公开(公告)号：US07366439B2

公开(公告)日：2008-04-29

申请号：US11150114

申请日：2005-06-13

申请人： Osamu Anan ,  Akira Suzuki

发明人： Osamu Anan ,  Akira Suzuki

IPC分类号： G03G15/00

CPC分类号： G03G21/181 ,  G03G2215/00987

摘要： A method of remanufacturing a cartridge detachably mountable in an electrophotographic image-forming apparatus body and composed of styrene-based resin compositions at least in part, characterized by including the steps of: (1) dividing the cartridge into at least two parts; and (2) bonding at least one of the divided parts with another one of the divided parts and/or a component other than the divided parts by use of a terpene solvent.

摘要翻译： 一种可拆卸地安装在电子照相成像设备主体中并由至少部分由苯乙烯基树脂组合物构成的盒的方法，其特征在于包括以下步骤：（1）将盒分成至少两部分; 和（2）通过使用萜烯溶剂将分割部分中的至少一个与分割部分中的另一个和/或除了分割部分之外的成分结合。

公开(公告)号：US07339273B2

公开(公告)日：2008-03-04

申请号：US11257390

申请日：2005-10-25

申请人： Kojiro Kameyama ,  Akira Suzuki ,  Mitsuo Umemoto

发明人： Kojiro Kameyama ,  Akira Suzuki ,  Mitsuo Umemoto

IPC分类号： H01L29/40 ,  H01L23/52 ,  H01L23/48 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L24/10 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/351 ,  Y10S438/978 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： The invention is directed to a semiconductor device having a penetrating electrode and a manufacturing method thereof in which reliability and a yield of the semiconductor device are enhanced. A semiconductor substrate is etched to form a via hole from a back surface of the semiconductor substrate to a pad electrode. This etching is performed under an etching condition such that an opening diameter of the via hole at its bottom is larger than a width of the pad electrode. Next, a second insulation film is formed on the back surface of the semiconductor substrate including in the via hole 16, exposing the pad electrode at the bottom of the via hole. Next, a penetrating electrode and a wiring layer are formed, being electrically connected with the pad electrode exposed at the bottom of the via hole 16. Furthermore, a protection layer and a conductive terminal are formed. Finally, the semiconductor substrate is cut and separated in semiconductor dies by dicing.

摘要翻译： 本发明涉及一种具有穿透电极的半导体器件及其制造方法，其中提高了半导体器件的可靠性和产量。 蚀刻半导体衬底以从半导体衬底的背表面到焊盘电极形成通孔。 该蚀刻在蚀刻条件下进行，使得其底部的通孔的开口直径大于焊盘电极的宽度。 接下来，在包括在通孔16中的半导体衬底的背面上形成第二绝缘膜，使通孔底部的焊盘电极露出。 接下来，形成贯通电极和布线层，与在通孔16的底部露出的焊盘电极电连接。 此外，形成保护层和导电端子。 最后，通过切割在半导体管芯中切割和分离半导体衬底。

公开(公告)号：US20080029322A1

公开(公告)日：2008-02-07

申请号：US11878238

申请日：2007-07-23

申请人： Toru Oba ,  Akira Suzuki

发明人： Toru Oba ,  Akira Suzuki

IPC分类号： B62D25/00 ,  B62D39/00

CPC分类号： F01P11/18 ,  B62D25/12

摘要： An intake system cover for a vehicle is mounted in an engine compartment to cover a reservoir tank that stores coolant for an engine. The intake system cover for the vehicle is formed with a light introduction opening for introducing light to be directed toward a liquid level gauge at a side of the reservoir tank. The visibility of the liquid level of the reservoir tank at the liquid level gauge is improved.

摘要翻译： 用于车辆的进气系统盖安装在发动机舱中以覆盖储存用于发动机的冷却剂的储存罐。 用于车辆的进气系统盖形成有用于引导光的导光开口，以引导到储液罐侧面的液位计。 液位计液位计液位的可视性得到改善。

公开(公告)号：US20080026227A1

公开(公告)日：2008-01-31

申请号：US11866531

申请日：2007-10-03

申请人： Kenshirou Abe ,  Akira Suzuki

发明人： Kenshirou Abe ,  Akira Suzuki

IPC分类号： B29C65/42

CPC分类号： B29C66/54 ,  B29C45/0062 ,  B29C65/42 ,  B29C66/71 ,  B29C66/73921 ,  B29K2105/0097 ,  B29L2031/767 ,  Y10T428/19 ,  Y10T428/195 ,  Y10T428/24 ,  Y10T428/24529 ,  Y10T428/31504 ,  B29K2023/04 ,  B29K2023/10 ,  B29K2025/04 ,  B29K2069/00 ,  B29K2055/02 ,  B29K2071/12 ,  B29K2025/06 ,  B29K2023/12 ,  B29K2023/06

摘要： A resin molding is made by integrally joining a first resin molded part configured a concave portion and a second resin molded part configured a convex portion so that the concave portion and the convex portion are mated together. The resin molding includes a cavity that is in communication with the convex portion and the concave portion when the convex and concave portions are mated into each other, and a joining resin filled into the cavity. The first and second molded parts and the joining resin are composed of the same resin or similar resins.

摘要翻译： 通过将构成凹部的第一树脂成形部和形成有凸部的第二树脂成型体整体接合而成形树脂成形体，使得凹部和凸部配合在一起。 树脂模制件包括当凸部和凹部彼此配合时与凸部和凹部连通的空腔，以及填充到空腔中的接合树脂。 第一和第二模制部件和接合树脂由相同的树脂或类似的树脂组成。

公开(公告)号：US20080023846A1

公开(公告)日：2008-01-31

申请号：US11878796

申请日：2007-07-26

申请人： Katsuyuki Seki ,  Akira Suzuki ,  Koujiro Kameyama ,  Takahiro Oikawa

发明人： Katsuyuki Seki ,  Akira Suzuki ,  Koujiro Kameyama ,  Takahiro Oikawa

IPC分类号： H01L21/311 ,  H01L21/302 ,  H01L23/48

CPC分类号： H01L21/3065 ,  H01L21/30655 ,  H01L21/31138 ,  H01L21/76898 ,  H01L2224/02372 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/00014 ,  H01L2924/04953 ,  H01L2924/0496 ,  H01L2924/01074 ,  H01L2924/0494

摘要： The invention provides a method of manufacturing a semiconductor device which achieves high reliability and high yield as well as high production efficiency. Back surface grinding (back grinding) is performed to a semiconductor substrate to thin the semiconductor substrate. A damaged layer formed by the back surface grinding is not removed at this time, and a photoresist layer is selectively formed on the back surface of the semiconductor substrate. The semiconductor substrate is then etched using the photoresist layer as a mask to form a via hole. The photoresist layer is then removed with the semiconductor substrate still placed in an etcher used in the etching process subsequently after the formation of the via hole. In this manner, the etching process and the next ashing process are performed sequentially in one apparatus. Then a process of removing the damaged layer on the back surface of the semiconductor substrate and a process of smoothing the sidewall of the via hole are simultaneously performed subsequently after the ashing process in the same apparatus.

摘要翻译： 本发明提供一种制造半导体器件的方法，该方法实现了高可靠性和高产率以及高生产效率。 对半导体基板进行背面研磨（背面研磨）以使半导体基板变薄。 此时不会去除由背面磨削形成的损伤层，并且在半导体衬底的背面上选择性地形成光致抗蚀剂层。 然后使用光致抗蚀剂层作为掩模蚀刻半导体衬底以形成通孔。 然后在形成通孔之后，半导体衬底仍然放置在蚀刻工艺中使用的蚀刻器中，去除光致抗蚀剂层。 以这种方式，在一个装置中顺序地执行蚀刻处理和下一个灰化处理。 然后，在同一装置的灰化处理之后，随后进行去除半导体基板背面的损伤层的工序和平滑通路孔的侧面的工序。

公开(公告)号：US07323039B2

公开(公告)日：2008-01-29

申请号：US11302217

申请日：2005-12-14

申请人： Takehiko Suzuki ,  Yasuhisa Matsukawa ,  Akira Suzuki

发明人： Takehiko Suzuki ,  Yasuhisa Matsukawa ,  Akira Suzuki

IPC分类号： B01D53/22 ,  B01D63/00 ,  B01D13/12

CPC分类号： A61K9/1647 ,  A61K9/1635 ,  A61K9/1694 ,  B01D61/362 ,  B01D63/02 ,  B01D71/70 ,  B01D2311/06 ,  B01D2315/06 ,  B01J13/12 ,  C08J3/16 ,  Y10T428/2985 ,  B01D2311/106 ,  B01D2311/2626

摘要： It is to provide an improved method for preparation of microsphere from an emulsion wherein an organic phase containing an organic solvent having a boiling point lower than that of water and a hardly-water-soluble polymer is emulsified in an aqueous phase by an in-water drying method, which comprises: (1) using an apparatus equipped with a gas separation membrane; (2) supplying the emulsion to be subjected to in-water drying to one side of said gas separation membrane; (3) evaporating off the organic solvent contained in said emulsion to the other side of said gas separation membrane, which can remove the organic solvent with high efficiency and can be carried out in a closed system and hence is favorable from the environmental viewpoint.

摘要翻译： 本发明提供一种从乳液制备微球的改进方法，其中将含有沸点低于水的有机溶剂和难溶于水的聚合物的有机相通过水中乳化在水相中 干燥方法，其包括：（1）使用装备有气体分离膜的装置; （2）将要进行水中干燥的乳液供给到所述气体分离膜的一侧; （3）将所述乳液中所含的有机溶剂蒸发到所述气体分离膜的另一侧，其可以高效地除去有机溶剂，并且可以在封闭体系中进行，因此从环境的观点来看是有利的。

公开(公告)号：US20080003039A1

公开(公告)日：2008-01-03

申请号：US11681910

申请日：2007-03-05

申请人： Toshiharu Sekino ,  Kenji Eoka ,  Kousuke Takahashi ,  Takeshi Hiyoshi ,  Tsuyoshi Sanada ,  Akira Suzuki

发明人： Toshiharu Sekino ,  Kenji Eoka ,  Kousuke Takahashi ,  Takeshi Hiyoshi ,  Tsuyoshi Sanada ,  Akira Suzuki

IPC分类号： B41J3/60

CPC分类号： B41J3/60 ,  B41J11/0095 ,  B41J15/042

摘要： A printer comprising a main unit, a cover, a first print head provided in the cover, a second print head provided in the main unit, and a hinge mechanism. The cover can rotate around the hinge mechanism, between a first state and a second state in which the cover is opened and closed, respectively, with respect to the main unit. The first print head and the second print head can rotate along the locus of the cover.

摘要翻译： 一种打印机，包括主单元，盖，设置在盖中的第一打印头，设置在主单元中的第二打印头和铰链机构。 在第一状态和第二状态之间，盖可以围绕铰链机构旋转，其中盖分别相对于主单元打开和关闭。 第一打印头和第二打印头可以沿着盖的轨迹旋转。

公开(公告)号：US20080003038A1

公开(公告)日：2008-01-03

申请号：US11681907

申请日：2007-03-05

申请人： Kiyotaka Nihashi ,  Kenji Eoka ,  Kousuke Takahashi ,  Takeshi Hiyoshi ,  Tsuyoshi Sanada ,  Akira Suzuki

发明人： Kiyotaka Nihashi ,  Kenji Eoka ,  Kousuke Takahashi ,  Takeshi Hiyoshi ,  Tsuyoshi Sanada ,  Akira Suzuki

IPC分类号： B41J3/60

CPC分类号： B41J3/60 ,  B41J2/32 ,  B41J15/042

摘要： A thermal printer has a main body, a cover body, a hinge mechanism, a first locating mechanism, and a second locating mechanism. At the time of a shift from a second state where the cover body is opened with respect to the main body to a first state where the cover body covers the main body, the first locating mechanism locates a first platen roller of the cover body with respect to a first thermal head of the main body, and arranges a second thermal head of the cover body in the vicinity of a second platen roller of the main body. The second locating mechanism locates the second thermal head arranged in the vicinity of the second platen roller by the first locating mechanism with respect to the second platen roller of the main body.

摘要翻译： 热敏打印机具有主体，盖体，铰链机构，第一定位机构和第二定位机构。 在从主体相对于主体打开的第二状态转移到盖体覆盖主体的第一状态时，第一定位机构将盖体的第一压纸辊相对于 连接到主体的第一热敏头，并且将盖体的第二热敏头布置在主体的第二压纸辊附近。 第二定位机构通过第一定位机构相对于主体的第二压纸辊定位布置在第二压纸辊附近的第二热敏头。

公开(公告)号：US20070279485A1

公开(公告)日：2007-12-06

申请号：US10587172

申请日：2005-01-28

申请人： Akio Ohba ,  Akira Suzuki ,  Tomokazu Kake

发明人： Akio Ohba ,  Akira Suzuki ,  Tomokazu Kake

IPC分类号： H04N7/01 ,  G06F13/14

CPC分类号： G06F3/017 ,  G06F3/012 ,  G06F3/0481 ,  G06F3/0482

摘要： To provide an image processing technique for easy initial settings when a video image feature is used as an input interface. This is an image processor having an image combining section 106 for combining a mirrored video image feature that includes an image of an operator as a portion thereof and an object image of an object that is associated with a predetermined event, to generate a combined image, and being adapted to provide production of the combined image on a display device. This image processor has a detection section 109 for detecting the position of an image of an operator included in the mirrored video image feature. The image combining section 106 is adapted to combine the object image and the mirrored video image feature in such a manner that the object image is displayed in a range that an image of a hand of the operator can reach, depending on the position of the image of the operator detected by the detection section 109.

摘要翻译： 提供图像处理技术，以便在使用视频图像特征作为输入接口时进行简单的初始设置。 这是具有图像合成部分106的图像处理器，用于将包括作为其一部分的操作者的图像的镜像视频图像特征与与预定事件相关联的对象的对象图像组合以生成组合图像， 并且适于在显示装置上提供组合图像的制作。 该图像处理器具有用于检测包括在镜像视频图像特征中的运算符的图像的位置的检测部分109。 图像组合部分106适于将目标图像和镜像的视频图像特征组合，使得在根据图像的位置使操作者的手的图像能够到达的范围内显示对象图像 由检测部109检测出的操作者。

公开(公告)号：US20070254471A1

公开(公告)日：2007-11-01

申请号：US11822122

申请日：2007-07-02

申请人： Kojiro Kameyama ,  Akira Suzuki

发明人： Kojiro Kameyama ,  Akira Suzuki

IPC分类号： H01L21/4763

CPC分类号： H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A result of formation of an opening in a semiconductor substrate can be judged without cutting a semiconductor wafer and observing a cross-section of the cut wafer. A semiconductor device of this invention includes a semiconductor substrate, a pad electrode formed on the semiconductor substrate, an opening formed in the semiconductor substrate to expose the pad electrode, a wiring layer connected with the pad electrode through the opening and a monitoring opening formed in a scribe line to monitor a result of the formation of the opening.