公开(公告)号：US4838313A

公开(公告)日：1989-06-13

申请号：US198405

申请日：1988-05-25

申请人： Kouji Kobayashi ,  Nobuaki Miki ,  Akira Suzuki

发明人： Kouji Kobayashi ,  Nobuaki Miki ,  Akira Suzuki

IPC分类号： G05D16/20

CPC分类号： G05D16/2013 ,  Y10T137/86622

摘要： In a solenoid-operated pressure control valve having a pressure modulating section and a magnetic section, the pressure modulating section includes a valve sleeve having an application port, an output port, a feedback port having throttle passage, and a drain port, and a spool being movable in the valve sleeve; and the magnetic section includes a coil assembly and a rod. According to the above structure a force developed from the magnetic section, a force developed by a spring and an output pressure feedback force are applied and balanced, so that an application pressure is so modulated that the application pressure is taken out as an output pressure corresponding to input electric level to the magnetic section. Furthermore, the spool is made to have at least two lands neighboring on each other and to have different diameters, a feedback port which is directly connected to the area between the different diameters is made on the valve sleeve, and the output pressure is so feedbacked that its volume corresponds to the difference of diameters by applying the pressure from the output port.

摘要翻译： 在具有压力调节部和磁性部的电磁式压力控制阀中，压力调节部包括具有施加口，输出口，具有节流通路的反馈口和排出口的阀套， 可在阀套中移动; 并且磁性部分包括线圈组件和杆。 根据上述结构，从磁性部分产生的力，由弹簧产生的力和输出压力反馈力被施加和平衡，使得施加压力被调节，使得施加压力被取出作为对应的输出压力 以向磁性部分输入电平。 此外，阀芯被制成具有彼此相邻并且具有不同直径的至少两个平台，在阀套上形成直接连接到不同直径之间的区域的反馈端口，并且输出压力被反馈 其体积通过施加来自输出端口的压力而对应于直径差异。

公开(公告)号：US4758782A

公开(公告)日：1988-07-19

申请号：US905922

申请日：1986-09-10

申请人： Kouji Kobayashi

发明人： Kouji Kobayashi

IPC分类号： H05K3/00 ,  G01N21/956 ,  G01R31/28 ,  G01R31/309 ,  G06T1/00 ,  G01R31/02

CPC分类号： G01N21/956 ,  G01N21/95607 ,  G01R31/2806 ,  G01R31/309 ,  G01N2021/95638

摘要： Method and apparatus for inspecting a printed circuit board wherein scanned image data are digitized and analyzed according to a feature extraction method and a mutual comparison method. The result of both of the analysis methods is combined with predetermined conditions to control output devices including a CRT display or a marking device. The two complementary methods compensate each others drawbacks so that the reliability of inspection can be improved.

摘要翻译： 根据特征提取方法和相互比较方法对扫描图像数据进行数字化和分析的印刷电路板的检查方法和装置。 两种分析方法的结果与预定条件相结合，以控制包括CRT显示器或标记装置的输出装置。 这两种互补方法相互补偿的缺点，从而可以提高检查的可靠性。

公开(公告)号：US4594296A

公开(公告)日：1986-06-10

申请号：US562071

申请日：1983-12-16

申请人： Kiyoshi Noguchi ,  Kouji Kobayashi ,  Suguru Takayama

发明人： Kiyoshi Noguchi ,  Kouji Kobayashi ,  Suguru Takayama

IPC分类号： G11B5/706 ,  G11B5/64 ,  G11B5/65 ,  G11B5/66 ,  G11B5/716 ,  G11B5/85

CPC分类号： G11B5/66 ,  G11B5/716 ,  Y10S428/928 ,  Y10T428/12458 ,  Y10T428/12465 ,  Y10T428/12861

摘要： A magnetic recording medium which comprises a magnetic layer formed on a substrate and comprising Co, or Co and one to three elements selected from the group consisting of Ni, Cr and O, wherein, when the magnetic layer is divided equally into four portions in the direction of the thickness of the magnetic layer, the density of the portion located farthest from the substrate is greater by at least 20% than the average density of three other portions.

摘要翻译： 一种磁记录介质，包括形成在基底上的包含Co或Co的磁性层和从由Ni，Cr和O组成的组中选择的一种至三种元素的磁性层，其中当磁性层被均匀地分成四部分时 磁性层的厚度方向，距离基板最远的部分的密度比三个其它部分的平均密度大至少20％。

公开(公告)号：US08558118B2

公开(公告)日：2013-10-15

申请号：US12769953

申请日：2010-04-29

申请人： Motohiro Arifuku ,  Nichiomi Mochizuki ,  Takashi Nakazawa ,  Kouji Kobayashi ,  Tohru Fujinawa ,  Takashi Tatsuzawa

发明人： Motohiro Arifuku ,  Nichiomi Mochizuki ,  Takashi Nakazawa ,  Kouji Kobayashi ,  Tohru Fujinawa ,  Takashi Tatsuzawa

IPC分类号： H05K1/03 ,  H05K1/11

CPC分类号： H05K3/323 ,  C08G18/4213 ,  C08G18/672 ,  C08L75/06 ,  C08L2666/20 ,  C09J175/16 ,  H01R12/52 ,  H05K3/361 ,  Y10T29/49126 ,  C08G18/42

摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.

摘要翻译： 用于连接电路构件的电路连接材料，每个电路构件具有形成在基板的主表面上的基板和电路电极，包括响应于光或热而固化的粘合剂组合物和含有氨基甲酸酯基团和酯的有机化合物 组。

公开(公告)号：US08202622B2

公开(公告)日：2012-06-19

申请号：US12557076

申请日：2009-09-10

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： H01R11/01 ,  H01B1/22 ,  H01L21/60 ,  H05K1/14 ,  H05K3/36 ,  C09J9/02

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

公开(公告)号：US08115322B2

公开(公告)日：2012-02-14

申请号：US12874945

申请日：2010-09-02

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

IPC分类号： C09J9/02 ,  C09J4/06 ,  H01B1/20 ,  H05K3/36 ,  H05K3/32 ,  H01L21/60

CPC分类号： H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

摘要： This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

摘要翻译： 本发明提供了一种接线端子连接粘合剂，其包括在加热时能够产生自由基的固化剂，可自由基聚合的物质和硅氧烷颗粒，以及使用这种粘合剂的接线端子连接方法和布线结构 。

公开(公告)号：US20100277885A1

公开(公告)日：2010-11-04

申请号：US12808967

申请日：2008-12-16

申请人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Akihiro Ito

发明人： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Akihiro Ito

IPC分类号： H05K1/11 ,  H02G3/04

CPC分类号： H01R4/04 ,  C08K3/017 ,  C08K3/08 ,  C08K9/02 ,  C09J7/10 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/36 ,  C09J2205/102 ,  H01R12/52 ,  H01R12/7076 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/1189

摘要： A circuit connecting material which is situated between mutually opposing circuit electrodes and, upon pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, the circuit connecting material having a laminated construction comprising an anisotropic conductive adhesive layer A with conductive particles 21 dispersed therein and an insulating adhesive layer B, wherein the adhesive force of the insulating adhesive layer B for glass substrates is greater than the adhesive force of the anisotropic conductive adhesive layer A for glass substrates.

摘要翻译： 位于相互相对的电路电极之间的电路连接材料，并且在按压相互相对的电路电极时沿着按压方向电连接电极，该电路连接材料具有包含各向异性导电粘合剂层A的导电粒子21 分散在其中以及绝缘粘合剂层B，其中用于玻璃基板的绝缘粘合剂层B的粘合力大于玻璃基板用各向异性导电粘合剂层A的粘合力。

公开(公告)号：US07777335B2

公开(公告)日：2010-08-17

申请号：US11074704

申请日：2005-03-09

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

IPC分类号： H05K3/32 ,  H05K3/36 ,  H01L21/60 ,  C09J4/06

CPC分类号： H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

摘要： A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.

摘要翻译： 一种具有接线端子连接粘合剂的布线结构，其包括在加热时能够产生自由基的固化剂，可自由基聚合的物质和硅氧烷颗粒。

公开(公告)号：US07736066B2

公开(公告)日：2010-06-15

申请号：US11817725

申请日：2006-03-02

申请人： Jun Liu ,  Ryosuke Yamada ,  Kouji Kobayashi ,  Azusa Otani

发明人： Jun Liu ,  Ryosuke Yamada ,  Kouji Kobayashi ,  Azusa Otani

IPC分类号： F16C33/46

CPC分类号： F16C33/546 ,  F16C19/30 ,  F16C33/541 ,  F16C2240/40

摘要： A diameter dimension of a chamfer 11 which is formed on axial end faces of a cylindrical roller 8 which is retained in each pocket 7 of a cage 2 whose axial positioning is realized by a roller guide at a portion which lies closer to an outside diameter side thereof is made such that a central flat surface 9 which lies on an inside diameter side of the chamfer 11 is not exposed from an external surface of an outside diameter side flat plate portion 14. Then, a difference between a minimum value ΔB of an amount by which the cylindrical roller 8 projects from the external surface of the outside diameter side flat plate portion 14 and a dimension W11 of the chamfer 11 with respect to a diameter direction thereof is made smaller than a thickness T2 of the cage 2.

摘要翻译： 形成在圆柱滚子8的轴向端面上的倒角11的直径尺寸，圆柱滚子8保持在保持架2的每个凹部7中，轴承定位通过滚子引导件在靠近外径侧的部分 使得位于倒角11的内径侧的中央平面9不从外径侧平板部14的外表面露出。然后，最小值Dgr; B之间的差 圆筒滚子8从外径侧平板部14的外表面突出的量和倒角11相对于其直径方向的尺寸W11小于保持架2的厚度T2。

公开(公告)号：US20100108365A1

公开(公告)日：2010-05-06

申请号：US12374628

申请日：2006-07-21

申请人： Motohiro Arifuku ,  Nichiomi Mochizuki ,  Takashi Nakazawa ,  Kouji Kobayashi ,  Tohru Fujinawa ,  Takashi Tatsuzawa

发明人： Motohiro Arifuku ,  Nichiomi Mochizuki ,  Takashi Nakazawa ,  Kouji Kobayashi ,  Tohru Fujinawa ,  Takashi Tatsuzawa

IPC分类号： H05K1/09 ,  C08K5/29 ,  C09J133/12

CPC分类号： H05K3/323 ,  C08G18/4213 ,  C08G18/672 ,  C08L75/06 ,  C08L2666/20 ,  C09J175/16 ,  H01R12/52 ,  H05K3/361 ,  Y10T29/49126 ,  C08G18/42

摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.