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公开(公告)号：US08466562B2
公开(公告)日：2013-06-18
申请号：US12585778
申请日：2009-09-24
IPC分类号： H01L23/48
CPC分类号： H01L24/94 , H01L23/481 , H01L24/11 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05554 , H01L2224/0557 , H01L2224/1147 , H01L2224/13099 , H01L2225/06513 , H01L2225/06541 , H01L2225/06596 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/3025 , H01L2224/05552
摘要： A layered chip package includes a plurality of layer portions that are stacked, each of the layer portions including a semiconductor chip. The plurality of layer portions include at least one first-type layer portion and at least one second-type layer portion. The semiconductor chip has a circuit, a plurality of electrode pads electrically connected to the circuit, and a plurality of through electrodes. In every vertically adjacent two of the layer portions, the plurality of through electrodes of the semiconductor chip of one of the two layer portions are electrically connected to the respective corresponding through electrodes of the semiconductor chip of the other of the two layer portions. The first-type layer portion includes a plurality of wires for electrically connecting the plurality of through electrodes to the respective corresponding electrode pads, whereas the second-type layer portion does not include the wires.
摘要翻译： 分层芯片封装包括堆叠的多个层部分，每个层部分包括半导体芯片。 多个层部分包括至少一个第一类型层部分和至少一个第二类型的部分。 半导体芯片具有电路，电连接到电路的多个电极焊盘以及多个贯通电极。 在每个垂直相邻的两个层部分中，两个层部分中的一个的半导体芯片的多个通孔电连接到两个层部分中另一个的半导体芯片的相应的贯通电极。 第一型层部分包括用于将多个贯通电极电连接到各个对应的电极焊盘的多条导线，而第二型层部分不包括导线。
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72.发明授权公开(公告)号：US08465658B2
公开(公告)日：2013-06-18
申请号：US13110442
申请日：2011-05-18
申请人： Hironori Araki , Yoshitaka Sasaki , Hiroyuki Ito , Kazuki Sato , Shigeki Tanemura , Yukinori Ikegawa
发明人： Hironori Araki , Yoshitaka Sasaki , Hiroyuki Ito , Kazuki Sato , Shigeki Tanemura , Yukinori Ikegawa
CPC分类号： G11B5/3163 , G11B5/3116 , G11B2005/0021 , Y10T29/4902 , Y10T29/49021 , Y10T29/49032 , Y10T29/49043
摘要： In a method of forming a main pole, an initial accommodation layer is etched by RIE using a first etching mask having a first opening, whereby a groove is formed in the initial accommodation layer. Next, a part of the initial accommodation layer including the groove is etched by RIE using a second etching mask having a second opening, so that the groove becomes an accommodation part. The main pole is then formed in the accommodation part. The first etching mask has first and second sidewalls that face the first opening and are opposed to each other at a first distance in a track width direction. The second etching mask has third and fourth sidewalls that face the second opening and are opposed to each other at a second distance greater than the first distance.
摘要翻译： 在形成主极的方法中，使用具有第一开口的第一蚀刻掩模，通过RIE蚀刻初始容纳层，由此在初始容纳层中形成凹槽。 接下来，使用具有第二开口的第二蚀刻掩模，通过RIE蚀刻包括凹槽的初始容纳层的一部分，使得凹槽变成容纳部分。 主杆然后形成在容纳部分中。 第一蚀刻掩模具有面向第一开口并且在轨道宽度方向上以第一距离彼此相对的第一和第二侧壁。 第二蚀刻掩模具有面向第二开口的第三和第四侧壁，并且在大于第一距离的第二距离处彼此相对。
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公开(公告)号：US08441112B2
公开(公告)日：2013-05-14
申请号：US12896283
申请日：2010-10-01
CPC分类号： H01L25/50 , H01L22/22 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/04105 , H01L2224/08145 , H01L2224/13025 , H01L2224/131 , H01L2224/32145 , H01L2224/73267 , H01L2224/97 , H01L2225/06524 , H01L2225/06527 , H01L2225/06558 , H01L2225/1035 , H01L2225/1064 , H01L2924/01029 , H01L2924/07802 , H01L2924/3511 , H01L2224/19 , H01L2224/83 , H01L2924/00 , H01L2924/014
摘要： A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. The first and second terminals are formed by using electrodes of the first and second layer portions. The layered chip package is manufactured by fabricating a layered substructure by stacking two substructures each of which includes an array of a plurality of preliminary layer portions, and then cutting the layered substructure. The layered substructure includes a plurality of preliminary wires that are disposed between two adjacent pre-separation main bodies and are to become the plurality of wires.
摘要翻译： 分层芯片封装包括主体和布线，其包括布置在主体的侧表面上的多根导线。 主体包括：主要部分，包括第一和第二层部分; 以及多个第一和第二端子，其分别设置在主要部分的顶表面和底表面上，并且电连接到多个导线。 第一和第二端子通过使用第一和第二层部分的电极形成。 层叠芯片封装通过层叠两个子结构（其中包括多个预备层部分的阵列），然后切割层状子结构而制造层状子结构来制造。 分层子结构包括多个初级线，其布置在两个相邻的预分离主体之间并且将成为多根线。
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公开(公告)号：US08426981B2
公开(公告)日：2013-04-23
申请号：US13240048
申请日：2011-09-22
申请人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
发明人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
CPC分类号： H01L24/96 , H01L21/6835 , H01L24/06 , H01L24/24 , H01L24/94 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/03011 , H01L2224/0346 , H01L2224/03618 , H01L2224/0401 , H01L2224/05147 , H01L2224/05644 , H01L2224/24145 , H01L2224/32145 , H01L2224/83005 , H01L2224/94 , H01L2225/06551 , H01L2225/06558 , H01L2225/06565 , H01L2225/1064 , H01L2924/07802 , H01L2224/03 , H01L2224/83 , H01L2924/00 , H01L2924/0105
摘要： A composite layered chip package includes first and second subpackages that are stacked. Each subpackage includes a main body and wiring. The main body includes: a main part having a top surface and a bottom surface; first terminals disposed on the top surface of the main part; and second terminals disposed on the bottom surface of the main part. The first and second terminals are electrically connected to the wiring. The first and second subpackages are arranged in a specific relative positional relationship, different from a reference relative positional relationship, with each other.
摘要翻译： 复合分层芯片封装包括堆叠的第一和第二子封装。 每个子包包括主体和接线。 主体包括：具有顶表面和底表面的主要部分; 第一端子设置在主要部件的顶表面上; 以及设置在主要部分的底表面上的第二端子。 第一端子和第二端子电连接到布线。 第一子包和第二子包以不同于参考相对位置关系的特定相对位置关系彼此排列。
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75.发明授权公开(公告)号：US08406089B2
公开(公告)日：2013-03-26
申请号：US12585150
申请日：2009-09-04
IPC分类号： G11B11/00
CPC分类号： G11B5/314 , G11B5/105 , G11B5/6088 , G11B2005/001 , G11B2005/0021 , H01S5/0224 , H01S5/02272 , H01S5/0228 , H01S5/02292
摘要： A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror provided outside the slider. The slider includes a magnetic pole, a waveguide, and a near-field light generating element. The laser diode includes: an emitting end face that lies at an end in a direction parallel to the plane of an active layer and includes a laser-light emission part; and a mounting surface that lies at an end in a direction perpendicular to the plane of the active layer and faces the slider. The external mirror includes: a first reference surface that is parallel to the emitting end face and faces the emitting end face; a second reference surface that is parallel to the mounting surface and faces toward the same direction as the mounting surface does; and a reflecting surface that connects the first and second reference surfaces to each other and reflects the laser light emitted from the emission part toward the waveguide.
摘要翻译： 热辅助磁记录头包括滑块，固定到滑块的边缘发射激光二极管和设置在滑块外部的外反射镜。 滑块包括磁极，波导和近场光产生元件。 激光二极管包括：发射端面，其位于与有源层的平面平行的方向上的端部，并且包括激光发射部分; 以及安装表面，其位于垂直于有源层的平面的方向上的端部并且面向滑块。 外部反射镜包括：平行于发射端面并面对发射端面的第一参考表面; 第二参考表面，其平行于安装表面并面向与安装表面相同的方向; 以及将第一和第二参考表面彼此连接并将从发射部分发射的激光反射到波导的反射表面。
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公开(公告)号：US08400884B1
公开(公告)日：2013-03-19
申请号：US13353981
申请日：2012-01-19
申请人： Hironori Araki , Yoshitaka Sasaki , Hiroyuki Ito , Kazuki Sato , Shigeki Tanemura , Yukinori Ikegawa
发明人： Hironori Araki , Yoshitaka Sasaki , Hiroyuki Ito , Kazuki Sato , Shigeki Tanemura , Yukinori Ikegawa
CPC分类号： G11B5/3163 , B82Y20/00 , G02B6/1226 , G11B5/314 , G11B5/6088 , G11B2005/0021
摘要： A method of manufacturing a plasmon generator includes the steps of forming an accommodation part and forming the plasmon generator to be accommodated in the accommodation part. The step of forming the accommodation part includes the steps of: forming a dielectric layer having an upper surface; etching the dielectric layer by using an etching mask and thereby forming a groove in the dielectric layer; and forming a dielectric film in the groove. The groove has first and second sidewalls and a bottom. Each of the first and second sidewalls forms an angle in the range of 0° to 15° relative to the direction perpendicular to the upper surface of the dielectric layer. The dielectric film includes a first portion interposed between the first sidewall and the first side surface, and a second portion interposed between the second sidewall and the second side surface.
摘要翻译： 制造等离子体发生器的方法包括以下步骤：形成容纳部分并形成容纳在容纳部分中的等离子体发生器。 形成容纳部的步骤包括以下步骤：形成具有上表面的电介质层; 通过使用蚀刻掩模蚀刻介电层，从而在电介质层中形成凹槽; 以及在所述槽中形成电介质膜。 凹槽具有第一和第二侧壁和底部。 第一和第二侧壁中的每一个相对于与电介质层的上表面垂直的方向形成0°至15°的范围内的角度。 介电膜包括介于第一侧壁和第一侧表面之间的第一部分和介于第二侧壁和第二侧表面之间的第二部分。
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77.发明授权公开(公告)号：US08395971B2
公开(公告)日：2013-03-12
申请号：US12458546
申请日：2009-07-15
IPC分类号： G11B11/00
CPC分类号： G11B5/314 , G11B5/4866 , G11B2005/001 , G11B2005/0021
摘要： A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror provided outside the slider. The slider includes a magnetic pole, a waveguide, a near-field light generating element, and a substrate. The substrate has a top surface facing toward the magnetic pole, the near-field light generating element and the waveguide. The slider has a top surface that lies above the top surface of the substrate, at an end of the slider farther from the top surface of the substrate. The laser diode includes: an active layer; an emitting end face that lies at an end in a direction parallel to the plane of the active layer and includes an emission part for emitting laser light; and a bottom surface that lies at an end in a direction perpendicular to the plane of the active layer. The laser diode is arranged so that the bottom surface faces the top surface of the slider. The external mirror reflects the laser light emitted from the emission part toward the waveguide.
摘要翻译： 热辅助磁记录头包括滑块，固定到滑块的边缘发射激光二极管和设置在滑块外部的外反射镜。 滑块包括磁极，波导，近场光产生元件和基板。 基板具有面向磁极的顶表面，近场光产生元件和波导。 滑块具有位于基板顶表面上方的顶表面，在滑块的距基板顶表面更远的一端。 激光二极管包括：有源层; 位于与有源层的平面平行的方向上的端部的发射端面，并且包括用于发射激光的发射部分; 以及位于与有源层的平面垂直的方向上的端部的底表面。 激光二极管被布置成使得底表面面向滑块的顶表面。 外部反射镜将从发射部分发射的激光朝向波导反射。
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78.发明申请公开(公告)号：US20130057987A1
公开(公告)日：2013-03-07
申请号：US13224954
申请日：2011-09-02
CPC分类号： G11B5/1278 , G11B5/3106 , G11B5/3116 , G11B5/3136 , G11B5/607 , Y10T29/49032 , Y10T428/1186
摘要： A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head has a leading shield part opposing the main magnetic pole layer on the substrate side of the main magnetic pole layer. The thin-film magnetic head has a substrate side coil layer disposed between the main magnetic pole layer and the substrate. In the thin-film magnetic head, a space between a lower end face of the leading shield part and the substrate and a space between an upper end face in the substrate side coil layer and the substrate are formed equal to each other.
摘要翻译： 薄膜磁头被构造为使得主磁极层，写入屏蔽层，间隙层和薄膜线圈层叠在基板上。 薄膜磁头具有与主磁极层的基板侧的主磁极层相对的主屏蔽部。 薄膜磁头具有设置在主磁极层和基板之间的基板侧线圈层。 在薄膜磁头中，形成前导屏蔽部的下端面与基板之间的空间与基板侧线圈层的上端面与基板之间的空间。
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79.发明授权公开(公告)号：US08366948B2
公开(公告)日：2013-02-05
申请号：US12714998
申请日：2010-03-01
CPC分类号： G11B5/314 , B24B37/048 , G11B5/3163 , G11B2005/0021
摘要： A near-field light generating element has an outer surface including first and second inclined surfaces and an edge part that connects the first and second inclined surfaces to each other. In a method of manufacturing the near-field light generating element, a polishing stopper layer is initially formed on a metal layer, and the polishing stopper layer and the metal layer are etched so that the metal layer is provided with the first inclined surface. Next, a coating layer is formed to cover the metal layer and the polishing stopper layer. The coating layer is made of a non-metallic inorganic material that has an etching rate lower than that of the metal layer in a second etching step to be performed later. Next, the coating layer is polished until the polishing stopper layer is exposed. Next, the second etching step is performed to etch the polishing stopper layer and the metal layer using the coating layer as the etching mask. This provides the metal layer with the second inclined surface and the edge part, and thereby makes the metal layer into the near-field light generating element.
摘要翻译： 近场光产生元件具有包括第一和第二倾斜表面的外表面和将第一和第二倾斜表面彼此连接的边缘部分。 在制造近场光产生元件的方法中，最初在金属层上形成抛光阻挡层，并且蚀刻抛光阻挡层和金属层，使得金属层设置有第一倾斜表面。 接下来，形成涂覆层以覆盖金属层和抛光阻挡层。 在稍后执行的第二蚀刻步骤中，涂层由非金属无机材料制成，其蚀刻速率低于金属层的蚀刻速率。 接下来，抛光涂层直到抛光停止层露出。 接下来，进行第二蚀刻步骤，使用涂层作为蚀刻掩模来蚀刻抛光停止层和金属层。 由此，使金属层具有第二倾斜面和边缘部，由此使金属层成为近场光产生元件。
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公开(公告)号：US08358015B2
公开(公告)日：2013-01-22
申请号：US13156941
申请日：2011-06-09
CPC分类号： H01L23/5389 , H01L21/561 , H01L21/6835 , H01L22/22 , H01L23/3114 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/95 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0235 , H01L2224/02371 , H01L2224/02373 , H01L2224/02379 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/0346 , H01L2224/0401 , H01L2224/04026 , H01L2224/05008 , H01L2224/05013 , H01L2224/05147 , H01L2224/05644 , H01L2224/1146 , H01L2224/13024 , H01L2224/13144 , H01L2224/16148 , H01L2224/24011 , H01L2224/2405 , H01L2224/24146 , H01L2224/245 , H01L2224/2512 , H01L2224/25171 , H01L2224/25175 , H01L2224/25177 , H01L2224/2746 , H01L2224/29024 , H01L2224/29144 , H01L2224/32145 , H01L2224/32148 , H01L2224/75101 , H01L2224/8112 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/82101 , H01L2224/82106 , H01L2224/83005 , H01L2224/8313 , H01L2224/83191 , H01L2224/83203 , H01L2224/83815 , H01L2224/8385 , H01L2224/83986 , H01L2224/92 , H01L2224/92244 , H01L2224/94 , H01L2224/95 , H01L2225/06541 , H01L2225/06551 , H01L2225/06558 , H01L2225/06565 , H01L2225/1058 , H01L2924/07802 , H01L2924/0105 , H01L2224/82 , H01L2924/00014 , H01L2224/83 , H01L2224/11 , H01L2224/27 , H01L2224/0231 , H01L21/78 , H01L2224/81 , H01L2924/00
摘要： A layered chip package includes a main body and wiring. The main body includes: a main part having a top surface and a bottom surface and including three or more layer portions stacked on one another; a plurality of first terminals disposed on the top surface of the main part; and a plurality of second terminals disposed on the bottom surface of the main part. Each layer portion includes a semiconductor chip having first and second surfaces, and a plurality of electrodes electrically connected to the wiring. The plurality of electrodes are disposed on a side of the first surface of the semiconductor chip. A first layer portion located closest to the top surface of the main part and a second layer portion located closest to the bottom surface of the main part are arranged so that the second surfaces of their respective semiconductor chips face toward each other. The plurality of first terminals are formed by using the plurality of electrodes of the first layer portion. The plurality of second terminals are formed by using the plurality of electrodes of the second layer portion.
摘要翻译： 分层芯片封装包括主体和布线。 主体包括：具有顶表面和底表面并且包括彼此堆叠的三个或更多个层部分的主要部分; 多个第一端子，设置在所述主要部件的顶表面上; 以及设置在主要部分的底表面上的多个第二端子。 每个层部分包括具有第一和第二表面的半导体芯片和电连接到布线的多个电极。 多个电极设置在半导体芯片的第一表面的一侧。 位于最靠近主要部分的顶表面的第一层部分和最靠近主要部分的底表面的第二层部分被布置成使得它们各自的半导体芯片的第二表面朝向彼此。 多个第一端子通过使用第一层部分的多个电极形成。 多个第二端子通过使用第二层部分的多个电极形成。
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