公开(公告)号：US20150132884A1

公开(公告)日：2015-05-14

申请号：US14602863

申请日：2015-01-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Yu-Hao SHIH ,  Szu-Ying CHEN ,  Hsing-Lung CHEN ,  Jen-Cheng LIU ,  Dun-Nian YAUNG ,  Volume CHIEN

IPC: H01L27/146 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H01L27/14685 ,  H01L27/14629 ,  H01L27/1464 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/18

Abstract: A method of forming an image sensor device where the method includes forming a first dielectric layer on a substrate. The method further includes patterning the first dielectric layer to define an area for a reflective shield, where the area defined for the reflective shield is above a photodiode. Additionally, the method includes forming the reflective shield on the substrate by filling the defined area with a high reflectivity material, and the high reflective material comprises a polymer.

Abstract translation: 一种形成图像传感器装置的方法，其中所述方法包括在基底上形成第一介电层。 该方法还包括图案化第一介电层以限定用于反射屏蔽的区域，其中为反射屏蔽限定的区域在光电二极管的上方。 另外，该方法包括通过用高反射率材料填充限定区域在基板上形成反射屏蔽，并且高反射材料包括聚合物。

公开(公告)号：US20150130004A1

公开(公告)日：2015-05-14

申请号：US14401224

申请日：2013-03-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Hiroya Kobayashi ,  Masaharu Muramatsu

IPC: H01L27/146

CPC classification number: H01L27/1464 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L31/02162 ,  H01L31/0232 ,  H01L31/02327 ,  H01L2224/48091 ,  H01L2924/10158 ,  H01L2924/00014

Abstract: A portion on the light exit end surface side of a fiber optic plate includes a first portion and a second portion. The first portion corresponds to a peripheral portion of a semiconductor photodetecting element. The second portion corresponds to a thin portion of the semiconductor photodetecting element and projects more toward the semiconductor photodetecting element than the first portion. A height of a step made between the first portion and the second portion of the fiber optic plate is lower than a height of a step made between the thin portion and the peripheral portion of the semiconductor photodetecting element. The semiconductor photodetecting element and the fiber optic plate are fixed by a resin, in a state in which the first portion and the peripheral portion are in contact and in which the second portion and the thin portion are separated.

Abstract translation: 光纤板的光出射端面侧的一部分包括第一部分和第二部分。 第一部分对应于半导体光电检测元件的周边部分。 第二部分对应于半导体光电检测元件的薄部分，并且比第一部分更多地朝向半导体光电检测元件投射。 在光纤板的第一部分和第二部分之间形成的台阶的高度低于在半导体光电检测元件的薄部分和周边部分之间形成的台阶的高度。 半导体光电检测元件和光纤板在第一部分和周边部分接触并且第二部分和薄部分分离的状态下由树脂固定。

公开(公告)号：US09000354B2

公开(公告)日：2015-04-07

申请号：US13646423

申请日：2012-10-05

Applicant: Telcordia Technologies, Inc.

Inventor： Ted Woodward ,  Anjali Agarwal ,  Nicholas Peters

IPC: G01J1/04 ,  G01N21/17 ,  G01J1/42 ,  H01L31/0232 ,  G02B6/293 ,  G01J3/453 ,  G01N21/41 ,  G01J1/58 ,  G02F1/35 ,  G01S17/10 ,  G01S7/486 ,  G01S7/487 ,  H04B10/70 ,  G02F1/39

CPC classification number: G01N21/17 ,  G01J1/0425 ,  G01J1/0459 ,  G01J1/42 ,  G01J1/58 ,  G01J3/4531 ,  G01N21/41 ,  G01S7/486 ,  G01S7/487 ,  G01S17/10 ,  G02B6/29338 ,  G02F1/3536 ,  G02F1/39 ,  G02F2001/392 ,  H01L31/0232 ,  H04B10/70

Abstract: Systems for enhancing the sensitivity of detecting an optical signal using nonlinear optics and method of performing the same. In one embodiment, a single-photon detection system includes an optical amplifier realized in a waveguide, and a photodetector coupled to an output of the optical amplifier. A light detection and ranging system includes the optical amplifier coupled to an optical source and one photodetector. In another embodiment, a photodetection system includes a plurality of optical frequency converters, coupled to an optical source, that sequentially convert a wavelength of photons of the optical source to a final wavelength, and a single-photon photodetector coupled to the optical frequency converters to detect single photons produced by the optical source. In another embodiment, an optical sensor includes an optical pump, and a transducer including an optical ring cavity coupled to the optical pump and configured to utilize optical four-wave mixing to detect an external stimulus.

Abstract translation: 用于增强使用非线性光学器件检测光信号的灵敏度的系统及其执行方法。 在一个实施例中，单光子检测系统包括在波导中实现的光放大器和耦合到光放大器的输出的光电检测器。 光检测和测距系统包括耦合到光源和一个光电检测器的光放大器。 在另一个实施例中，光电检测系统包括耦合到光源的多个光学频率转换器，其将光源的光子的波长顺序地转换成最终的波长，以及耦合到光变换器的单光子光电探测器 检测由光源产生的单个光子。 在另一个实施例中，光学传感器包括光学泵和包括耦合到光学泵的光学环腔的换能器，并被配置为利用光学四波混频来检测外部刺激。

公开(公告)号：US08994860B2

公开(公告)日：2015-03-31

申请号：US13350619

申请日：2012-01-13

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H04N5/335 ,  H04N5/225 ,  G02B7/02 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L23/00

CPC classification number: H01L27/14627 ,  G02B7/02 ,  G02B7/022 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H04N5/2251 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Abstract translation: 图像传感器封装包括图像传感器，窗口和模制件，其中模制件包括从窗户向上延伸的透镜保持器延伸部分。 透镜保持器延伸部分包括从窗口延伸的阴螺纹孔，使得窗口通过孔露出。 透镜支撑在螺纹透镜支架中。 带螺纹的透镜支撑件被拧入透镜保持器延伸部分的孔中。 通过旋转透镜支架，相对于图像传感器容易地调节透镜。

公开(公告)号：US20150076637A1

公开(公告)日：2015-03-19

申请号：US14025890

申请日：2013-09-13

Applicant: Taiwan Semiconductor Manufacturing Company Limited

Inventor： TZU-JUI WANG ,  KENG-YU CHOU ,  CHUN-HAO CHUANG ,  MING-CHIEH HSU ,  YUICHIRO YAMASHITA ,  JEN-CHENG LIU ,  DUN-NIAN YAUNG

IPC: H01L31/0232 ,  H01L31/18

CPC classification number: H01L31/0232 ,  H01L27/14603 ,  H01L27/14609 ,  H01L27/14612 ,  H01L27/14641 ,  H01L31/02162 ,  H01L31/02325 ,  H01L31/18

Abstract: A method for forming a photo diode is provided. The method includes: forming a first bottom electrode corresponding to a first pixel and a second bottom electrode corresponding to a second pixel over a substrate; forming a dielectric layer over the substrate; patterning the dielectric layer over the substrate; forming a photo conversion layer over the substrate; and forming a top electrode over the photo conversion layer; forming a color filter layer over the top electrode, wherein at least a portion of the dielectric layer separates a first portion of the color filter layer corresponding to a first pixel from a second portion of the color filer layer corresponding to a second pixel, and a refractive index of the dielectric layer is lower than a refractive index of the color filter layer.

Abstract translation: 提供一种形成光电二极管的方法。 该方法包括：在衬底上形成对应于第一像素的第一底部电极和对应于第二像素的第二底部电极; 在所述衬底上形成介电层; 在衬底上图形化介电层; 在衬底上形成光转换层; 以及在所述光转换层上形成顶部电极; 在所述顶部电极上形成滤色器层，其中所述电介质层的至少一部分将对应于第一像素的滤色器层的第一部分与对应于第二像素的所述彩色滤光片层的第二部分分离， 电介质层的折射率低于滤色器层的折射率。

公开(公告)号：US08981413B2

公开(公告)日：2015-03-17

申请号：US14188064

申请日：2014-02-24

Applicant: Rohm Co., Ltd.

Inventor： Akira Obika

IPC: G02B6/42 ,  H01L33/54 ,  H01L31/0232 ,  H01L33/58 ,  H01L31/18

CPC classification number: H01L31/02325 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/58 ,  H01L2224/16225 ,  H01L2224/48095 ,  H01L2924/181 ,  H01L2924/00012

Abstract: An optical communication module includes an optical semiconductor element. The element includes an optical functional region having a light receiving function or a light emitting function, a first transmission layer transmissive to light emitted from the optical functional region or light received by the optical functional region, and a wiring layer stacked on the first transmission layer and constituting a conduction path to the optical functional region. The communication module also includes a second transmission layer transmissive to the light and disposed to cover the optical semiconductor element, and a first resin member stacked on the second transmission layer. The communication module is formed with a fixing hole for fixing an optical fiber. The fixing hole includes a bottom face provided by the second transmission layer, and an opening formed in an outer surface of the first resin member.

Abstract translation: 光通信模块包括光半导体元件。 该元件包括具有光接收功能或发光功能的光学功能区域，对从光学功能区域发射的光或由光学功能区域接收的光透射的第一透射层，以及堆叠在第一透射层 并且构成到光学功能区域的传导路径。 通信模块还包括透光的第二透射层并且被设置成覆盖光学半导体元件，以及堆叠在第二透射层上的第一树脂构件。 通信模块形成有用于固定光纤的固定孔。 固定孔包括由第二透射层提供的底面和形成在第一树脂构件的外表面中的开口。

公开(公告)号：US08980675B2

公开(公告)日：2015-03-17

申请号：US14349097

申请日：2012-09-10

Applicant: Katsumi Shibayama ,  Takashi Kasahara

Inventor： Katsumi Shibayama ,  Takashi Kasahara

IPC: H01L21/00 ,  H01L31/18 ,  G01J3/26 ,  G02B5/28 ,  G01J3/02 ,  G01J3/36 ,  H01L31/0232 ,  G01J3/12

CPC classification number: H01L31/1896 ,  G01J3/02 ,  G01J3/0259 ,  G01J3/26 ,  G01J3/2803 ,  G01J3/36 ,  G01J2003/1234 ,  G02B5/28 ,  G02B5/284 ,  H01L31/0232

Abstract: A method for manufacturing a spectroscopic sensor 1 comprises a first step of forming a cavity layer 21 by etching a surface layer disposed on a handle substrate, a second step of forming a first mirror layer 22 on the cavity layer 21 after the first step, a third step of joining a light-transmitting substrate 3 onto the first mirror layer 22 after the second step, a fourth step of removing the handle substrate from the cavity layer 21 after the third step, a fifth step of forming a second mirror layer 23 on the cavity layer 21 devoid of the handle substrate after the fourth step, and a sixth step of joining a light-detecting substrate 4 onto the second mirror layer after the fifth step.

Abstract translation: 用于制造分光传感器1的方法包括：通过蚀刻设置在手柄基板上的表面层来形成空腔层21的第一步骤，在第一步骤之后在空腔层21上形成第一反射镜层22的第二步骤， 在第二步骤之后将透光基板3接合到第一镜面层22上的第三步骤，在第三步骤之后从空腔层21去除手柄基板的第四步骤，将第二镜面层23形成在第五步骤上的第五步骤 在第四步骤之后没有手柄基板的空腔层21，以及在第五步骤之后将光检测基板4接合到第二镜面层上的第六步骤。

公开(公告)号：US08974126B2

公开(公告)日：2015-03-10

申请号：US13688727

申请日：2012-11-29

Applicant: Apple Inc.

Inventor： Jason S. Sloey ,  Albert J. Golko ,  Eric S. Jol ,  Ian Spraggs

IPC: G02B6/36 ,  G02B6/42 ,  G02B6/38 ,  G02B6/26 ,  H01L31/0232

CPC classification number: G02B6/4204 ,  G02B6/262 ,  G02B6/3817 ,  G02B6/389 ,  G02B6/4246 ,  G02B6/4292 ,  H01L31/0232

Abstract: Connector systems that carry electrical signals and optical signals in a single connector are provided. A male electro-optical connector can have an electrical insert portion that fits into a receptacle of a female electro-optical connector to provide a structural connection. The optical interface can be advantageously near a front of the connectors for easy maintenance. Optical connectors with a relatively large diameter for the optical interface are also provided. Optical connectors can include a collector for receiving optical signals at a large opening and providing signals to a photodiode at a small opening of the collector. Such optical connectors with a large diameter for an optical interface can advantageously provide reduced alignment tolerances. Adapters, cable adapters, docking stations, and other apparatus can also be provided.

Abstract translation: 提供了在单个连接器中承载电信号和光信号的连接器系统。 阳电光连接器可以具有电插入部分，该电插入部分装配到阴电光连接器的插座中以提供结构连接。 光学接口可以有利地靠近连接器的前部，以便于维护。 还提供了具有用于光学接口的相对较大直径的光学连接器。 光连接器可以包括用于在大开口处接收光信号并在集电极的小开口处向光电二极管提供信号的集电极。 具有用于光学接口的大直径的这种光学连接器可以有利地提供降低的对准公差。 还可以提供适配器，电缆适配器，坞站和其他设备。

公开(公告)号：US08971678B2

公开(公告)日：2015-03-03

申请号：US13863433

申请日：2013-04-16

Applicant: International Business Machines Corporation

Inventor： Daiju Nakano ,  Masao Tokunari ,  Kazushige Toriyama ,  Yutaka Tsukada

IPC: G02B6/42 ,  H01L33/58 ,  H01L31/0232 ,  G02B6/12 ,  G02B6/26 ,  H01L25/16

CPC classification number: G02B6/4236 ,  G02B6/4214 ,  H01L25/167 ,  H01L31/0232 ,  H01L33/58 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Spacer resin pattern layer which precisely aligns a light-emitting element or a light-receiving element relative to both a waveguide pattern layer and electrical circuit pattern layer from the semiconductor wafer level. A substratum of resin having a through-hole provided for electrical communication with an electrical circuit pattern layer is formed on a semiconductor wafer. A truncated cone-shaped three-dimensional reflective surface is formed to guide the emitted light towards or received light from a waveguide pattern layer. A metal film is deposited planarly in a predetermined range from the center when positioned relative to the position of the through-hole. A truncated cone-shaped mold is stamped in the center. By modifying the direction of the light using this tapered structure, the precision tolerance is increased and optical loss is reduced.

Abstract translation: 间隔树脂图案层，其相对于波导图案层和电路图案层相对于半导体晶片级精确对准发光元件或光接收元件。 在半导体晶片上形成具有用于与电路图案层电连通的通孔的树脂基底。 形成截头圆锥形的三维反射表面以将发射的光引导到波导图案层或从波导图案层接收光。 当相对于通孔的位置定位时，金属膜从中心平面地沉积在预定范围内。 一个截头圆锥形的模具被冲压在中心。 通过使用这种锥形结构改变光的方向，提高了精度公差，降低了光损耗。

公开(公告)号：US08969879B2

公开(公告)日：2015-03-03

申请号：US13064787

申请日：2011-04-15

Applicant: Takashi Abe ,  Nobuo Nakamura ,  Keiji Mabuchi ,  Tomoyuki Umeda ,  Hiroaki Fujita ,  Eiichi Funatsu ,  Hiroki Sato

Inventor： Takashi Abe ,  Nobuo Nakamura ,  Keiji Mabuchi ,  Tomoyuki Umeda ,  Hiroaki Fujita ,  Eiichi Funatsu ,  Hiroki Sato

IPC: H01L29/76 ,  H01L31/0232 ,  H01L23/544 ,  H01L27/146 ,  H01L31/0216

CPC classification number: H01L27/14643 ,  H01L23/544 ,  H01L27/14603 ,  H01L27/14607 ,  H01L27/14609 ,  H01L27/14612 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/0232 ,  H01L31/02327 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for the registration mark. Thereafter, the registration mark is read from the back side by use of red light or near infrared rays, and registration of the stepper is accomplished. It is also possible to form a registration mark in a silicon oxide film on the back side (illuminated side) in registry with the registration mark on the wiring side, and to achieve the desired registration by use of the registration mark thus formed.