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公开(公告)号：US11879524B1
公开(公告)日：2024-01-23
申请号：US17229727
申请日：2021-04-13
CPC分类号： F16H21/06 , B81B3/0037 , F16H21/44 , G02B26/001 , G02B26/0833 , B81B2201/042 , B81B2203/053 , B81B2207/053
摘要： An actuator system can be used to adjust a position of a component in a spatial light modulator. The actuator system has a pair of actuators that are coupled together by a frame that is used to adjust the height of the component relative to the substrate. The frame includes a pair of moment arms that are coupled to the actuators and a pair of connecting arms that are coupled to the moment arms. The connecting arms are then connected together at about the center of the frame, which portion of the frame can be used to raise or lower the plate. The center of the frame can be raised or lowered by a shortening or lengthening of the connecting arms relative to each other.
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公开(公告)号：US11873215B2
公开(公告)日：2024-01-16
申请号：US17684317
申请日：2022-03-01
发明人： Enri Duqi , Marco Del Sarto , Lorenzo Baldo
CPC分类号： B81C1/00325 , B81B3/0018 , B81C99/0005 , B81C2201/112
摘要： A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.
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公开(公告)号：US11860184B2
公开(公告)日：2024-01-02
申请号：US17447876
申请日：2021-09-16
申请人： Robert Bosch GmbH
发明人： Cristian Nagel , Johannes Classen , Lars Tebje , Rolf Scheben , Rudy Eid
IPC分类号： G01P15/08 , G01P15/125 , B81B3/00
CPC分类号： G01P15/0802 , B81B3/001 , B81B3/0051 , G01P15/125 , B81B2201/0235 , B81B2203/0163 , B81B2203/04 , G01P2015/0831 , G01P2015/0862 , G01P2015/0871
摘要： A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.
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公开(公告)号：US20230406692A1
公开(公告)日：2023-12-21
申请号：US17878924
申请日：2022-08-02
发明人： Jung-Hao Chang , Weng-Yi Chen
CPC分类号： B81B3/0021 , B81C1/00158 , B81B2201/0257 , B81B2203/0127 , B81B2203/0315 , B81C2201/0132 , B81C2201/0156 , B81C2201/0176
摘要： A microelectromechanical system (MEMS) microphone includes a substrate, a membrane supported relative to the substrate, an opening extending through the entire thickness of the membrane, and a spacer disposed on the sidewall of the opening. The spacer protrudes beyond the top surface of the membrane.
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公开(公告)号：US20230403514A1
公开(公告)日：2023-12-14
申请号：US17894181
申请日：2022-08-24
发明人： Chien-Hsing Huang
CPC分类号： H04R19/04 , B81B3/001 , B81C1/00968 , H04R7/04 , H04R7/18 , H04R31/003 , H04R31/006 , B81B2201/0257 , B81B2203/0127 , B81B2203/04 , B81C2201/0109 , H04R2201/003
摘要： A MEMS capacitance microphone includes a substrate, a diaphragm, a back plate structure and a plurality of support structures. The substrate is provided with a plurality of gate structures and a cavity penetrating through the substrate, and the gate structures extend from an inner wall of the cavity to the center of the cavity. The diaphragm is vibratably arranged on one side of the substrate and includes a main deformation zone and a non-main deformation zone. The back plate structure is arranged on the diaphragm, and the diaphragm is located between the substrate and the back plate structure. The support structures are arranged on the back plate structure, penetrate the periphery of the main deformation zone, and respectively abut against the gate structures. The MEMS capacitance microphone has higher rigidity of a back plate, and is capable of greatly reducing the impedance of air to increase its signal-to-noise ratio.
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公开(公告)号：US20230393243A1
公开(公告)日：2023-12-07
申请号：US18328659
申请日：2023-06-02
申请人： nEYE Systems, Inc.
CPC分类号： G01S7/4811 , B81B2201/045 , B81B3/0083 , G01S7/4817
摘要： The present disclosure is directed to imaging LiDARs monolithic integration of focal plane switch array LiDARS with CMOS electronics. The CMOS wafer contains electronic circuits needed to control the focal plane array, e.g., digital addressing circuits and MEMS drivers, as well as circuits to amplify and process the detected signals, e.g., trans-impedance amplifiers (TIA), multi-stage amplifiers, analog-to-digital converters (ADC), digital signal processing (DSP), and circuits to communicate with external systems. Methods of use are also provided.
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公开(公告)号：US11838725B2
公开(公告)日：2023-12-05
申请号：US17566700
申请日：2021-12-31
发明人： Zhengyu Shi , Zhuanzhuan Zhao , Rui Zhang
CPC分类号： H04R19/04 , B81B3/0072 , H04R7/04 , H04R7/18 , B81B2201/0257 , B81B2203/0127 , B81B2203/0315 , H04R2201/003
摘要： The present disclosure discloses a MEMS microphone including a substrate with a back cavity, and an electric capacitance system arranged on the substrate. The electric capacitance system includes a back plate and a diaphragm opposite to the back plate. The back plate includes a body part, a fixing portion connected to the substrate, and a connecting portion connecting the body part and the fixing portion. The diaphragm is fixed to the substrate and located at a side of the back plate close to the substrate. The fixing portion includes a first surface away from the substrate, the first surface includes a first arc surface connected with the body part, the first arc surface protrudes toward a direction away from the substrate. Compared with the related art, MEMS microphone disclosed by the present disclosure has a better reliability.
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公开(公告)号：US11837425B2
公开(公告)日：2023-12-05
申请号：US17446033
申请日：2021-08-26
发明人： Hiroaki Yamazaki , Ping Wang
CPC分类号： H01H59/0009 , B81B3/0086 , B81B2201/018 , B81B2203/04 , H01H2059/0027
摘要： According to one embodiment, a MEMS element includes a first member, and an element part. The element part includes a first fixed electrode fixed to the first member, and a first movable electrode facing the first fixed electrode, a first conductive member electrically connected with the first movable electrode, and a second conductive member electrically connected with the first movable electrode. The first movable electrode is supported by the first and second conductive members to be separated from the first fixed electrode in a first state before a first electrical signal is applied between the second conductive member and the first fixed electrode. The first conductive member is separated from the first movable electrode in a second state after the first electrical signal is applied. The first movable electrode is supported by the second conductive member to be separated from the first fixed electrode in the second state.
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公开(公告)号：US11835338B2
公开(公告)日：2023-12-05
申请号：US16479442
申请日：2018-01-22
申请人： KYOCERA Corporation
发明人： Munetaka Soejima
IPC分类号： G01C19/5621 , G01C19/5656 , B81B3/00 , H10N30/03 , H10N30/30
CPC分类号： G01C19/5621 , B81B3/0018 , H10N30/03 , H10N30/302 , B81B2201/02
摘要： A sensor element includes a piezoelectric body, a plurality of excitation electrodes, and a plurality of detecting electrodes. The piezoelectric body includes a frame and a driving arm and detecting arm which extend from the frame within a predetermined plane parallel to an xy plane in an orthogonal coordinate system xyz. The excitation electrodes are located on the driving arm. The detecting electrodes are located on the detecting arm enabling detection of a signal generated by bending deformation of the detecting arm in a z-axis direction. The detecting arm includes first and second arms. The first arm extends from the frame in the predetermined plane. The second arm extends from a front end side of the first arm toward a frame side within the predetermined plane. An end part of the second arm on the frame side is formed as a free end.
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公开(公告)号：US20230388711A1
公开(公告)日：2023-11-30
申请号：US17826184
申请日：2022-05-27
CPC分类号： H04R7/06 , B81B3/0021 , H04R7/18 , H04R19/04 , B81B2201/0257 , B81B2203/0127 , B81B2203/019 , B81B2203/04 , B81B2207/07 , H04R2201/003 , H04R2410/03
摘要： Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing therethrough; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, the second region is formed by semiconductor material without doping conductive ions. Through design of the first and second membranes as the first region and the second region, respectively, the second region is formed by semiconductor material without doping conductive ions, and the first region is formed by doping conductive ions in the semiconductor material, so that the compliance performance is improved and not at risk of delamination.
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