Pattern formation method and method for forming semiconductor device
    71.
    发明授权
    Pattern formation method and method for forming semiconductor device 失效
    用于形成半导体器件的图案形成方法和方法

    公开(公告)号:US07563709B2

    公开(公告)日:2009-07-21

    申请号:US11907018

    申请日:2007-10-09

    IPC分类号: H01L21/4763

    摘要: A pattern formation method includes the steps of forming a flowable film made of a material with flowability; forming at least one of a concave portion and a convex portion provided on a pressing face of a pressing member onto the flowable film by pressing the pressing member against the flowable film; forming a solidified film by solidifying the flowable film, onto which the at least one of a concave portion and a convex portion has been transferred, through annealing at a first temperature with the pressing member pressed against the flowable film; and forming a pattern made of the solidified film burnt by annealing at a second temperature higher than the first temperature.

    摘要翻译: 图案形成方法包括形成由具有流动性的材料制成的可流动膜的步骤; 通过将所述按压构件压靠在所述可流动膜上,将设置在所述挤压构件的按压面上的凹部和凸部中的至少一个形成在所述可流动膜上; 通过使按压部件压靠在所述可流动膜上的第一温度退火,使其中已经转移了所述至少一个凹部和凸部的所述可流动膜固化而形成固化膜; 以及在高于第一温度的第二温度下通过退火而形成由固化膜制成的图案。

    Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
    74.
    发明申请
    Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device 审中-公开
    用于形成多孔膜的组合物,多孔膜及其形成方法,层间绝缘膜和半导体器件

    公开(公告)号:US20080118737A1

    公开(公告)日:2008-05-22

    申请号:US11999076

    申请日:2007-12-04

    IPC分类号: B32B5/18 B05D5/00 C08J9/22

    摘要: The present invention provides a composition for film formation which can form a porous film that excels in dielectric properties, adhesion, film consistency and mechanical strength, and that is easily thinned; a porous film and a method for forming the same, and a high-performing and highly reliable semiconductor device which contains the porous film inside. More specifically, the composition for forming a porous film comprises a solution containing an amorphous polymer which is obtained by hydrolyzing and condensing at least one silane compound expressed by the general formula (R1)nSi(OR2)4-n, and a zeolite sol which is formed by using a quaternary ammonium hydroxide. The method for forming a porous film comprises a coating step for coating the composition for forming a porous film; a subsequent drying step; and a porousness forming step.

    摘要翻译: 本发明提供一种成膜用组合物,其可以形成介电性,粘合性,膜一致性和机械强度优异的多孔膜,容易变薄; 多孔膜及其形成方法,以及内部含有多孔膜的高性能和高可靠性的半导体器件。 更具体地,用于形成多孔膜的组合物包括含有无定形聚合物的溶液,其通过水解和缩合由通式(R 1)2表示的至少一种硅烷化合物而获得, (OR 2)4-n N,以及通过使用氢氧化季铵形成的沸石溶胶。 形成多孔膜的方法包括用于涂覆用于形成多孔膜的组合物的涂布步骤; 随后的干燥步骤; 和多孔性形成步骤。

    Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
    75.
    发明授权
    Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device 有权
    用于形成多孔膜的组合物,多孔膜及其形成方法,层间绝缘膜和半导体器件

    公开(公告)号:US07341775B2

    公开(公告)日:2008-03-11

    申请号:US10706861

    申请日:2003-11-12

    IPC分类号: H01L23/48

    摘要: Provided are a composition for forming film which can form a porous film excelling in dielectric constant, adhesiveness, uniformity of the film, mechanical strength and having low hygroscopicity; a porous film and a method for forming the film; and a high-performing and highly reliable semiconductor device comprising the porous film inside. More specifically, provided is a composition for forming porous film, comprising a surfactant and a solution comprising polymer obtainable by hydrolyzing and condensing, in the presence of the surfactant, one or more of alkoxysilane represented by Formula (1) and one or more of alkoxysilane represented by Formula (2): (R1)mSi(OR2)4-m  (1) R3Si(R4)n(OR5)3-n  (2) Also provided is a method for forming porous film comprising a step of applying said composition on a substrate to form film and a step of transforming the film into porous film.

    摘要翻译: 提供一种可形成介电常数,粘合性,膜均匀性,机械强度和吸湿性低的多孔膜的成膜用组合物。 多孔膜和形成膜的方法; 以及内部具有多孔膜的高性能,高可靠性的半导体装置。 更具体地,提供了一种用于形成多孔膜的组合物,其包含表面活性剂和包含可通过在表面活性剂存在下水解和缩合获得的聚合物的溶液,所述聚合物可由一种或多种由式(1)表示的烷氧基硅烷和一种或多种烷氧基硅烷 由式(2)表示:<?in-line-formula description =“In-line Formulas”end =“lead”?>(R&lt; 1&gt;)&lt; (1)<?in-line-formula description =“In-line Formulas”end =“tail”?> <?in-line -formulae description =“In-line Formulas”end =“lead”?> R <3> Si(R 4) 3-n(2)<?in-line-formula description =“In-line Formulas”end =“tail”?>还提供了形成多孔的方法 薄膜,其包括在基材上涂布所述组合物以形成薄膜的步骤和将薄膜转变成多孔薄膜的步骤。

    Semiconductor Device and Method for Fabricating the Same
    76.
    发明申请
    Semiconductor Device and Method for Fabricating the Same 有权
    半导体器件及其制造方法

    公开(公告)号:US20080054464A1

    公开(公告)日:2008-03-06

    申请号:US11630799

    申请日:2005-05-20

    IPC分类号: H01L23/48 H01L21/44

    摘要: In a semiconductor device including: an insulating film (6) formed over a substrate (1); a buried metal interconnect (10) formed in the insulating film (6); and a barrier metal film (A1) formed between the insulating film (6) and the metal interconnect (10), the barrier metal film (A1) includes a metal oxide film (7), a metal compound film (8) and a metal film (9) stacked in this order from a side in which the insulating film (6) exists to a side in which the metal interconnect (10) exists. Elastic modulus of the metal compound film (8) is larger than that of the metal oxide film (7).

    摘要翻译: 一种半导体器件,包括:形成在衬底(1)上的绝缘膜(6); 形成在所述绝缘膜(6)中的掩埋金属互连(10); 和形成在绝缘膜(6)和金属互连件(10)之间的阻挡金属膜(A 1),阻挡金属膜(A 1)包括金属氧化物膜(7),金属化合物膜(8)和 从绝缘膜(6)存在的一侧到存在金属互连(10)的一侧依次堆叠的金属膜(9)。 金属化合物膜(8)的弹性模量大于金属氧化物膜(7)的弹性模量。

    Method for fabricating semiconductor device
    77.
    发明授权
    Method for fabricating semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07273820B2

    公开(公告)日:2007-09-25

    申请号:US10399755

    申请日:2001-10-09

    IPC分类号: H01L21/469

    CPC分类号: H01L21/76819 H01L21/31051

    摘要: After a fluid film is formed by supplying a material with fluidity to the surface of a substrate formed with a stepped layer, the fluid film is pressed against the substrate by a pressing member having a planar pressing surface so that the surface of the fluid film is planarized. The fluid film is heated in this state and thereby solidified to form a solidified film having a planar surface.

    摘要翻译: 在通过向形成有阶梯层的基板的表面供给流动性的材料形成流体膜之后,通过具有平面的按压面的按压部件将流体膜压在基板上,使得流体膜的表面为 平面化 在该状态下加热流体膜,由此固化,形成具有平坦表面的固化膜。

    Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
    80.
    发明申请
    Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device 失效
    沸石溶胶及其制备方法,用于形成多孔膜的组合物,多孔膜及其形成方法,层间绝缘膜和半导体器件

    公开(公告)号:US20070108593A1

    公开(公告)日:2007-05-17

    申请号:US11652297

    申请日:2007-01-11

    IPC分类号: C23C16/00 C07C5/25 H01L23/12

    摘要: The present invention provides a zeolite sol which can be formed into a porous film that can be thinned to an intended thickness by a method used in the ordinary semiconductor process, that excels in dielectric properties, adhesion, film consistency and mechanical strength, and that can be easily thinned; a composition for film formation; a porous film and a method for forming the same; and a high-performing and highly reliable semiconductor device which contains this porous film inside. More specifically, the zeolite sol is prepared by hydrolyzing and decomposing a silane compound expressed by a general formula: Si(OR1)4 (wherein R1 represents a straight-chain or branched alkyl group having 1 to 4 carbons, and when there is more than one R1, the R1s can be independent and the same as or different from each other) in a conventional coating solution for forming a porous film in the presence of a structure-directing agent and a basic catalyst; and then by heating the silane compound at a temperature of 75° C. or lower. A composition for forming a porous film which contains this zeolite sol is used.

    摘要翻译: 本发明提供一种沸石溶胶,其可以通过通常的半导体工艺中使用的方法来形成多孔膜,该多孔膜可以被薄化到预期的厚度,其具有优异的介电性能,粘附性,膜稠度和机械强度,并且可以 容易变薄; 用于成膜的组合物; 多孔膜及其形成方法; 以及内部含有该多孔膜的高性能,高可靠性的半导体装置。 更具体地说,通过水解和分解由以下通式表示的硅烷化合物制备沸石溶胶:Si(OR 1)4(其中R 1, SUP>表示具有1至4个碳的直链或支链烷基,当存在多于一个R 1时,R 1可以是独立的,并且 在结构导向剂和碱性催化剂的存在下在用于形成多孔膜的常规涂布溶液中相同或不同) 然后在75℃以下的温度下加热硅烷化合物。 使用含有该沸石溶胶的多孔膜形成用组合物。