公开(公告)号：US06650007B2

公开(公告)日：2003-11-18

申请号：US09924635

申请日：2001-08-08

申请人： Walter L. Moden ,  David J. Corisis ,  Leonard E. Mess ,  Larry D. Kinsman

发明人： Walter L. Moden ,  David J. Corisis ,  Leonard E. Mess ,  Larry D. Kinsman

IPC分类号： H01L2302

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.

摘要翻译： 一种用于球栅阵列半导体器件的高温热应用的装置封装以及包装球栅阵列半导体器件的方法。

公开(公告)号：US06637103B2

公开(公告)日：2003-10-28

申请号：US10005410

申请日：2001-12-03

申请人： Walter L. Moden

发明人： Walter L. Moden

IPC分类号： H05K330

CPC分类号： H01L23/49572 ,  H01L23/4985 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01R4/02 ,  H01R13/58 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49204 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05124

摘要： A tape bonding system may include a tape and a lead coupled to the tape. The lead may have a stress relief formed along its length which is adapted to relieve stresses and strains arising from differential thermal expansion of the materials to which the tape is coupled. The lead may have a first portion supported by the tape and a second portion which is unsupported by the tape due to an opening in the tape. The unsupported portion of the tape may be deflected to make contact with a bond pad. In this configuration, the lead may accommodate differential thermal expansion by cantilevered beam displacements. In addition, due to the provision of a stress relief, the beam can respond in a totally different rotational displacement to compressive stresses parallel to the surfaces of the integrated circuit elements being joined.

摘要翻译： 胶带粘合系统可以包括胶带和连接到胶带的引线。 导线可能具有沿着其长度形成的应力消除，其适于缓解由带耦合到的材料的不同热膨胀产生的应力和应变。 引线可以具有由带支撑的第一部分和由于带中的开口而不被带支撑的第二部分。 带的未支撑部分可能被偏转以与接合垫接触。 在这种构造中，引线可以通过悬臂梁的位移来适应不同的热膨胀。 此外，由于提供了应力消除，梁可以以完全不同的旋转位移响应平行于所连接的集成电路元件的表面的压缩应力。

公开(公告)号：US06634098B1

公开(公告)日：2003-10-21

申请号：US09358171

申请日：1999-07-20

申请人： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

发明人： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC分类号： H05K330

CPC分类号： H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

摘要翻译： 一种可垂直安装的半导体器件，包括从其底部边缘垂直延伸的多个短截线触头。 互补对准装置包括用于接收垂直安装的半导体器件的插座。 对准装置可附接到载体基板。 在将对准装置附接到载体基板并将可垂直安装的半导体装置插入到插座中时，接触元件向垂直安装的半导体器件施加向下的力，以建立并保持可垂直安装的半导体器件与 载体衬底。

公开(公告)号：US06577503B2

公开(公告)日：2003-06-10

申请号：US10191701

申请日：2002-07-08

申请人： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

发明人： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC分类号： H05K720

CPC分类号： H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

摘要： A high density vertical surface mount package and thermal carrier therefor including a heat sink.

摘要翻译： 一种高密度垂直表面贴装封装及其热载体，包括散热片。

公开(公告)号：US06551845B1

公开(公告)日：2003-04-22

申请号：US08581905

申请日：1996-01-02

申请人： Walter L. Moden ,  John O. Jacobson

发明人： Walter L. Moden ,  John O. Jacobson

IPC分类号： G01R3126

CPC分类号： G01R1/04 ,  G01R1/0483 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/01019 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of using adhesive tape to temporarily retain a die being temporarily held in a fixture during testing and burn-in. The method of the present invention uses a die cut piece of adhesively coated tape to hold a die in a test and burn-in fixture. Upon subsequent heating of the tape beyond the normal operating range of the adhesive coating on the tape, the die is removed from the tape, the tape is removed from the test and burn-in fixture, and the remaining adhesive, if any, is removed from the test and burn-in fixture.

公开(公告)号：US06531764B2

公开(公告)日：2003-03-11

申请号：US09939849

申请日：2001-08-27

申请人： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

发明人： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC分类号： H01L23495

CPC分类号： H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicular from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

摘要翻译： 一种可垂直安装的半导体器件，包括从其底部边缘垂直延伸的多个短截线触头。 互补对准装置包括用于接收垂直安装的半导体器件的插座。 对准装置可附接到载体基板。 在将对准装置附接到载体基板并将可垂直安装的半导体装置插入到插座中时，接触元件向垂直安装的半导体器件施加向下的力，以建立并保持可垂直安装的半导体器件与 载体衬底。

公开(公告)号：US06512290B2

公开(公告)日：2003-01-28

申请号：US09873869

申请日：2001-06-04

申请人： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

发明人： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC分类号： H01L2348

CPC分类号： H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

公开(公告)号：US06506628B2

公开(公告)日：2003-01-14

申请号：US09938105

申请日：2001-08-23

申请人： Tongbi Jiang ,  Syed S. Ahmad ,  Walter L. Moden

发明人： Tongbi Jiang ,  Syed S. Ahmad ,  Walter L. Moden

IPC分类号： H01L2144

CPC分类号： H01L23/49513 ,  H01L23/4951 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73257 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die, the lead finger of a leadframe, or both. By applying the adhesive only to identified good dice, time and material are saved over a process that applies adhesive to the entire wafer. By attaching the leadframe to the good die with a wet film, it is possible to remove the leadframe from the good die for rework if the good die subsequently tests unacceptable.

公开(公告)号：US06489564B2

公开(公告)日：2002-12-03

申请号：US10047797

申请日：2002-01-15

申请人： Walter L. Moden

发明人： Walter L. Moden

IPC分类号： H01R402

CPC分类号： H01L23/49572 ,  H01L23/4985 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01R4/02 ,  H01R13/58 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49204 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05124

摘要： A tape bonding system may include a tape and a lead coupled to the tape. The lead may have a stress relief formed along its length which is adapted to relieve stresses and strains arising from differential thermal expansion of the materials to which the tape is coupled. The lead may have a first portion supported by the tape and a second portion which is unsupported by the tape due to an opening in the tape. The unsupported portion of the tape may be deflected to make contact with a bond pad. In this configuration, the lead may accommodate differential thermal expansion by cantilevered beam displacements. In addition, due to the provision of a stress relief, the beam can respond in a totally different rotational displacement to compressive stresses parallel to the surfaces of the integrated circuit elements being joined.

公开(公告)号：US06418023B2

公开(公告)日：2002-07-09

申请号：US09944232

申请日：2001-08-30

申请人： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

发明人： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC分类号： H05K720

CPC分类号： H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

摘要： A high density vertical surface mount package and thermal carrier therefor including a heat sink.

摘要翻译： 一种高密度垂直表面贴装封装及其热载体，包括散热片。