公开(公告)号：US07368324B2

公开(公告)日：2008-05-06

申请号：US10547174

申请日：2004-01-15

申请人： Karl Weidner ,  Eckhard Wolfgang ,  Jörg Zapf

发明人： Karl Weidner ,  Eckhard Wolfgang ,  Jörg Zapf

IPC分类号： H01L21/00

CPC分类号： H01L23/4822 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/82001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

摘要： A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently removing these layers from said support.

摘要翻译： 通过将由非导电材料制成的层和由导电材料制成的层施加到组件和支撑件上并随后从其中除去这些层而直接在不具有外壳的部件上产生自支撑接触结构 说支持。

公开(公告)号：US20080013249A1

公开(公告)日：2008-01-17

申请号：US11457318

申请日：2006-07-13

申请人： Henrik Ewe ,  Karl Weidner

发明人： Henrik Ewe ,  Karl Weidner

IPC分类号： H01G4/008

CPC分类号： H01L23/49548 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/3185 ,  H01L23/49517 ,  H01L23/49562 ,  H01L24/24 ,  H01L24/33 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/82039 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/8382 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for producing a dielectric layer extending between two or more elements of an electronic component includes arranging a free-standing dielectric layer above the elements and a deformable support layer below the elements. The free-standing dielectric layer is laminated onto at least a portion of the first surface of the first element and onto at least a portion of the first surface of the second element such that a portion of the dielectric layer extends between the first surface of the first element and the first surface of the second element.

摘要翻译： 用于制造在电子部件的两个或更多个元件之间延伸的电介质层的方法包括在元件上方设置独立的电介质层和在元件下面形成可变形的支撑层。 独立电介质层被层压到第一元件的第一表面的至少一部分上并且到达第二元件的第一表面的至少一部分上，使得电介质层的一部分在第一元件的第一表面之间延伸 第一元件和第二元件的第一表面。

公开(公告)号：US20070216025A1

公开(公告)日：2007-09-20

申请号：US11728900

申请日：2007-03-27

申请人： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

IPC分类号： H01L23/485

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

摘要翻译： 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US06685168B1

公开(公告)日：2004-02-03

申请号：US09622139

申请日：2000-12-22

申请人： Alois Stelzl ,  Hans Krüger ,  Karl Weidner ,  Manfred Wossler

发明人： Alois Stelzl ,  Hans Krüger ,  Karl Weidner ,  Manfred Wossler

IPC分类号： H01L2348

CPC分类号： H03H9/1092 ,  H01L2924/0002 ,  H03H9/058 ,  Y10T29/42 ,  H01L2924/00

摘要： An electronic component such as a surface acoustic wave component has a chip a piezoelectric substrate with electrically conductive structures thereon and a base plate having external electrical terminal elements that are contacted to the electrically conductive structures of the chip. A protective film is applied onto the chip surface carrying the electrically conductive structures. The surface of the protective film facing away from the piezoelectric substrate carries electrical contact elements that are connected, to the electrically conductive structures of the chip via through-contacts in the protective film and/or directly via bumps, as well as to the electrical terminal elements of the base plate.

摘要翻译： 诸如表面声波分量的电子部件具有芯片，其上具有导电结构的压电基片和具有与芯片的导电结构接触的外部电端子元件的基板。 将保护膜施加到承载导电结构的芯片表面上。 保护膜的背离压电基板的表面承载电接触元件，其通过保护膜中的通孔接触和/或直接通过凸块连接到芯片的导电结构，以及连接到电端子 基板元件。

公开(公告)号：US06256877B1

公开(公告)日：2001-07-10

申请号：US09209406

申请日：1998-12-10

申请人： Hans-Juergen Hacke ,  Manfred Wossler ,  Karl Weidner ,  Wolfgang Radlik

发明人： Hans-Juergen Hacke ,  Manfred Wossler ,  Karl Weidner ,  Wolfgang Radlik

IPC分类号： H05K330

CPC分类号： H01L23/4985 ,  H01L23/49816 ,  H01L24/50 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/147 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

摘要： The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected with the lower side of the substrate, whereupon the edge regions of the flexible circuit are bent up and around the substrate and the ends of the conductors are electrically contacted to the edge contacts of the substrate.

摘要翻译： 将具有边缘触点的IC衬底转换成球栅阵列是使用柔性电路来实现的，所述柔性电路具有平面地布置在底面上用于接收可熔化焊料凸起的端子，并且其从端子向外引出的导体具有暴露端。 柔性电路的上侧与基板的下侧连接，于是柔性电路的边缘区域向上弯曲并围绕基板，并且导体的端部与基板的边缘触点电接触。