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公开(公告)号：US4367414A
公开(公告)日：1983-01-04
申请号：US352578
申请日：1982-02-26
CPC分类号： H02J13/0079 , H02J13/0086 , H05B37/0218 , H05B37/0227 , H05B37/029 , Y02B20/46 , Y02B70/3283 , Y04S20/246 , Y10T307/461
摘要： An apparatus for controlling distributed electrical loads including a microprocessor based central controller coupled via a twisted pair bidirectional data line to a plurality of microcomputer based transceiver decoders. Each transceiver decoder is coupled to a plurality of relays, each relay associated with a particular load to be controlled. Override switches and sensors, coupled to transceiver decoders provide override requests and information related to ambient conditions at the site of a load. A user defined data base includes sub-sets of relays called sectors, patterns of relay states, remote switches, a time dependent schedule and condition responses. A communication protocall and arbitration scheme provide for interactive communication between the central controller and each transceiver decoder with interfacing with the operation of any other transceiver decoder. Enhanced data storage capacity is achieved through dynamic allocation of memory space for pattern data.
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公开(公告)号：US4345200A
公开(公告)日：1982-08-17
申请号：US242782
申请日：1981-03-11
CPC分类号： H02M5/297
摘要： A circuit, for controlling the output level of a load circuit connected thereto, has a single input for receiving a control signal to provide both a selectable level on/off output signal at a first output connected to an on/off terminal of the load circuit, and a pair of essentially equal control currents drawn in shunt from a pair of output terminals connected to load output-level-setting input terminals. The shunt control currents are provided by a current-mirror circuit having a pair of substantially identical current sinks, each responsive to an input signal applied thereto in parallel from the single control circuit input.
摘要翻译： 用于控制与其连接的负载电路的输出电平的电路具有用于接收控制信号的单个输入，以在连接到负载电路的开/关端的第一输出端提供可选择的电平开/关输出信号 以及从连接到负载输出电平设置输入端子的一对输出端子分流引出的一对基本上相等的控制电流。 分流控制电流由具有一对基本上相同的电流吸收器的电流镜电路提供，每个电流检测器响应于从单个控制电路输入并行施加到其上的输入信号。
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公开(公告)号：US4310896A
公开(公告)日：1982-01-12
申请号：US93683
申请日：1979-11-13
IPC分类号： G06F11/14 , G06F13/368 , G06F13/42 , G06F3/04
CPC分类号： G06F11/1443 , G06F13/368 , G06F13/4269
摘要： A method for interfacing two remote electronic units uses four lines and a handshaking routine including the steps of: causing the first unit to simultaneously transmit a strobe signal on one of the four lines and a signal representing one bit of the information to be communicated on a second of the four lines, sending the two signals continuously until acknowledged by the second unit; causing the second unit, when it receives these signals, simultaneously to transmit a strobe signal on a third line and a data signal, which may or may not be the same as that on the second line, on the fourth line, the third and fourth signals being transmitted continuously until their receipt is acknowledged; terminating transmission of the first and second signals when the first unit receives the third and fourth signals; and terminating the transmission of the third and fourth signals when the second unit determines that the first and second signals are no longer being transmitted. This routine is used for transmission of each bit of information to be communicated. If desired, a fifth line may be provided to carry a signal by means of which the first unit can reset the second unit so that transmission of the communication can be reinitiated in the event of difficulties.
摘要翻译： 用于连接两个远程电子单元的方法使用四条线和一个握手程序，包括以下步骤：使第一单元同时在四条线之一上发送选通信号，以及一个信号，代表要传送的信息的一位 四行中的第二行，连续发送两个信号，直到第二个单元确认; 使得第二单元在接收到这些信号时同时在第三行上发送选通信号和在第四行上传送与第二行相关的数据信号，第三和第四行 信号被连续发送，直到收到确认为止; 当第一单元接收到第三和第四信号时终止第一和第二信号的传输; 以及当所述第二单元确定所述第一和第二信号不再被发送时终止所述第三和第四信号的传输。 该程序用于传送要传送的每一位信息。 如果需要，可以提供第五行以携带信号，通过该信号第一单元可以重置第二单元，使得在困难的情况下可以重新发送通信。
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公开(公告)号：US4213182A
公开(公告)日：1980-07-15
申请号：US966816
申请日：1978-12-06
CPC分类号： H05B37/0254 , H02J13/0086 , G05B2219/24137 , G05B2219/25381 , Y02B70/3283 , Y04S20/246
摘要： A programmable energy load controller system, allowing each of a multiplicity of energy loads to be established in a selected one of an unenergized condition and a plurality of energized conditions, utilizes a central microcomputer facility in communication with a selected one of a plurality of remotely located load control processors, each configured with a unique address and capable of selectively energizing a plurality of energy loads coupled thereto under control of the central facility. The central facility includes at least one user input device, allowing a plurality of maps of load conditions, established in accordance with a user-selectable criteria, such as time-of-day and day-of-week requirements, to be loaded into a data storage associated with the central computer. A real time clock means are utilized in association with the computer and the memory to enable the desired map of load energization under the selected criteria, with means being provided for entering, on a high priority basis, overrides to at least a selected portion of the map currently implemented. Programmable energy load control methods are also disclosed.
摘要翻译： 一种可编程能量负载控制器系统，其允许以未激励状态和多个通电状态中选定的一个中的每一个能量负载建立每个能量负载控制器系统，利用中央微计算机设备与多个远程位置 负载控制处理器，每个配置有唯一地址，并能够在中央设施的控制下选择性地激励与其耦合的多个能量负载。 中央设施包括至少一个用户输入设备，允许根据用户可选择的标准（例如日期和星期几的要求）建立的多个负载状况图被加载到 与中央计算机相关联的数据存储。 与计算机和存储器相关联地使用实时时钟装置，以使得能够在所选择的标准下进行负载通电的期望映射，其中提供了用于在高优先级的基础上进入至少所选择的部分 地图目前实施。 还公开了可编程能量负载控制方法。
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公开(公告)号：US4138665A
公开(公告)日：1979-02-06
申请号：US835068
申请日：1977-09-21
摘要： A preamplifier using charge transfer techniques is formed on the same chip as a charge transfer analog to digital converter. The preamplifier then couples low level output sensors directly to the converter without need for a costly interfacing amplifier.
摘要翻译： 使用电荷转移技术的前置放大器形成在与电荷转移模数转换器相同的芯片上。 然后，前置放大器将低电平输出传感器直接耦合到转换器，而不需要昂贵的接口放大器。
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公开(公告)号：US4070666A
公开(公告)日：1978-01-24
申请号：US698012
申请日：1976-06-21
CPC分类号： H03M1/1215
摘要： An analog-to-digital converter of the metered charge transfer type is provided including an automatic polarity sensing circuit which selectively connects first and second input terminals to a charge storage location at appropriate times during a measurement cycle in order to insure that proper polarity relationships are maintained.
摘要翻译： 提供了计量电荷转移类型的模数转换器，其包括自动极性检测电路，其在测量周期期间的适当时间选择性地将第一和第二输入端子连接到电荷存储位置，以确保适当的极性关系为 保持。
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公开(公告)号：US4070600A
公开(公告)日：1978-01-24
申请号：US753773
申请日：1976-12-23
CPC分类号： H03K5/023
摘要： A semiconductor switching circuit utilizes a relatively low breakdown voltage transistor for switching between a higher and a lower voltage by switching between a first conducting state of said transistor which is a "turned-on" state and a second state which is a "breakdown" state. The switching circuit is especially useful for the operation of display devices.
摘要翻译： 半导体开关电路利用相对较低的击穿电压晶体管，通过在“导通”状态的所述晶体管的第一导通状态与作为“分断”状态的第二状态之间切换，在高电压和低电压之间切换 。 开关电路对于显示装置的操作特别有用。
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公开(公告)号：US08590145B2
公开(公告)日：2013-11-26
申请号：US12580537
申请日：2009-10-16
IPC分类号： H05K3/30
CPC分类号： H05K3/30 , H01L21/568 , H01L21/6835 , H01L23/29 , H01L23/3128 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/82 , H01L24/96 , H01L25/0652 , H01L2221/68345 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/16227 , H01L2224/16235 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/2518 , H01L2224/96 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/3511 , H05K1/0206 , H05K1/0218 , H05K1/185 , H05K3/4644 , H05K2201/09563 , H05K2201/096 , H05K2201/10371 , H05K2201/10674 , H05K2203/0733 , Y10T29/49121 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , H01L2924/00
摘要： Methods of fabricating a circuit structure are provided. The fabrication method includes: forming a chip layer, which includes obtaining at least one chip and disposing a structural material around and physically contacting the side surface(s) of each chip in the chip layer. The structural material has an upper surface substantially coplanar with or parallel to an upper surface of each chip and defines at least a portion of a front surface of the chip layer, and has a lower surface substantially coplanar with or parallel to a lower surface of each chip, which defines at least portion of a back surface of the chip layer. The method further includes forming at least one strengthening structure over the back surface of the chip layer. The strengthening structure is formed to strengthen an interface between the chip(s) and the structural material.
摘要翻译： 提供制造电路结构的方法。 制造方法包括：形成芯片层，其包括获得至少一个芯片并且在芯片层中的每个芯片的侧表面周围设置结构材料并物理接触芯片层。 结构材料具有与每个芯片的上表面基本上共面或平行的上表面，并且限定了芯片层的前表面的至少一部分，并且具有与每个芯片的下表面基本上共面或平行于下表面的下表面 芯片，其限定了芯片层的背表面的至少一部分。 该方法还包括在芯片层的背面上形成至少一个强化结构。 形成强化结构以加强芯片和结构材料之间的界面。
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公开(公告)号：US08169065B2
公开(公告)日：2012-05-01
申请号：US12644380
申请日：2009-12-22
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/48 , H01L24/96 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2221/68359 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/16146 , H01L2224/16225 , H01L2224/16237 , H01L2224/17181 , H01L2224/20 , H01L2224/2101 , H01L2224/2105 , H01L2224/211 , H01L2224/221 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06582 , H01L2225/1035 , H01L2225/1058 , H01L2225/1082 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2224/82 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Stackable circuit structures and methods of fabrication are provided employing first level metallization directly on a chips-first layer(s), which includes: a chip(s), each with a pad mask over its upper surface and openings exposing its contact pads; electrically conductive structures; and structural dielectric material surrounding the side surfaces of the chips and the conductive structures. Each chips-first layer further includes a metallization layer on the front surface of the layer, residing at least partially on the pad mask and extending over an edge of the chip. Together, the pad mask and the structural material electrically isolate the metallization layer from the chip. Input/output interconnect structures physically and electrically contact the metallization layer over the front surface and/or the lower surfaces of the electrically conductive structures at the back surface of the chips-first layer, to facilitate input/output connection to chips of the layers in a stack.
摘要翻译： 提供了可堆叠的电路结构和制造方法，其在芯片第一层上直接采用第一级金属化，其包括：芯片，每个芯片在其上表面上具有焊盘掩模，并且露出其接触焊盘; 导电结构; 以及围绕芯片和导电结构的侧表面的结构介电材料。 每个芯片第一层还包括在该层的前表面上的金属化层，其至少部分地驻留在焊盘掩模上并在芯片的边缘上延伸。 一起，焊盘掩模和结构材料将金属化层与芯片电隔离。 输入/输出互连结构在芯片第一层的后表面处物理地和电接触导电结构的前表面和/或下表面上的金属化层，以便于输入/输出与层的芯片的连接 一堆
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80.发明授权Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system 有权封装的电子模块及其制造方法实现蜂窝电话或其他电子系统公开(公告)号：US07863090B2
公开(公告)日：2011-01-04
申请号：US12144725
申请日：2008-06-24
CPC分类号： H05K3/30 , H01L21/568 , H01L21/6835 , H01L23/29 , H01L23/3128 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/82 , H01L24/96 , H01L25/0652 , H01L2221/68345 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/16227 , H01L2224/16235 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/2518 , H01L2224/96 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/3511 , H05K1/0206 , H05K1/0218 , H05K1/185 , H05K3/4644 , H05K2201/09563 , H05K2201/096 , H05K2201/10371 , H05K2201/10674 , H05K2203/0733 , Y10T29/49121 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , H01L2924/00
摘要： Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a chips-first multichip base layer with conductive structures extending therethrough. An interconnect layer is disposed over the front surface of the multichip layer and includes interconnect metallization electrically connected to contact pads of the chips and to conductive structures extending through the structural material. A redistribution layer, disposed over the back surface of the multichip layer, includes a redistribution metallization also electrically connected to conductive structures extending through the structural material. Input/output contacts are arrayed over the redistribution layer, including over the lower surfaces of at least some integrated circuit chips within the multichip layer, and are electrically connected through the redistribution metallization, conductive structures, and interconnect metallization to contact pads of the integrated circuit chips of the multichip layer.
摘要翻译： 提供了电路结构和制造方法，以便于以紧凑的封装实现完整的电子系统。 在一个实施例中，电路结构包括具有延伸穿过其中的导电结构的芯片 - 第一多芯片基底层。 互连层设置在多芯层的前表面上，并且包括电连接到芯片的接触焊盘和延伸穿过结构材料的导电结构的互连金属化。 设置在多芯层的后表面上的再分配层包括还电连接到延伸穿过结构材料的导电结构的再分布金属化。 输入/输出触点排列在再分配层上，包括在多芯层内的至少一些集成电路芯片的下表面上，并且通过再分布金属化，导电结构和互连金属化电连接到集成电路的接触焊盘 多芯片层的芯片。
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