Abstract:
Semiconductor devices can be mounted by the bump technique using compound metallic ultra-fine particles. Each particle comprises a core portion which is substantially a metallic component, with a coating layer chemically bound to the core portion, the coating layer being an organic substance. One of two bump technologies can be used to mount the semiconductor device, namely, forming under bump metals from the compound metallic ultra-fine particles, and forming ordinary solder balls on the under bump metals; or using paste balls comprising the compound metallic ultra-fine particles rather than ordinary solder balls.
Abstract:
Within a container b 2 of a spin coater 1, a rotatable support table 4 for supporting a wafer W and an arm 6 for dropping a chemical liquid onto the wafer W are arranged. Also, the spin coater 1 comprises a gas introducing path 12 for introducing a laminar flow forming gas into the container 2. The gas introducing path 12 has a glass filter 13 provided in an upper part of the container 2, whereas the laminar flow forming gas is introduced into the container 2 by way of the glass filter 13. The container 2 is provided with a wall portion 15 formed so as to continuously spread like a curve downward from a lower end edge part of the glass filter 13. As a consequence, a downflow of the laminar flow forming gas occurs in the whole horizontal section of the region surrounded by the wall portion 15 within the container 2, thereby reliably preventing turbulent flows from occurring.
Abstract:
The present invention comprises a wicket conveyor for conveying a series of wickets through pre-curing, curing and post-curing sections of a curing system. The wicket conveyor forms a continuous loop, having a straight upper track portion, a straight lower track portion and a pair of curved end portions of track that adjoin each end of the straight upper and lower track potions. Each wicket is attached to the wicket conveyor track such that the plane of the wicket is oriented at a predetermined angle. B wicket picks up a horizontally oriented sheet and carries it toward the pre-curing section. The wicket and substrate sheet are reoriented in response to the contour of the conveyor, into a near vertical planar orientation. While in the near vertical orientation, liquid coatings on the surface of the sheet substrate move down the substrate sheet in nullsheet flow,null thereby leaving a smooth coating surface prior to curing. Wickets and the substrate sheets riding the wickets are approximately parallel with one another and closely spaced in straight portions of the conveyor, such as the space during pre- and post-curing sections. Bs a wicket enters the curing section, it follows the contour of the track around the distil end of the conveyor. That wicket falls away from the next wicket on the track, thereby opening a gap between the adjacent wickets. Bt this point, both wickets and sheets are irradiated with UV rays, causing UV curable laminates to be cured on the front, rear and sides of the substrate sheets as well as all parts of the wicket conveyor and wickets. Prior to entering the post-curing section, the wicket and substrate sheet are once again reoriented into a near vertical planar orientation and approximately parallel with other wickets in the post-curing section. In the post-curing section, excess latent heat is disputed from the sheets. The sheets are then unloaded for subsequent processing.
Abstract:
A door positioning article positions a door of a motor vehicle in an ajar position with respect to the motor vehicle during coating steps of manufacture. The door positioning article includes a base. An extension is secured to the base for fastening the door positioning article to the motor vehicle. A retainer extends out from the base and holds the door in the ajar position with respect to the motor vehicle and the door positioning article. A spring extends between the base and the retainer for allowing the door to pass over the retainer and for forcing the retainer through an orifice in the door providing the defined ajar position.
Abstract:
A plasma-assisted processing apparatus comprises: a vacuum vessel defining a processing chamber, a gas supply line for carrying gases into the processing chamber, a workpiece support for supporting a workpiece, disposed in the processing chamber and serving as an electrode, a disk antenna for radiating a high-frequency wave of a frequency in the VHF or the UHF band into the processing chamber, a high-frequency waveguide for guiding a high-frequency wave to the disk antenna, and a window of a dielectric material isolating the disk antenna from the processing chamber. A conductive ring is disposed between the disk antenna and the window such that its end surface is in contact with a peripheral part of the disk antenna.
Abstract:
A method of fabricating a thin magnetic film composed of ConullNinullFe alloy, includes the step of plating an object with plating solution containing Co ions, Ni ions and Fe ions. The plating solution is kept at 20 degrees centigrade or lower while the object is being plated while the object is being plated.
Abstract:
A chucking device of the present invention includes an annular elastic member sandwiched between an upper and a lower member. A rod is slidable up and down in a bore formed in the upper and lower members and is partly positioned in the elastic member. The rod presses the elastic member radially outward when raised or lowered, thereby causing the chucking device to chuck a hollow, cylindrical base. The elastic member contacts the inner periphery of the base over a minimum of area and surely, closely contacts it for thereby implementing desirable sealing. The chucking device can therefore form a uniform film on the outer periphery of the base.
Abstract:
A silicon wafer supporting device, for supporting a silicon wafer whose underside is subjected to an evaporation process, including a plate-like element (10) and a plurality of bracket-like elements (12). These bracket-like elements (12) are selectively fixed to the plate-like element (10) and adapted to support at least one silicon wafer (2) at the silicon wafer's perimeter. This supporting device has at least one blind seat (11) which is formed at the lower surface of the plate-like element (10) and is adapted to accommodate the at least one silicon wafer (2) whose lower side is subjected to an evaporation process.
Abstract:
An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing forms a substantially closed processing chamber where processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. The housing may also be detached from the motor and moved to another location. The housing consequently serves as a processing chamber, as well as a storage or transport chamber.
Abstract:
The invention relates to a method and a device for regulating the thickness of coatings or layers, in particular of bond coatings, wherein bonding is controlled in a programmed manner thereby taking into account the influence of disturbance variables. The invention can be used especially in the production of DVDs. The advantages of the present invention are reproducible accuracy in adjusting the thickness of the coating/bond coating and thus an increased production output.