Shaped contact layer for light emitting heterostructure
    76.
    发明授权
    Shaped contact layer for light emitting heterostructure 有权
    用于发光异质结构的成形接触层

    公开(公告)号:US08981417B2

    公开(公告)日:2015-03-17

    申请号:US13048233

    申请日:2011-03-15

    IPC分类号: H01L33/32 H01L33/38 H01S5/042

    CPC分类号: H01L33/38 H01S5/0425

    摘要: An improved light emitting heterostructure and/or device is provided, which includes a contact layer having a contact shape comprising one of: a clover shape with at least a third order axis of symmetry or an H-shape. The use of these shapes can provide one or more improved operating characteristics for the light emitting devices. The contact shapes can be used, for example, with contact layers on nitride-based devices that emit light having a wavelength in at least one of: the blue spectrum or the deep ultraviolet (UV) spectrum.

    摘要翻译: 提供了一种改进的发光异质结构和/或器件,其包括具有接触形状的接触层,接触形状包括具有至少三阶对称轴或H形的三叶形。 使用这些形状可以为发光器件提供一个或多个改进的操作特性。 接触形状可以例如使用发射具有以下蓝色光谱或深紫外(UV)光谱中的至少一个的波长的光的氮化物基器件上的接触层。

    Chromium/Titanium/Aluminum-based semiconductor device contact
    77.
    发明授权
    Chromium/Titanium/Aluminum-based semiconductor device contact 有权
    铬/钛/铝基半导体器件接触

    公开(公告)号:US08766448B2

    公开(公告)日:2014-07-01

    申请号:US12102408

    申请日:2008-04-14

    IPC分类号: H01L23/532

    摘要: A contact to a semiconductor including sequential layers of Cr, Ti, and Al is provided, which can result in a contact with one or more advantages over Ti/Al-based and Cr/Al-based contacts. For example, the contact can: reduce a contact resistance; provide an improved surface morphology; provide a better contact linearity; and/or require a lower annealing temperature, as compared to the prior art Ti/Al-based contacts.

    摘要翻译: 提供了与包括Cr,Ti和Al的连续层的半导体的接触,其可以导致与基于Ti / Al和Cr / Al的触点相关的一个或多个优点的接触。 例如,触点可以:降低接触电阻; 提供改进的表面形态; 提供更好的接触线性; 和/或要求较低的退火温度,与现有技术的Ti / Al基触点相比。

    Device and circuit with improved linearity
    78.
    发明授权
    Device and circuit with improved linearity 有权
    器件和电路具有提高的线性度

    公开(公告)号:US08643430B2

    公开(公告)日:2014-02-04

    申请号:US13311633

    申请日:2011-12-06

    IPC分类号: H03B1/00

    CPC分类号: H03H5/12

    摘要: A solution for compensating intermodulation distortion of a component is provided. A circuit element includes multiple connected components. At least two of the connected components comprise current-voltage characteristics of opposite signs (e.g., sublinear and superlinear current-voltage characteristics) such that the current-voltage characteristics of the circuit element produces a level of intermodulation distortion for the circuit element lower than a level of intermodulation distortion for each of the connected components.

    摘要翻译: 提供了用于补偿组件的互调失真的解决方案。 电路元件包括多个连接的部件。 连接的组件中的至少两个包括具有相反符号的电流 - 电压特性(例如,亚线性和超级线性电流 - 电压特性),使得电路元件的电流 - 电压特性产生电路元件的互调失真水平低于 每个连接组件的互调失真水平。

    Composite contact for semiconductor device
    80.
    发明授权
    Composite contact for semiconductor device 有权
    半导体器件的复合接点

    公开(公告)号:US08461631B2

    公开(公告)日:2013-06-11

    申请号:US11781302

    申请日:2007-07-23

    IPC分类号: H01L21/336

    摘要: A composite contact for a semiconductor device is provided. The composite contact includes a DC conducting electrode that is attached to a semiconductor layer in the device, and a capacitive electrode that is partially over the DC conducting electrode and extends beyond the DC conducting electrode. The composite contact provides a combined resistive-capacitive coupling to the semiconductor layer. As a result, a contact impedance is reduced when the corresponding semiconductor device is operated at high frequencies.

    摘要翻译: 提供了一种用于半导体器件的复合触点。 复合触点包括附接到器件中的半导体层的直流导电电极和部分地在直流导电电极上并延伸超过直流导电电极的电容电极。 复合触点提供与半导体层的组合的电阻 - 电容耦合。 结果,当对应的半导体器件以高频率操作时,接触阻抗减小。