Memory Systems and Methods for Improved Power Management

    公开(公告)号:US20170337965A1

    公开(公告)日:2017-11-23

    申请号:US15522182

    申请日:2015-11-04

    Applicant: Rambus Inc.

    CPC classification number: G11C11/4093 G11C5/04 G11C5/063 G11C7/22 G11C8/12

    Abstract: A memory module with multiple memory devices includes a buffer system that manages communication between a memory controller and the memory devices. Each memory device supports an access mode and a low-power mode, the latter used to save power for devices that are not immediately needed. The module provides granular power management using a chip-select decoder that decodes chip-select signals from the memory controller into power-state signals that determine which of the memory devices are in which of the modes. Devices can thus be brought out of the low-power mode in relatively small numbers, as needed, to limit power consumption.

    Memory component with error-detect-correct code interface

    公开(公告)号:US09823966B1

    公开(公告)日:2017-11-21

    申请号:US14527422

    申请日:2014-10-29

    Applicant: Rambus Inc.

    CPC classification number: G06F11/1076 G06F11/1048

    Abstract: A memory component internally generates and stores the check bits of error detect and correct code (EDC). In a first mode, during a read transaction, the check bits are sent to the memory controller along with the data on the data mask (DM) signal lines. In a second mode, an unmasked write transaction is defined where the check bits are sent to the memory component on the data mask signal lines. In a third mode, a masked write transaction is defined where at least a portion of the check bits are sent from the memory controller on the data signal lines coincident with an asserted data mask signal line. By sending the check bits along with the data, the EDC code can be used to detect and correct errors that occur between the memory component and the memory controller.

    THERMAL CLAMP FOR CRYOGENIC DIGITAL SYSTEMS
    809.
    发明申请

    公开(公告)号:US20170090533A1

    公开(公告)日:2017-03-30

    申请号:US15243596

    申请日:2016-08-22

    Applicant: RAMBUS INC.

    Abstract: The embodiments herein describe technologies of cryogenic digital systems with a power supply located in an ambient temperature domain and logic located in a cryogenic temperature domain. A pair of conductors is operable to carry current with a voltage difference between the power supply and the logic. The pair of conductors includes a first portion thermally coupled to a temperature-regulated or temperature-controlled intermediate temperature domain. The intermediate temperature domain is less than the ambient temperature domain and greater than the cryogenic temperature domain.

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