公开(公告)号：US06921895B1

公开(公告)日：2005-07-26

申请号：US09914083

申请日：1999-02-13

Applicant: Jörg Schieferdecker ,  Mischa Schulze

Inventor： Jörg Schieferdecker ,  Mischa Schulze

IPC: G01J5/04 ,  G05D23/27 ,  H05B6/68 ,  H05B6/80 ,  G01J5/20

CPC classification number: H05B6/6447 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/04 ,  G01J5/045 ,  G01J5/08 ,  G01J5/0815 ,  G01J2005/068 ,  G05D23/27

Abstract: A sensor module comprises a radiation-sensitive sensor element (12), a sensor signal processing circuit (13, 41a, 44a) receiving the output signal of the sensor element (12) and obtaining a radiation-dependent first electric signal therefrom, a temperature-sensitive reference means (14, 15, 41b, 43, 44b) providing a temperature-dependent second electric signal and a signal combining means (16) for combining the two electric signals. The sensor signal processing circuit (13, 41a, 44a), the reference means (14, 15, 41b, 44b) and the combining means (16) are formed on a single chip (20, 21), and the chip (20, 21) and the sensor element (12) are accommodated in a common housing (22, 62, 64).

Abstract translation: 传感器模块包括辐射敏感传感器元件（12），接收传感器元件（12）的输出信号并从其获得依赖于辐射的第一电信号的传感器信号处理电路（13,41a，44aa） 提供温度依赖的第二电信号的温度敏感参考装置（14,15,41b，43,44b）和用于组合两个电信号的信号组合装置（16）。 传感器信号处理电路（13,41a，44a），参考装置（14,15bb，44b）和组合装置（16）形成在单个芯片（20,21）上，并且 芯片（20,21）和传感器元件（12）容纳在公共壳体（22,62,64）中。

公开(公告)号：US06787387B2

公开(公告)日：2004-09-07

申请号：US10601470

申请日：2003-06-23

Applicant: Kimiya Ikushima ,  Hiroyoshi Komobuchi ,  Mikiya Uchida

Inventor： Kimiya Ikushima ,  Hiroyoshi Komobuchi ,  Mikiya Uchida

IPC: H01L2100

CPC classification number: G01J5/20 ,  B81B3/0072 ,  B81B2201/0207 ,  B81B2203/0127 ,  B81C1/00047 ,  B81C1/00801 ,  B81C2201/0109 ,  B81C2201/014 ,  G01F1/6845 ,  G01J5/023 ,  G01J5/024 ,  G01J5/045 ,  G01J5/10 ,  G01J5/34

Abstract: A method for fabricating an electronic device includes the steps of: preparing a cavity defining sacrificial layer, at least the upper surface of which is covered with an etch stop layer; forming at least one first opening in the etch stop layer, thereby partially exposing the surface of the cavity defining sacrificial layer; etching the cavity defining sacrificial layer through the first opening, thereby defining a provisional cavity under the etch stop layer and a supporting portion that supports the etch stop layer thereon; and etching away a portion of the etch stop layer, thereby defining at least one second opening that reaches the provisional cavity through the etch stop layer and expanding the provisional cavity into a final cavity.

公开(公告)号：US06753526B2

公开(公告)日：2004-06-22

申请号：US10103403

申请日：2002-03-20

Applicant: Michel Vilain

Inventor： Michel Vilain

IPC: G01J500

CPC classification number: H01L27/14618 ,  B81B7/0038 ,  G01J5/04 ,  G01J5/045 ,  G01J5/20 ,  H01L27/14632 ,  H01L27/14649 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: The present invention relates to a method of manufacturing radiation detectors, in which these detectors each comprise a set of microdetectors, for example microbolometers, situated under a window that is transparent to said radiation. According to the invention, said detectors are manufactured collectively on a substrate (1), and said method comprises notably the following steps: the construction of several layers, of which, for each of said detectors, at least one layer (4) is transparent to said radiation and serves as a window, and the partial elimination of said layers principally under said transparent layer(4), such that said microdetectors (2) are placed, for each of said detectors, in one or more cavities, which are then placed under vacuum or under low pressure. The invention also relates to various radiation detectors, of which the walls form hermetically sealed cavities each containing one or more microdetectors (2).

Abstract translation: 本发明涉及一种制造辐射探测器的方法，其中这些检测器各自包括一组位于对所述辐射透明的窗口下方的微检测器，例如微电热计。 根据本发明，所述检测器集体地制造在基板（1）上，并且所述方法显着地包括以下步骤：构造几层，其中对于每个所述检测器，至少一层（4）是透明的 到所述辐射并且用作窗口，并且主要在所述透明层（4）下部分消除所述层，使得对于每个所述检测器将所述微检测器（2）放置在一个或多个空腔中，然后将其放置 在真空或低压下，本发明还涉及各种辐射检测器，其中壁形成密封腔，每个包含一个或多个微检测器（2）。

公开(公告)号：US20040072384A1

公开(公告)日：2004-04-15

申请号：US10628849

申请日：2003-07-28

Applicant: Honeywell International Inc.

Inventor： Barrett E. Cole

IPC: H01L031/00

CPC classification number: H01L27/14632 ,  G01J5/045 ,  G01J5/0875 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14649 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An infrared detector has a window in a cover having a cavity for exposing detector pixels to incident radiation. The window has an antireflective element formed within the cavity as a field of posts. The field of post structures is formed in a cavity by etching the posts in a desired pattern first, and forming the cavity by a general etch over the whole field afterward.

Abstract translation: 红外检测器具有在盖中的窗口，其具有用于将检测器像素暴露于入射辐射的空腔。 窗口具有在腔内形成的抗反射元件作为柱的场。 柱结构的领域通过首先通过以期望的图案蚀刻柱而形成在腔中，并且通过在整个场之后的一般蚀刻来形成空腔。

公开(公告)号：US20040053435A1

公开(公告)日：2004-03-18

申请号：US10601470

申请日：2003-06-23

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Kimiya Ikushima ,  Hiroyoshi Komobuchi ,  Mikiya Uchida

IPC: H01L021/00

CPC classification number: G01J5/20 ,  B81B3/0072 ,  B81B2201/0207 ,  B81B2203/0127 ,  B81C1/00047 ,  B81C1/00801 ,  B81C2201/0109 ,  B81C2201/014 ,  G01F1/6845 ,  G01J5/023 ,  G01J5/024 ,  G01J5/045 ,  G01J5/10 ,  G01J5/34

Abstract: A method for fabricating an electronic device includes the steps of: preparing a cavity defining sacrificial layer, at least the upper surface of which is covered with an etch stop layer; forming at least one first opening in the etch stop layer, thereby partially exposing the surface of the cavity defining sacrificial layer; etching the cavity defining sacrificial layer through the first opening, thereby defining a provisional cavity under the etch stop layer and a supporting portion that supports the etch stop layer thereon; and etching away a portion of the etch stop layer, thereby defining at least one second opening that reaches the provisional cavity through the etch stop layer and expanding the provisional cavity into a final cavity.

Abstract translation: 一种制造电子器件的方法包括以下步骤：制备限定牺牲层的空腔，其至少其上表面被蚀刻停止层覆盖; 在蚀刻停止层中形成至少一个第一开口，从而部分地暴露限定牺牲层的空腔的表面; 蚀刻通过所述第一开口限定牺牲层的所述腔，从而在所述蚀刻停止层下方限定临时空腔，以及在其上支撑所述蚀刻停止层的支撑部分; 并且蚀刻掉蚀刻停止层的一部分，从而限定通过蚀刻停止层到达临时腔的至少一个第二开口，并将临时空腔膨胀成最终空腔。

公开(公告)号：US20030062480A1

公开(公告)日：2003-04-03

申请号：US10260501

申请日：2002-10-01

Applicant: NEC CORPORATION

Inventor： Masayuki Kanzaki

IPC: G01J005/00

CPC classification number: B81B7/0041 ,  B81C2203/0136 ,  B81C2203/0145 ,  G01J5/04 ,  G01J5/045 ,  G01J5/20 ,  H01L27/14669

Abstract: An infrared ray detector includes an array of pixels each including a micro-bridge structure wherein a diaphragm is supported in spaced relationship with a substrate by a beam structure. Each pixel has a vacuum encapsulation structure supported in a base area wherein the beam structure is supported by the substrate. The vacuum encapsulation structure includes a window film encapsulating first and second vacuum spaces formed by removing first and second sacrificial films sandwiching therebetween the diaphragm.

Abstract translation: 一种红外线检测器，包括各自包括微桥结构的像素阵列，其中隔膜通过光束结构与衬底间隔开地支撑。 每个像素具有支撑在基底区域中的真空封装结构，其中光束结构由衬底支撑。 该真空封装结构包括一个密封第一和第二真空空间的窗膜，该第一和第二真空空间是通过除去夹在其间的隔膜的第一和第二牺牲膜形成的。

公开(公告)号：US20020186745A1

公开(公告)日：2002-12-12

申请号：US10136029

申请日：2002-04-30

Applicant: Exergen Corp.

Inventor： Francesco Pompei ,  Janus Ternullo

IPC: G01J005/00

CPC classification number: G01J5/02 ,  G01J5/0022 ,  G01J5/0025 ,  G01J5/021 ,  G01J5/026 ,  G01J5/0265 ,  G01J5/04 ,  G01J5/045 ,  G01J5/06 ,  G01J5/16 ,  G01J2005/068

Abstract: A radiation detector for axillary temperature measurement comprises a wand having an axially directed radiation sensor at one end and an offset handle at the opposite end. The radiation sensor is mounted within a heat sink and retained by an elastomer in compression. The radiation sensor views a target surface through an emissivity compensating cup and a plastic film. A variable reference is applied to a radiation sensor and amplifier circuit in order to maintain full converter resolution over design ranges of target and sensor temperature with the sensor temperature either above or below target temperature.

Abstract translation: 用于腋温度测量的辐射检测器包括在一端具有轴向指向的辐射传感器的杆和在相对端的偏移手柄。 辐射传感器安装在散热器内并由弹性体保持压缩。 辐射传感器通过发射率补偿杯和塑料膜来观察目标表面。 可变参考应用于辐射传感器和放大器电路，以便在传感器温度高于或低于目标温度的情况下，保持完全转换器分辨率超过目标和传感器温度的设计范围。

公开(公告)号：US20020037026A1

公开(公告)日：2002-03-28

申请号：US09875343

申请日：2001-06-06

Inventor： Shigemi Sato ,  Osamu Iwamoto ,  Yasuhiro Shiohara ,  Yuji Oda

IPC: G01J005/02

CPC classification number: G01J5/04 ,  G01J5/02 ,  G01J5/021 ,  G01J5/0225 ,  G01J5/045 ,  G01J5/048 ,  G01J5/049 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0818 ,  G01J5/12 ,  G01J5/16 ,  G01J2005/068

Abstract: An infrared sensing element of the present invention includes a base including a thin film portion and a thick wall portion arranged around the thin film portion, and a thermopile including a plurality of thermocouples connected in series so that cold junctions are located on the thick wall portion and hot junctions are located on the thin film portion, wherein a thermosensitive portion is provided in contact with the thick wall portion so that a reference temperature with high accuracy can be used for determining temperature based on output from the thermopile. A PN junction formed on a semiconductor substrate serves as the thermosensitive portion, and it is used to provide for a compact infrared sensing element with high performance at low cost.

Abstract translation: 本发明的红外线感测元件包括：基底，其包括薄膜部分和布置在薄膜部分周围的厚壁部分;以及热电堆，其包括串联连接的多个热电偶，使得冷接点位于厚壁部分上 并且热接点位于薄膜部分上，其中热敏部分设置成与厚壁部分接触，使得可以使用高精度的参考温度来基于来自热电堆的输出来确定温度。 形成在半导体衬底上的PN结用作热敏部分，并且用于以低成本提供具有高性能的紧凑型红外感测元件。

公开(公告)号：US06359333B1

公开(公告)日：2002-03-19

申请号：US09052630

申请日：1998-03-31

Applicant: R. Andrew Wood ,  Jeffrey A. Ridley ,  Robert E. Higashi

Inventor： R. Andrew Wood ,  Jeffrey A. Ridley ,  Robert E. Higashi

IPC: H01L2312

CPC classification number: B81B7/0077 ,  G01J5/045 ,  G01J5/0875

Abstract: A wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, and may be divided into chips.

Abstract translation: 在一个晶片中具有至少一个凹部的晶片对，并且所述凹部形成为室，另一个晶片的附接具有在其外表面上与沉积层堵塞的端口。 该层的沉积可以在非常低的压力环境中进行，从而确保密封室中的相同种类的环境。 腔室可以封闭至少一个装置，如热电传感器，测辐射热计，发射器或其他类型的装置。 晶片对通常将具有多个室，并且可以被分成芯片。

公开(公告)号：US06297072B1

公开(公告)日：2001-10-02

申请号：US09293750

申请日：1999-04-16

Applicant: Hendrikus A. C. Tilmans ,  Eric Beyne ,  Myriam Van de Peer

Inventor： Hendrikus A. C. Tilmans ,  Eric Beyne ,  Myriam Van de Peer

IPC: H01L2144

CPC classification number: B81C1/00293 ,  B81B7/0077 ,  G01J5/045 ,  G01L9/0042 ,  G01L9/0073 ,  G01P15/0802 ,  G01P15/125 ,  H01H1/0036 ,  H01H35/14 ,  H01L21/50 ,  H01L23/10 ,  H01L2224/16 ,  H01L2924/01025 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H03H9/1057 ,  H01L2924/00

Abstract: A method of fabricating a microstructure having an inside cavity. The method includes depositing a first layer or a first stack of layers in a substantially closed geometric configuration on a first substrate. Then, performing an indent on the first layer or on the top layer of said first stack of layers. Then, depositing a second layer or a second stack of layers substantially with said substantially closed geometric configuration on a second substrate. Then, aligning and bonding said first substrate on said second substrate such that a microstructure having a cavity is formed according to said closed geometry configuration.

Abstract translation: 一种制造具有内腔的微结构的方法。 该方法包括在第一基底上沉积基本封闭的几何构型的第一层或第一层叠层。 然后，在所述第一层叠层的第一层或顶层上执行缩进。 然后，将基本上具有所述基本上封闭的几何构型的第二层或第二层叠层沉积在第二衬底上。 然后，将所述第一基板对准并粘结在所述第二基板上，使得根据所述封闭几何结构形成具有空腔的微结构。