摘要:
There is provided a novel organic silicon compound that can be used for a silane coupling agent. An organic silicon compound of Formula (1): (where A− is Formula (2) or Formula (3): E is Formula (4) or Formula (5): R1 and R2 are each independently a C1-5 alkyl group, R3 is a hydrogen atom or a methyl group, R4 and R5 are each independently a C1-5 alkyl group, m, n, and p are each independently an integer of 1 to 5, and q is an integer of 1 to 3).
摘要:
Provided are a rubber composition suitable for cushion rubbers of retreaded tires in which tread rubbers of tires such as truck and bus tires (TBR) and aircraft tires are replaced for reuse, and a rubber composition which is suitable for adhesion carried out by interposing the rubber composition between vulcanized rubber members and covulcanizing them in a tire prepared by adhering separately vulcanized rubber members and which is excellent in a productivity. The rubber composition is characterized by comprising 0.3 to 2.5 parts by mass of aldehydeamines, 0.1 to 1.5 part by mass of at least one compound selected from a group consisting of tetra(2-ethylhexyl)thiuram disulfide, 1,6-bis(N,N′-dibenzylthiocarbamoyldithio)-hexane and 1,6-bis{N,N′-di(2-ethylhexyl)thiocarbamoyldithio}-hexane, and 0.1 to 2.5 parts by mass of a thiazole type vulcanization accelerator based on 100 parts by mass of a rubber component.
摘要:
There is provided a novel organic silicon compound that can be used for a silane coupling agent. An organic silicon compound of Formula (1): (where A− is Formula (2) or Formula (3): E is Formula (4) or Formula (5): R1 and R2 are each independently a C1-5 alkyl group, R3 is a hydrogen atom or a methyl group, R4 and R5 are each independently a C1-5 alkyl group, m, n, and p are each independently an integer of 1 to 5, and q is an integer of 1 to 3).
摘要:
Provided are a rubber composition suitable for cushion rubbers of retreaded tires in which tread rubbers of tires such as truck and bus tires (TBR) and aircraft tires are replaced for reuse, and a rubber composition which is suitable for adhesion carried out by interposing the rubber composition between vulcanized rubber members and covulcanizing them in a tire prepared by adhering separately vulcanized rubber members and which is excellent in a productivity. The rubber composition is characterized by comprising 0.3 to 2.5 parts by mass of aldehydeamines, 0.1 to 1.5 part by mass of at least one compound selected from a group consisting of tetra(2-ethylhexyl)thiuram disulfide, 1,6-bis(N,N′-dibenzylthiocarbamoyldithio)-hexane and 1,6-bis{N,N′-di(2-ethylhexyl)thiocarbamoyldithio}-hexane, and 0.1 to 2.5 parts by mass of a thiazole type vulcanization accelerator based on 100 parts by mass of a rubber component.
摘要:
A resist underlayer film forming composition used in a lithography process includes: a polymer (A) containing a unit structure having a hydroxy group, a unit structure having a carboxy group, or combination thereof; a crosslinkable compound (B) having at least two vinyl ether groups; a photoacid generator (C); a C4-20 fluoroalkylcarboxylic acid or a salt of the fluoroalkylcarboxylic acid (D); and a solvent (E). The polymer (A) includes a unit structure selected from unit structures of Formula (1), Formula (2), and Formula (3);
摘要:
Provided is a retreaded tire that uses cushion rubber for retread that is able to further improve the prevention of separation failure while effectively suppressing blowout within the cushion rubber layer. The retreaded tire includes cushion rubber for retread, a base tire, and precured tread rubber formed of at least one rubber layer, and is characterized by: the aforementioned cushion rubber for retreaded tires being formed from a rubber composition containing specific quantities of a highly reinforcing carbon black of at least HAF grade, and natural rubber and/or synthetic polyisoprene rubber; the 100% modulus (AM) of the rubber layer (A) that comprises the aforementioned cushion rubber for retread being at least 3.0 MPa and less than 6.0 MPa; and the outermost layer (B) of the aforementioned base tire and the innermost layer (C) of the aforementioned precured tread rubber being formed from a rubber composition containing specific quantities of natural rubber and/or synthetic polyisoprene rubber.
摘要:
A packing configuration of a cable hardly collapsing the cylindrical shape of a cable bundle and hardly producing a bending tendency and a knot on the cable. The packing configuration includes the cylindrical cable bundle formed by coiling the cable in an 8-shape, a binding member which is disposed on the outer peripheral part of the cable bundle and which binds the cable bundle, and a storage container for storing the cable bundle and the binding member.
摘要:
A semiconductor chip is mounted on a wiring board that has a two-layer lead structure. One of the leads used for receiving input signals is disposed on the lower layer and runs underneath the semiconductor chip forming an U-shaped wiring line while other leads are disposed on the upper layer. Because one of the upper layer leads for receiving input signals is disposed in the U-shaped pocket of the U-shaped wiring line of the lower layer, the relative positioning of corresponding terminals can be changed into a reversal of the positioning of the electrode pads of the chip connected to the terminals. Furthermore, one of the upper layer lead for receiving control signals is placed between the chip and the lower layer lead underneath the chip to prevent high frequency signal interference.
摘要:
The present invention comprises a first main face (22a) on the surface side of a substrate (21a). An island portion (26) is formed on the first main face (22a) and a semiconductor chip (29), etc. are adhered onto the first main face (22a). The semiconductor chip (29), etc. are sealed in a hollow space made by a column portion (23) and a transparent glass plate (36). Then, the column portion (23) and the glass plate (36) are adhered by the light-shielding adhesive resin made of epoxy resin. Accordingly, there can be provided the semiconductor device and a method of manufacturing the same, which can prevent the direct incidence of the light onto the semiconductor chip (29) and the degradation of the characteristic of the semiconductor chip (29) can be suppressed.
摘要:
A developing apparatus includes a developer bearing member, a first magnetic pole and a second magnetic pole of a same polarity as that of the first magnetic pole, and a regulating member. A regulating portion of the regulating member is provided within a range from a point of the maximum magnetic flux density of the second magnetic pole and an angular point corresponding to a half of the half value width of the second magnetic pole at the downstream side in the rotating direction of the developer bearing member.