Abstract:
In a semiconductor device 100, a light emitting element 120 has been mounted on an upper plane of a semiconductor substrate 102. In an impurity diffusion region of the semiconductor substrate 102, a P conducting type of a layer 104, and an N layer 106 have been formed, while an N conducting type impurity is implanted to the P layer 104, and then the implanted impurity is diffused to constitute the N layer 106. A zener diode 108 made of a semiconductor device has been formed by the P layer 104 and the N layer 106.
Abstract:
A single camera acquires an input image of a scene as observed in an array of spheres, wherein pixels in the input image corresponding to each sphere form a sphere image. A set of virtual cameras are defined for each sphere on a line joining a center of the sphere and a center of projection of the camera, wherein each virtual camera has a different virtual viewpoint and an associated cone of rays, appearing as a circle of pixels on its virtual image plane. A projective texture mapping of each sphere image is applied to all of the virtual cameras on the virtual image plane to produce a virtual camera image comprising circle of pixels. Each virtual camera image for each sphere is then projected to a refocusing geometry using a refocus viewpoint to produce a wide-angle lightfield view, which are averaged to produce a refocused wide-angle image.
Abstract:
A storage subsystem includes: a controller; a first logical storage area corresponding to a RAID group configured by a plurality of storage devices; and a second logical storage area corresponding to a plurality of the RAID groups each configured by the plurality of storage devices, and storing a copy of data stored in the first logical storage area. In the storage subsystem, the first and second logical storage areas form a copy group, and for starting copying from the first to second logical storage area, the controller performs a mode change, from a power saving mode to a ready mode, to the plurality of storage devices configuring the plurality of RAID groups corresponding to the second logical storage area. With such a storage subsystem, the time can be reduced for activating copy-destination storage devices to which a power saving function is applied, and the copy time is thus favorably reduced.
Abstract:
Proposed is an operation method for seeking a power interruption operation target in which MTBF will become longest. When a target value regarding a power interruption time and a target value regarding a power interruption count per 24 hours is input from an administrator to a management computer, the management computer calculates the MTBF after one year and the annual power consumption for each of the input target values, and, as a power interruption operation target in which the MTBF will become longest in one year, a target value regarding a power interruption time and a target value regarding a power interruption count are respectively selected among multiple target values in which the MTBF will become longest based on each of the calculation results, and displayed on a screen of an output unit.
Abstract:
Conventionally, no consideration was given to the control of the main power supply circuit in a storage apparatus. Thus, unnecessary electric power will be consumed because it is not possible to inhibit the power consumption of the main power supply circuit of the storage apparatus. With this storage system having a plurality of storage apparatuses, a storage apparatus internally has a power supply control program for controlling the respective components and the main power supply circuit, and the power supply control command program provided to the management computer migrates a storage extent to be used for business to another storage apparatus based on the operation schedule of business to use the storage extent of the storage apparatus, and commands the power supply control of the main power supply circuit in the storage apparatuses and the respective components.
Abstract:
A semiconductor package includes a wiring board and a semiconductor device mounted on the wiring board. At least one penetration hole extends from one surface of the semiconductor chip to an opposite surface of the semiconductor chip. A penetration electrode is situated inside the penetration hole without contacting a wall of the penetration hole. The penetration electrode has one end fixed to the one surface of the semiconductor chip and an opposite end protruding from the opposite surface of the semiconductor chip. A connection terminal is formed on the opposite end of the penetration electrode and electrically connected to the wiring board.
Abstract:
A light-emitting device including a light-emitting element and a substrate where the light-emitting element is arranged. A housing part housing the light-emitting element and having a shape that is tapered upward from the substrate and a metal frame surrounding the light-emitting element and including the side face of the housing part made into an almost mirror-polished surface are provided on the substrate.
Abstract:
One of a backup apparatus and a storage system performs control to store backup data in a storage system which belongs to an organization and/or location different from an organization and/or location to which a storage-target storage system for original data belongs, based on information (P) and/or (Q) below: (P) information relating to original data, and information relating to backup data, which is a copy of the original data; (Q) information indicating an organization and/or location to which each storage system belongs.
Abstract:
In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the through electrode in the bottom surface side of the cavity has a connection part to a wiring that forms an electric circuit including the chip of the electronic device. The silicon substrate for a package is characterized in that (1) a thin film wiring is included as the wiring and the connection part is reinforced by a conductor connected to the thin film wiring and/or (2) a wire bonding part is included as the wiring and the connection part is formed by wire bonding the end part of the through electrode in the bottom surface side of the cavity.
Abstract:
Provided is a computer system including a plurality of storage apparatuses, in which, if the storage apparatuses employ an external mapping/connection system, the plurality of storage apparatuses can efficiently use each other's storage resources. The computer system includes a plurality of storage apparatuses and a management computer for managing the storage apparatuses. The management computer determines whether or not it is possible to perform external connection between the plurality of storage apparatuses and whether or not it is possible to divert the use of a storage device in one storage apparatus to another storage apparatus, on the basis of a criteria table, and if it is possible to perform external connection between the plurality of storage apparatuses, it is carried out and, if it is not possible, the management computer diverts the use of a storage device in one storage apparatus to another storage apparatus.