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公开(公告)号：US20090179314A1
公开(公告)日：2009-07-16
申请号：US12410463
申请日：2009-03-25
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L23/49579 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/1601 , H01L2224/81141 , H01L2224/81192 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15151
摘要： An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support.
摘要翻译： 一种集成电路封装系统，包括形成具有预定高度的引线支架的引线的引线框架，并且以由引导板支撑件的预定高度确定的预定的折叠高度将集成电路管芯与电互连件连接。
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公开(公告)号：US07479409B2
公开(公告)日：2009-01-20
申请号：US11610304
申请日：2006-12-13
IPC分类号： H01L21/00
CPC分类号： H01L23/49565 , H01L23/49541 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes an elevated edge leadframe array, isolating leadframes of the elevated edge leadframe array, validating integrated circuit die attached to the leadframes, and forming integrated circuit packages including the integrated circuit die.
摘要翻译： 集成电路封装系统包括升高的边缘引线框架阵列，隔离升高的边缘引线框阵列的引线框架，验证附接到引线框架的集成电路管芯，以及形成包括集成电路管芯的集成电路封装。
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公开(公告)号：US20090014849A1
公开(公告)日：2009-01-15
申请号：US12237291
申请日：2008-09-24
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L21/568 , H01L23/3135 , H01L23/495 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming a lead from a padless lead frame, and encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound.
摘要翻译： 提供了一种集成电路封装系统，其从无铅引线框架形成引线，并且封装所述引线以将第一模塑料与第二模塑料一起封装，用于支撑集成电路模具。
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公开(公告)号：US07449369B2
公开(公告)日：2008-11-11
申请号：US11338328
申请日：2006-01-23
IPC分类号： H01L21/00
CPC分类号： H01L21/568 , H01L23/3135 , H01L23/495 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming a lead from a padless lead frame, and encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound.
摘要翻译： 提供了一种集成电路封装系统，其从无铅引线框架形成引线，并且封装所述引线以将第一模塑料与第二模塑料一起封装，用于支撑集成电路模具。
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公开(公告)号：US20080006926A1
公开(公告)日：2008-01-10
申请号：US11456544
申请日：2006-07-10
CPC分类号： H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/4334 , H01L23/49548 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle; soldering a stiffener structure; having an opening; on the mounting structure; connecting the stiffener structure to a ground; and molding the integrated circuit die and partially the stiffener structure through the opening.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有外部互连件，桨形件和连接杆的安装结构; 在桨上安装集成电路管芯; 焊接加强筋结构; 有开口 在安装结构上; 将加强筋结构连接到地面上; 并且通过开口模制集成电路模具并且部分地加强加强件结构。
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公开(公告)号：US08637394B2
公开(公告)日：2014-01-28
申请号：US11773886
申请日：2007-07-05
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/3128 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/4826 , H01L2224/4846 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48482 , H01L2224/49111 , H01L2224/49112 , H01L2224/49171 , H01L2224/49174 , H01L2224/4942 , H01L2224/49433 , H01L2224/73215 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/8518 , H01L2224/85186 , H01L2224/85399 , H01L2224/85986 , H01L2225/06506 , H01L2924/00014 , H01L2924/01033 , H01L2924/01076 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2924/00011 , H01L2224/4554
摘要： An integrated circuit package system includes: forming a flex bump over an integrated circuit device structure, the flex bump having both a base portion and an offset portion over the base portion; forming a first ball bond of a first internal interconnect over the offset portion; and encapsulating the integrated circuit device structure, the flex bump, and the first internal interconnect.
摘要翻译： 集成电路封装系统包括：在集成电路器件结构上形成柔性突起，所述柔性突起在基部上方具有基部和偏移部分; 在所述偏移部分上形成第一内部互连的第一球接合; 并封装集成电路器件结构，柔性突起和第一内部互连。
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公开(公告)号：US20090008761A1
公开(公告)日：2009-01-08
申请号：US11773886
申请日：2007-07-05
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/3128 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/4826 , H01L2224/4846 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48482 , H01L2224/49111 , H01L2224/49112 , H01L2224/49171 , H01L2224/49174 , H01L2224/4942 , H01L2224/49433 , H01L2224/73215 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/8518 , H01L2224/85186 , H01L2224/85399 , H01L2224/85986 , H01L2225/06506 , H01L2924/00014 , H01L2924/01033 , H01L2924/01076 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2924/00011 , H01L2224/4554
摘要： An integrated circuit package system includes: forming a flex bump over an integrated circuit device structure, the flex bump having both a base portion and an offset portion over the base portion; forming a first ball bond of a first internal interconnect over the offset portion; and encapsulating the integrated circuit device structure, the flex bump, and the first internal interconnect.
摘要翻译： 集成电路封装系统包括：在集成电路器件结构上形成柔性突起，所述柔性突起在基部上方具有基部和偏移部分; 在所述偏移部分上形成第一内部互连的第一球接合; 并封装集成电路器件结构，柔性突起和第一内部互连。
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公开(公告)号：US20080237816A1
公开(公告)日：2008-10-02
申请号：US11694921
申请日：2007-03-30
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L21/565 , H01L23/3107 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit package system is provided including forming a lead frame includes forming a mold gate, providing a first surface, and providing a second surface opposite the first surface; and forming angled gate sides facing each other in the mold gate between the first surface and the second surface.
摘要翻译： 提供一种集成电路封装系统，包括形成引线框架，包括形成模具门，提供第一表面，并提供与第一表面相对的第二表面; 以及在所述第一表面和所述第二表面之间的模具浇口中形成彼此相对的成角度的浇口侧。
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公开(公告)号：US20080290485A1
公开(公告)日：2008-11-27
申请号：US12123995
申请日：2008-05-20
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49548 , H01L21/568 , H01L23/49503 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/48247 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system including: providing a die pad with a top, sides, and a bottom, the bottom having a relief with a flat surface and defining a wall and a center pad; mounting a barrier under the bottom of the die pad; mounting an integrated circuit die on the top of the die pad; encapsulating the integrated circuit die and the top and sides of the die pad with the wall preventing encapsulation from flowing along the barrier to reach the center pad; and mounting an external interconnect on the center pad.
摘要翻译： 一种集成电路封装系统，包括：提供具有顶部，侧面和底部的管芯焊盘，所述底部具有带有平坦表面并且限定壁和中心焊盘的浮雕; 在芯片底部的下方安装阻挡层; 将集成电路管芯安装在管芯焊盘的顶部; 封装集成电路管芯和管芯焊盘的顶部和侧面，防止封装沿着屏障流动到达中心焊盘; 并在中心焊盘上安装外部互连。
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公开(公告)号：US08981548B2
公开(公告)日：2015-03-17
申请号：US12123995
申请日：2008-05-20
IPC分类号： H01L23/48 , H01L23/495 , H01L21/56 , H01L23/00
CPC分类号： H01L23/49548 , H01L21/568 , H01L23/49503 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/48247 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system including: providing a die pad with a top, sides, and a bottom, the bottom having a relief with a flat surface and defining a wall and a center pad; mounting a barrier under the bottom of the die pad; mounting an integrated circuit die on the top of the die pad; encapsulating the integrated circuit die and the top and sides of the die pad with the wall preventing encapsulation from flowing along the barrier to reach the center pad; and mounting an external interconnect on the center pad.
摘要翻译： 一种集成电路封装系统，包括：提供具有顶部，侧面和底部的管芯焊盘，所述底部具有带有平坦表面并且限定壁和中心焊盘的浮雕; 在芯片底部的下方安装阻挡层; 将集成电路管芯安装在管芯焊盘的顶部; 封装集成电路管芯和管芯焊盘的顶部和侧面，防止封装沿着屏障流动到达中心焊盘; 并在中心焊盘上安装外部互连。
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