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公开(公告)号：US20090109628A1
公开(公告)日：2009-04-30
申请号：US11928165
申请日：2007-10-30
IPC分类号： H01L23/367 , F28F7/00
CPC分类号： H01L23/367 , F28F13/00 , H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： Integrated circuit chip cooling methods and systems are disclosed. A method for cooling an integrated circuit chip may comprise: providing a cooling mechanism; positioning an interface medium between the cooling mechanism and the integrated circuit chip; and interfacing the cooling mechanism and the integrated circuit chip through the interface medium; wherein at least one of the cooling mechanism, the integrated circuit chip, or the interface medium includes a convex portion on an interface surface thereof.
摘要翻译： 公开了集成电路芯片的冷却方法和系统。 用于冷却集成电路芯片的方法可以包括：提供冷却机构; 在冷却机构和集成电路芯片之间定位界面介质; 并通过接口介质与冷却机构和集成电路芯片接口; 其中所述冷却机构，所述集成电路芯片或所述界面介质中的至少一个在其界面表面上包括凸部。
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公开(公告)号：US20070227173A1
公开(公告)日：2007-10-04
申请号：US11308504
申请日：2006-03-30
CPC分类号： H01L23/4735 , F28F3/12 , F28F13/02 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.
摘要翻译： 一种用于热控制的分配设备，系统和方法，其中歧管组件的板具有定位在其表面上的特定位置上的预定表面特征，以增强组件的冷却能力。 板的预定表面特征延迟了撞击板表面的流体的速度衰减，同时还增加了暴露于冲击液体的板的表面积，这进而使整体的可靠性和热性能最大化 热系统在给定的最大工作压力。
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73.发明授权Discrete magnets in dielectric forming metal/ceramic laminate and process thereof 失效电介质成形金属/陶瓷层压板中的离散磁体及其工艺公开(公告)号：US06974358B2
公开(公告)日：2005-12-13
申请号：US10462275
申请日：2003-06-16
CPC分类号： H01J29/68
摘要： The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.
摘要翻译： 本发明一般涉及一种新的电介质形成金属/陶瓷层叠磁体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积层压磁体，用于电子和电子束控制的集成电介质形成金属板和电极的新方法。 本发明还涉及磁矩阵显示器和电子束源及其制造方法。
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公开(公告)号：US06955777B2
公开(公告)日：2005-10-18
申请号：US10338093
申请日：2003-01-07
申请人： Govindarajan Natarajan , Umar Ahmad , Raschid J. Bezama , James N. Humenik , John U. Knickerbocker , Rao V. Vallabhaneni
发明人： Govindarajan Natarajan , Umar Ahmad , Raschid J. Bezama , James N. Humenik , John U. Knickerbocker , Rao V. Vallabhaneni
CPC分类号： B32B18/00 , B01J2219/00286 , B01J2219/00317 , B01L3/502707 , B01L3/5085 , B01L2200/12 , B01L2300/0816 , B01L2300/0819 , B01L2300/0887 , B01L2300/12 , B81B2203/0338 , B81B2203/0353 , B81C1/00119 , C04B35/645 , C04B2235/6567 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/62 , C04B2237/704
摘要： A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.
摘要翻译： 在制药工业中用于混合和测试材料的板材是通过一种方法形成的，其中通过材料去除工艺形成一组绿叶片中的孔，至少一些孔被填充有在烧结过程中逸出的逃逸材料 。
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公开(公告)号：US20050214508A1
公开(公告)日：2005-09-29
申请号：US11137957
申请日：2005-05-26
CPC分类号： H01L21/481 , H01L21/486 , H05K1/0306 , H05K3/005 , H05K2201/2018 , H05K2203/0156 , Y10T83/0481 , Y10T156/1056 , Y10T156/1057 , Y10T156/1062 , Y10T428/24273 , Y10T428/24322 , Y10T428/24331 , Y10T428/24339 , Y10T428/24347
摘要： Methods for forming and the intermediate greensheet products formed are provided by attaching a removable support film to a first surface of a greensheet and a frame to a second surface of the greensheet. The support film is preferably a peelable support film cast to the first surface of the greensheet for providing strength thereto. A plurality of openings are formed in the greensheet by punching into the support film, through the support film and then through the greensheet. During this process, the support film provides added strength to the greensheet therein significantly reducing embossing and deformation of such greensheet. A second support film may be attached to the removable support film using an adhesive layer, which, is extruded into the openings upon attachment. The support film(s) may be peeled off the greensheet with little or no impact on via locations as a metal frame continues to support the greensheet.
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公开(公告)号：US06790515B2
公开(公告)日：2004-09-14
申请号：US10411906
申请日：2003-04-11
IPC分类号： B32B300
CPC分类号： B32B18/00 , B32B37/22 , B32B38/04 , B32B2038/042 , B32B2305/38 , B32B2305/77 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/38 , C04B2237/50 , C04B2237/56 , C04B2237/561 , C04B2237/567 , C04B2237/62 , C04B2237/66 , C04B2237/68 , C04B2237/702 , C04B2237/704 , H01L21/4857 , H05K1/0306 , H05K3/00 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2203/0169 , Y10T156/1052 , Y10T156/1057 , Y10T156/108 , Y10T428/161 , Y10T428/23 , Y10T428/24793 , Y10T428/24926
摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that the frame and greensheet side are substantially coplanar.
摘要翻译： 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其它方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并且被压入毛坯一侧，使得框架和毛坯面基本上共面。
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公开(公告)号：US06607780B1
公开(公告)日：2003-08-19
申请号：US09578580
申请日：2000-05-25
IPC分类号： B05D512
CPC分类号： H01L21/486 , H05K1/0306 , H05K3/4061 , H05K3/4614 , H05K3/4629 , H05K2201/09581 , H05K2203/0152 , H05K2203/0156 , Y10T29/49126 , Y10T156/1057 , Y10T428/24917 , Y10T428/24926
摘要： The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.
摘要翻译： 本发明一般涉及一种新的陶瓷结构及其工艺。 基本上，本发明涉及一种用于形成层压结构的结构和方法，更具体地涉及一种使用非常薄的生坯片和/或具有非常致密导电图案的生片在多层陶瓷产品的顶部制造多层陶瓷产品的结构和方法 更强的支撑板。 本发明的结构和方法能够在制造多层陶瓷封装中筛选，堆叠和处理具有非常密集金属化图案的非常薄的生片和/或生片。 薄的生片被粘合到较厚和更坚固的支撑片上以形成在筛选中具有优异稳定性并能够进一步加工的亚结构。 这些片材以这样的方式锚定或固定，以便随后可以容易地移除支撑片材来处理生片。
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78.发明授权Apparatus and insertless method for forming cavity substrates using coated membrane 失效使用涂覆膜形成腔体衬底的装置和无插入方法公开(公告)号：US06423174B1
公开(公告)日：2002-07-23
申请号：US08668291
申请日：1996-06-21
IPC分类号： B32B3120
CPC分类号： B32B18/00 , B32B37/0023 , B32B2038/042 , B32B2309/12 , B32B2315/02 , C04B35/10 , C04B35/581 , C04B35/6455 , C04B2235/658 , C04B2237/343 , C04B2237/366 , C04B2237/62 , C04B2237/64 , H01L21/4807
摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a coated membrane sheet is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the coated membrane is conveniently removed without causing damage to the cavity shelves or paste pull-outs.
摘要翻译： 本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。 更具体地，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将涂覆的膜片放置在空腔上方并使其符合空腔的轮廓，从而防止凹陷或损坏， 层压过程中的腔架。 在层压处理之后，方便地去除涂覆的膜，而不会损坏腔架或糊状物拉出。
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公开(公告)号：US06413339B1
公开(公告)日：2002-07-02
申请号：US09470457
申请日：1999-12-22
申请人： Govindarajan Natarajan , Jon A. Casey , Martin E. Klepeis , John U. Knickerbocker , Srinivasa S. N. Reddy , Robert A. Rita , Subhash L. Shinde
发明人： Govindarajan Natarajan , Jon A. Casey , Martin E. Klepeis , John U. Knickerbocker , Srinivasa S. N. Reddy , Robert A. Rita , Subhash L. Shinde
IPC分类号： B32B3116
CPC分类号： C04B35/2683 , C04B35/64 , H01F1/0027 , H01F41/0253 , Y10T156/1056 , Y10T156/1057
摘要： The present invention relates generally to a new metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.
摘要翻译： 本发明一般涉及具有通孔的新的金属/磁陶瓷层压体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积陶瓷层压体磁体的新方法，用于电子和电子束控制的集成金属板和共烧结电极。 本发明还涉及磁矩阵显示器（MMD）和电子束源，及其制造方法。
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公开(公告)号：US06406778B1
公开(公告)日：2002-06-18
申请号：US09621796
申请日：2000-07-21
IPC分类号： B32B1706
CPC分类号： B32B18/00 , C04B2235/785 , C04B2237/341 , C04B2237/343 , C04B2237/366 , H01L21/4857 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K3/4664 , Y10S428/901 , Y10T428/24917 , Y10T428/24926 , Y10T428/2495 , H01L2924/00
摘要： The present invention relates generally to using at least one green sheet that is originally very thin with the help of at least one thicker green sheet. An adhesion barrier to build multi-layer ceramic laminates and process thereof is also disclosed. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-density, multi-layer ceramic products using at least one very thin green sheet and/or at least one green sheet with very dense electrically conductive patterns on top of at least one thicker green sheet.
摘要翻译： 本发明一般涉及至少使用至少一种较薄的生坯片，该生片最初是非常薄的，借助于至少一个较厚的生片。 还公开了构建多层陶瓷层压体的粘合屏障及其工艺。 基本上，本发明涉及一种用于形成叠层结构的结构和方法，更具体地涉及使用至少一个非常薄的生片和/或至少一个生坯片来制造多密度多层陶瓷产品的结构和方法 在至少一个更厚的生片上方具有非常密集的导电图案。
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