固性粘合剂粘合到基底的基部。 折叠底座，并在电路芯片上施加紫外线固化粘合剂。 将基座的折回部分折回到电路芯片上，照射部分紫外线，结果，电路芯片的两个表面都用粘合剂粘合到基底上。

    RFID tag
    62.
    发明授权
    RFID tag 有权
    RFID标签

    公开(公告)号：US07463156B2

    公开(公告)日：2008-12-09

    申请号：US11584608

    申请日：2006-10-23

    申请人： Shunji Baba ,  Wei Jie

    发明人： Shunji Baba ,  Wei Jie

    IPC分类号： G08B13/14

    CPC分类号： G06K19/077 ,  G06K19/0773

    摘要： A RFID tag includes an inlet in which an antenna for communication and a circuit chip performing radio communication with the antenna are electrically connected to each other. The RFID tag further includes a thermal storage section which encloses the inlet, which is made of a nonmetal, and which prevents thermal diffusion into the inlet and a thermal insulating section which encloses the thermal storage section, which prevents thermal conduction to the thermal storage section, and which has higher thermal diffusivity than thermal diffusivity of the thermal storage section and lower thermal conductivity than thermal conductivity of the thermal storage section.

    摘要翻译： RFID标签包括用于通信的天线和与天线进行无线电通信的电路芯片彼此电连接的入口。 RFID标签进一步包括一个热存储部分，该热存储部分包围由非金属制成的入口，并且防止热扩散到入口中;隔热部分包围热储存部分，该隔热部分防止热存储部分 并且具有比热储存部分的热扩散率更高的热扩散率和比热存储部分的热导率低的热导率。

    Packaging structure and packaging method of electronic components
    65.
    发明授权
    Packaging structure and packaging method of electronic components 有权
    电子元件的包装结构和包装方法

    公开(公告)号：US07288722B2

    公开(公告)日：2007-10-30

    申请号：US11049901

    申请日：2005-02-04

    申请人： Shunji Baba

    发明人： Shunji Baba

    IPC分类号： H05K1/00 ,  H05K3/30 ,  H01R12/04 ,  H05K1/11

    CPC分类号： H05K1/189 ,  H05K2201/055 ,  H05K2201/096 ,  Y10T29/49135

    摘要： An electronic part mounting structure includes a printed circuit board, a plurality of electronic parts mounted on the printed circuit board, a folded portion of the printed circuit board bent and layered between the electronic parts, through holes formed in both sides of the folded portion, and a wiring connecting the electronic parts via the through holes and connecting the electronic parts to the through holes.

    摘要翻译： 电子部件安装结构包括印刷电路板，安装在印刷电路板上的多个电子部件，弯曲并分层在电子部件之间的印刷电路板的折叠部分，形成在折叠部分两侧的通孔， 以及经由通孔连接电子部件并将电子部件连接到通孔的布线。