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    Thermoelectric cooling for microelectronic packages and dice
    72.
    发明授权
    Thermoelectric cooling for microelectronic packages and dice 失效
    微电子封装和裸片的热电冷却

    公开(公告)号：US06981380B2

    公开(公告)日：2006-01-03

    申请号：US10326864

    申请日：2002-12-20

    申请人： Gregory M. Chrysler ,  Paul A. Koning ,  Saikumar Jayaraman ,  Makarem A. Hussein

    发明人： Gregory M. Chrysler ,  Paul A. Koning ,  Saikumar Jayaraman ,  Makarem A. Hussein

    IPC分类号： F35B21/02

    CPC分类号： F25B21/02 ,  H01L23/38 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/0401

    摘要： Apparatus and methods in accordance with the present invention utilize thermoelectric cooling (TEC) technology to provide enhanced power distribution and/or dissipation from a microelectronic die and/or microelectronic packages. Individual TEC devices are thermally interconnected with the microelectronic die in a number of placement configurations, including between the microelectronic die and the heat sink, on the integrated heat spreader (IHS) inner surface, and on the IHS outer surface. TEC devices comprise p- and n-type semiconducting material created using similar process as the microcircuits. The TEC devices are located in various regions within or on the microelectronic die, including directly below the microcircuits, on the backside of the microelectronic die, and on a separate substrate of microelectronic die material fabricated apart from the microelectronic die and subsequently thermally coupled to the backside of the microelectronic die.

    摘要翻译： 根据本发明的装置和方法利用热电冷却（TEC）技术来提供来自微电子管芯和/或微电子封装的增强的功率分配和/或耗散。 单个TEC装置与集成散热器（IHS）内表面和IHS外表面上的多个放置配置（包括微电子管芯和散热器之间）与微电子管芯热互连。 TEC器件包括使用与微电路类似的工艺制造的p型和n型半导体材料。 TEC器件位于微电子管芯内或微电子管芯上的多个区域中，包括微电路正下方，微电子管芯的背面，以及与微电子管芯分开制造的微电子管芯材料的分离衬底，随后热耦合到 微电子模具的背面。

    Microelectronic packaging and methods for thermally protecting package interconnects and components
    73.
    发明申请
    Microelectronic packaging and methods for thermally protecting package interconnects and components 审中-公开
    微电子封装和热保护封装互连和部件的方法

    公开(公告)号：US20050214977A1

    公开(公告)日：2005-09-29

    申请号：US11135776

    申请日：2005-05-23

    申请人： Christopher Rumer ,  Saikumar Jayaraman

    发明人： Christopher Rumer ,  Saikumar Jayaraman

    IPC分类号： H01L23/498 ,  H05K3/28 ,  H05K3/34 ,  H01L21/58 ,  H01L21/60

    CPC分类号： H01L23/49811 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/15312 ,  H05K3/284 ,  H05K3/3426 ,  H01L2924/00 ,  H01L2224/29099

    摘要： Apparatus and methods are provided wherein the reflowable electrically conductive interconnect material coupling the interconnects and/or land-side components of a microelectronic package is protected from elevated temperatures, such as those associated with reflow processes and environments which exceed the melting temperature of the interconnect material. One embodiment of the method provides covering the interconnect material about the interconnects and/or land-side components with heat-resistant curable material which protects the interconnect material from the elevated temperature and provides structural support to the interconnects and/or land-side components at the elevated temperature. One embodiment of the apparatus provides a substrate comprising interconnects and/or land-side components coupled to a carrier substrate with reflowable electrically conductive interconnect material, and a layer of heat-resistant curable material covering the interconnect material and forming fillets about the interconnects and/or land-side components.

    摘要翻译： 提供了装置和方法，其中耦合微电子封装的互连和/或陆侧组件的可回流导电互连材料被保护免受诸如与回流工艺和超过互连材料的熔化温度的环境相关的高温 。 该方法的一个实施例提供了用耐热可固化材料围绕互连和/或陆侧部件覆盖互连材料，其保护互连材料免受升高的温度，并且在互连和/或陆侧部件处提供结构支撑 升高的温度。 该装置的一个实施例提供了一种基板，其包括连接到具有可回流导电互连材料的载体基板的互连和/或平台侧部件，以及覆盖互连材料的层的耐热可固化材料并且围绕互连和/ 或陆上部件。