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71.发明授权Structures and methods related to detection, sensing, and/or mitigating undesirable structures or intrusion events on structures 有权与检测，感测和/或减轻结构上的不良结构或入侵事件有关的结构和方法公开(公告)号：US08907225B1
公开(公告)日：2014-12-09
申请号：US14221833
申请日：2014-03-21
Inventor： Nishkamraj U Deshpande , H. Fred Barsun , Ron Shoultz
CPC classification number: H05K1/0275 , H05K3/28 , H05K2201/0251 , H05K2201/026 , H05K2201/0769 , H05K2201/09872 , H05K2203/161 , Y10T29/49146 , Y10T428/1405
Abstract: A method and an apparatus for mitigating electrical failures caused by intrusive structures. Such structures can be tin whiskers forming on electrical circuits. In an illustrative embodiment, nano-capsules are filled with some type of insulative and adhesive fluid that is adapted to bind to and coat an intrusive structure, e.g., a whisker, making the whisker electrically inactive and thereby reducing the electrical faults that can be caused by the whisker. In another illustrative embodiment, randomly oriented nano-fibers having an elastic modulus higher than tin or any other whisker material is used to arrest a growth or movement of a whisker and further reduce a likelihood that a whisker can cause an electrical fault.
Abstract translation: 一种用于减轻由侵入式结构引起的电气故障的方法和装置。 这种结构可以是在电路上形成的锡晶须。 在说明性实施例中，纳米胶囊填充有某种类型的绝缘和粘合剂流体，其适于结合并涂覆侵入结构（例如晶须），使晶须电不活动，从而减少可能引起的电气故障 由晶须 在另一个说明性实施例中，使用弹性模量高于锡或任何其它晶须材料的随机取向的纳米纤维来阻止晶须的生长或移动，并进一步降低晶须可能导致电气故障的可能性。
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公开(公告)号：US08552602B2
公开(公告)日：2013-10-08
申请号：US13123733
申请日：2009-10-26
Applicant: Masayuki Takada
Inventor： Masayuki Takada
IPC: H02K1/04
CPC classification number: H02K5/08 , H02K3/44 , H02K3/50 , H02K11/33 , H05K3/284 , H05K3/3447 , H05K2201/0251 , H05K2201/09063 , H05K2203/1316
Abstract: A molded motor including a stator including a housing formed by integrally molding an armature winding and a printed circuit board with resin containing a fibrous reinforcing material and filler; a magnet rotor rotatably disposed to face the stator; and a plurality of lead wires led out to outside. The printed circuit board is provided with a plurality of lands connecting the lead wires by soldering, and a round hole between the plurality of lands filled with the resin, and the reinforcing material is oriented in a board thickness direction of the printed circuit board.
Abstract translation: 一种模制电动机，包括定子，所述定子包括通过一体地模制电枢绕组而形成的壳体和具有包含纤维增强材料和填料的树脂的印刷电路板; 可旋转地设置成面向定子的磁体转子; 并将多根引线导出到外部。 印刷电路板设置有通过焊接连接引线的多个焊盘，以及填充有树脂的多个焊盘之间的圆孔，并且加强材料沿印刷电路板的板厚度方向取向。
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公开(公告)号：US08357433B2
公开(公告)日：2013-01-22
申请号：US12164591
申请日：2008-06-30
Applicant: Gary C. Stevens , James D. B. Smith , John W. Wood
Inventor： Gary C. Stevens , James D. B. Smith , John W. Wood
IPC: H01B1/06
CPC classification number: C08G83/001 , C08J5/046 , C08J2363/00 , C08K3/14 , C08K3/22 , C08L63/00 , D21H13/44 , H05K1/0373 , H05K2201/0251 , H05K2201/0278 , Y10T428/23943 , Y10T428/2907 , Y10T428/2913 , Y10T428/292 , Y10T428/2924 , Y10T428/2925 , Y10T428/2933 , Y10T428/2936 , Y10T428/2947 , Y10T442/2738 , C08L2666/54
Abstract: Polymer brushes (50) in a resin that create phonon pathways therein. The polymer brushes themselves comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK. The polymer brushes are 10-25% by volume of the resin, and the polymer hairs can orient surrounding resin molecules to the polymer hairs alignment (55).
Abstract translation: 在其中产生声子通道的树脂中的聚合物刷（50）。 聚合物刷本身包含密度为0.8至1.0g / cc，链长为1至1000nm，热导率为0.5至5.0W / mK的结构化聚合物毛发。 聚合物刷是树脂的10-25体积％，聚合物毛可以将周围的树脂分子定向到聚合物毛发排列（55）。
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公开(公告)号：US08304054B2
公开(公告)日：2012-11-06
申请号：US13274851
申请日：2011-10-17
Applicant: Xinhe Tang , Ka Chun Tse , Ernst Hammel , Ben Zhong Tang
Inventor： Xinhe Tang , Ka Chun Tse , Ernst Hammel , Ben Zhong Tang
CPC classification number: C09J163/00 , B32B7/12 , B32B9/005 , B32B9/041 , B32B15/20 , B32B27/20 , B32B27/36 , B32B27/38 , B32B2250/40 , B32B2255/26 , B32B2262/02 , B32B2262/106 , B32B2264/102 , B32B2307/208 , B32B2307/302 , B82Y10/00 , B82Y30/00 , C08K7/02 , C08K2201/011 , C09J11/00 , H01L23/373 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/386 , H05K2201/0251 , H05K2201/026 , H05K2201/0323 , H05K2201/0355 , H05K2201/083 , H05K2203/104 , Y10T428/24 , Y10T428/24058 , Y10T428/24132 , Y10T428/249942 , Y10T428/31515 , H01L2924/00
Abstract: Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.
Abstract translation: 公开了一种多层材料，其中至少两种组分经由粘合剂粘结而相互连接。 粘合剂粘合剂是由适合作为粘合剂的基质中含有纳米纤维材料的粘合剂或粘合层形成的。
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75.发明申请Dielectric layer of printed circuit board, method for preparing the same, and printed circuit board including the same 审中-公开印刷电路板的电介质层，其制备方法以及包含该印刷电路板的印刷电路板公开(公告)号：US20120145441A1
公开(公告)日：2012-06-14
申请号：US13067533
申请日：2011-06-07
Applicant: Pochul Kim , Dongjin Kim , Sangik Cho , Woojin Lee , Sooyoung Ji
Inventor： Pochul Kim , Dongjin Kim , Sangik Cho , Woojin Lee , Sooyoung Ji
CPC classification number: H05K1/0366 , H05K2201/0251
Abstract: Disclosed herein are a dielectric layer of a printed circuit board prepared by dispersing short fibers in a dielectric polymer resin; and impregnating the resin having the short fibers dispersed therein in a fabric-shaped material, and a printed circuit board including the same. The dielectric polymer resin is reinforced with the short fibers and is impregnated in the fabric-shaped material, thereby making it possible to prepare the dielectric layer having excellent strength and low coefficient of thermal expansion. Accordingly, the printed circuit board including the dielectric layer may maintain strength and rigidity thereof at the same level as that of strength and rigidity of the printed circuit board according to the related art, even through a thickness thereof becomes thin.
Abstract translation: 本文公开了通过将短纤维分散在电介质聚合物树脂中而制备的印刷电路板的电介质层; 并将其中分散有短纤维的树脂浸渍在织物形状的材料中，以及包含该树脂的印刷电路板。 介电聚合物树脂用短纤维增强，并浸渍在织物形状的材料中，从而可以制备具有优异的强度和低的热膨胀系数的介电层。 因此，包括电介质层的印刷电路板可以将其强度和刚性保持在与现有技术的印刷电路板的强度和刚度相同的水平，即使其厚度变薄。
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Patent Agency Ranking
公开(公告)号：US20120031653A1
公开(公告)日：2012-02-09
申请号：US13274851
申请日：2011-10-17
Applicant: Xinhe Tang , Ka Chun Tse , Ernst Hammel
Inventor： Xinhe Tang , Ka Chun Tse , Ernst Hammel
CPC classification number: C09J163/00 , B32B7/12 , B32B9/005 , B32B9/041 , B32B15/20 , B32B27/20 , B32B27/36 , B32B27/38 , B32B2250/40 , B32B2255/26 , B32B2262/02 , B32B2262/106 , B32B2264/102 , B32B2307/208 , B32B2307/302 , B82Y10/00 , B82Y30/00 , C08K7/02 , C08K2201/011 , C09J11/00 , H01L23/373 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/386 , H05K2201/0251 , H05K2201/026 , H05K2201/0323 , H05K2201/0355 , H05K2201/083 , H05K2203/104 , Y10T428/24 , Y10T428/24058 , Y10T428/24132 , Y10T428/249942 , Y10T428/31515 , H01L2924/00
Abstract: Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.
Abstract translation: 公开了一种多层材料，其中至少两种组分经由粘合剂粘结而相互连接。 粘合剂粘合剂是由适合作为粘合剂的基质中含有纳米纤维材料的粘合剂或粘合层形成的。
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公开(公告)号：US20110193430A1
公开(公告)日：2011-08-11
申请号：US13123733
申请日：2009-10-26
Applicant: Masayuki Takada
Inventor： Masayuki Takada
IPC: H02K1/04
CPC classification number: H02K5/08 , H02K3/44 , H02K3/50 , H02K11/33 , H05K3/284 , H05K3/3447 , H05K2201/0251 , H05K2201/09063 , H05K2203/1316
Abstract: A molded motor including a stator including a housing formed by integrally molding an armature winding and a printed circuit board with resin containing a fibrous reinforcing material and filler; a magnet rotor rotatably disposed to face the stator; and a plurality of lead wires led out to outside. The printed circuit board is provided with a plurality of lands connecting the lead wires by soldering, and a round hole between the plurality of lands filled with the resin, and the reinforcing material is oriented in a board thickness direction of the printed circuit board.
Abstract translation: 一种模制电动机，包括定子，所述定子包括通过一体地模制电枢绕组而形成的壳体和具有包含纤维增强材料和填料的树脂的印刷电路板; 可旋转地设置成面向定子的磁体转子; 并将多根引线导出到外部。 印刷电路板设置有通过焊接连接引线的多个焊盘，以及填充有树脂的多个焊盘之间的圆孔，并且加强材料沿印刷电路板的板厚度方向取向。
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78.发明申请ARAMID FILLED POLYIMIDES HAVING ADVANTAGEOUS THERMAL EXPANSION PROPERTIES, AND METHODS RELATING THERETO 失效具有有利的热膨胀性能的ARAMID填充聚酰胺及其相关方法公开(公告)号：US20100311901A1
公开(公告)日：2010-12-09
申请号：US12848408
申请日：2010-08-02
Applicant: KUPPUSAMY KANAKARAJAN , ARNOLD FRANCES
Inventor： KUPPUSAMY KANAKARAJAN , ARNOLD FRANCES
CPC classification number: C09J179/08 , C08L77/10 , C08L2205/16 , C08L2666/20 , H05K1/0373 , H05K3/281 , H05K3/386 , H05K2201/0154 , H05K2201/0251 , H05K2201/0278 , H05K2201/068 , Y10T428/1023 , Y10T428/24917 , Y10T428/28 , Y10T428/2804 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , Y10T442/2361
Abstract: The invention is directed to polyimide based adhesives having a coefficient of thermal expansion (“CTE”) equal to or below 50 ppm/° C. The adhesives of the present invention contain a polyimide base polymer present in the overall adhesive in an amount from 25 to 95 weight percent. The polyimide base polymer has a glass transition temperature (“Tg”) in a range of from about 150 to about 300° C. and typically has a coefficient of thermal expansion above 50 ppm/° C. The polyimide based adhesives of the invention also contain an aramid micro fiber filler in an amount from 5 to 75 weight percent, based upon the total weight of the polyimide based adhesive. The fiber filler can be used to lower CTE of the overall adhesive to match (or nearly match) the CTE of other materials like metal, silicon wafers, other polymers (including polyimide) and the like.
Abstract translation: 本发明涉及具有等于或低于50ppm /℃的热膨胀系数（“CTE”）的聚酰亚胺基粘合剂。本发明的粘合剂含有总体粘合剂中聚酰亚胺基聚合物的量为25 至95重量％。 聚酰亚胺基聚合物的玻璃化转变温度（“Tg”）在约150至约300℃的范围内，并且通常具有高于50ppm /℃的热膨胀系数。本发明的聚酰亚胺基粘合剂也 基于聚酰亚胺基粘合剂的总重量，含有5至75重量％的芳族聚酰胺微纤维填料。 纤维填料可用于降低整个粘合剂的CTE以匹配（或几乎匹配）其它材料如金属，硅晶片，其它聚合物（包括聚酰亚胺）等的CTE。
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79.发明授权Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto 失效具有有利的热膨胀性能的芳族聚酰胺填充的聚酰亚胺及其相关的方法公开(公告)号：US07790276B2
公开(公告)日：2010-09-07
申请号：US11394956
申请日：2006-03-31
Applicant: Kuppusamy Kanakarajan
Inventor： Kuppusamy Kanakarajan
CPC classification number: C09J179/08 , C08L77/10 , C08L2205/16 , C08L2666/20 , H05K1/0373 , H05K3/281 , H05K3/386 , H05K2201/0154 , H05K2201/0251 , H05K2201/0278 , H05K2201/068 , Y10T428/1023 , Y10T428/24917 , Y10T428/28 , Y10T428/2804 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , Y10T442/2361
Abstract: The invention is directed to polyimide based adhesives having a coefficient of thermal expansion (“CTE”) equal to or below 50 ppm/° C. The adhesives of the present invention contain a polyimide base polymer present in the overall adhesive in an amount from 25 to 95 weight percent. The polyimide base polymer has a glass transition temperature (“Tg”) in a range of from about 150 to about 300° C. and typically has a coefficient of thermal expansion above 50 ppm/° C. The polyimide based adhesives of the invention also contain an aramid micro fiber filler in an amount from 5 to 75 weight percent, based upon the total weight of the polyimide based adhesive. The fiber filler can be used to lower CTE of the overall adhesive to match (or nearly match) the CTE of other materials like metal, silicon wafers, other polymers (including polyimide) and the like.
Abstract translation: 本发明涉及具有等于或低于50ppm /℃的热膨胀系数（“CTE”）的聚酰亚胺基粘合剂。本发明的粘合剂含有总体粘合剂中聚酰亚胺基聚合物的量为25 至95重量％。 聚酰亚胺基聚合物的玻璃化转变温度（“Tg”）在约150至约300℃的范围内，并且通常具有高于50ppm /℃的热膨胀系数。本发明的聚酰亚胺基粘合剂也 基于聚酰亚胺基粘合剂的总重量，含有5至75重量％的芳族聚酰胺微纤维填料。 纤维填料可用于降低整个粘合剂的CTE以匹配（或几乎匹配）其它材料如金属，硅晶片，其它聚合物（包括聚酰亚胺）等的CTE。
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公开(公告)号：US20090291281A1
公开(公告)日：2009-11-26
申请号：US11795725
申请日：2006-01-20
Applicant: Gregory M. Hanket
Inventor： Gregory M. Hanket
CPC classification number: B32B27/20 , C08J5/18 , C08J2379/08 , H05K1/0346 , H05K1/0373 , H05K1/0393 , H05K2201/0141 , H05K2201/0154 , H05K2201/0245 , H05K2201/0251 , Y10T428/268
Abstract: The present invention comprises microfiller-reinforced polymer films. Microfiller-reinforced polymer films are films having high aspect-ratio fillers incorporated therewith, which filler have a minor dimension less that 20 μm and a major dimension at least three times greater than the minor dimension.
Abstract translation: 本发明包括微细纤维增强聚合物膜。 微填料增强聚合物膜是具有掺入其中的高纵横比填料的膜，该填料具有小于20μm的小尺寸和小尺寸至少小于次要尺寸的三倍。
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