Abstract:
An apparatus for providing multiple screens and a method of dynamically configuring multiple screens are provided. The apparatus for providing multiple screens includes a service processing module producing at least one of logical screens and display screens for displaying a service, and an output module mapping the logical screens to arbitrary locations on the display screens and providing the display screens to a plurality of physical display devices.
Abstract:
An air conditioner is provided. The air conditioner according to an embodiment of the present invention includes: a base pan constituting a lower appearance: and a condensed water detector detecting the amount of condensed water collected on the base pan. The air conditioner according to another embodiment of the present invention includes: a base pan constituting a lower appearance; a blower unit provided at one side of the base pan to guide a flow of air; and a motor providing a fan with a rotational power, wherein a motor support supporting the motor is further installed on the base pan.
Abstract:
The present invention provides a flash memory device having a high degree of integration and high performance. The flash memory device has a double/triple gate structure where a channel is formed in a wall-shaped body. The flash memory device has no source/drain regions. In addition, although the flash memory device has the source/drain regions, the source/drain region are formed not to be overlapped with a control electrode. Accordingly, an inversion layer is induced by a fringing field generated from the control electrode, so that cell devices can be electrically connected to each other. The flash memory device includes a charge storage node for storing charges formed under the control electrode, so that miniaturization characteristics of cell device can be improved. According to the present invention, there is proposed a new device capable of improving the miniaturization characteristics of a MOS-based flash memory device and increasing memory capacity.
Abstract:
A semiconductor light emitting device includes: a substrate; a plurality of light emitting cells arranged on the substrate, each of the light emitting cells including a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer disposed therebetween to emit blue light; an interconnection structure electrically connecting at least one of the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer of the light emitting cell to at least one of the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer of another light emitting cell; and a light conversion part formed in at least a portion of a light emitting region defined by the plurality of light emitting cells, the light conversion part including at least one of a red light conversion part having a red light conversion material and a green light conversion part having a green light conversion material.
Abstract:
A molded underfill flip chip package may include a printed circuit board, a semiconductor chip mounted on the printed circuit board, and a sealant. The printed circuit board has at least one resin passage hole passing through the printed circuit board and at least one resin channel on a bottom surface of the printed circuit board, the at least one resin channel extending from the at least one resin passage hole passing through the printed circuit board. The sealant seals a top surface of the printed circuit board, the semiconductor chip, the at least one resin passage hole, and the at least one resin channel.
Abstract:
A semiconductor includes a channel region in a semiconductor substrate, a gate dielectric film on the channel region, and a gate on the gate dielectric film. The gate includes a doped metal nitride film, formed from a nitride of a first metal and doped with a second metal which is different from the first metal, and a conductive polysilicon layer formed on the doped metal nitride film. The gate may further include a metal containing capping layer interposed between the doped metal nitride film and the conductive polysilicon layer.
Abstract:
A pillar-type field effect transistor having low leakage current is provided. The pillar-type field effect transistor includes: a semiconductor body, source and drain formed in a semiconductor pillar; a gate insulating layer formed on a surface of the semiconductor body; a gate electrode formed on a surface of the gate insulating layer. The gate electrode includes a first gate electrode and a second gate electrode being electrically connected with the first gate electrode. The first gate electrode has a work function higher than that of the second gate electrode. Accordingly, the gate induced drain leakage (GIDL) can be reduced, so that an off-state leakage current can be greatly reduced.
Abstract:
In an integrated circuit (IC) chip and a flip chip package having the same, no wiring line is provided and the first electrode pad does not make contact with the wiring line in a pad area of the IC chip. Thus, the first bump structure makes contact with the first electrode regardless of the wiring line in the pad area. The second electrode pad makes contact with the wiring line in a pseudo pad area of the IC chip. Thus, the second bump structure in the pseudo pad area makes contact with an upper surface of the second electrode at a contact point(s) spaced apart from the wiring line under the second electrode.
Abstract:
Provided is a fin field effect transistor (FinFET) having low leakage current and a method of manufacturing the same. The FinFET includes: a bulk silicon substrate; a fence-shaped body formed by patterning the substrate; an insulating layer formed on a surface of the substrate to a first height of the fence-shaped body; a gate insulating layer formed at side walls and an upper surface of the fence-shaped body at which the insulating layer is not formed; a gate electrode formed on the gate insulating layer; source/drain formed at regions of the fence-shaped body where the gate electrode is not formed. The gate electrode includes first and second gate electrodes which are in contact with each other and have different work functions. Particularly, the second gate electrode having a low work function is disposed to be close to the drain. As a result, the FinFET according to the present invention increases a threshold voltage by using a material having the high work function for the gate electrode and lowers the work function of the gate electrode overlapping with the drain, so that gate induced drain leakage (GIDL) can be reduced.
Abstract:
A clutch water pump may include a pulley, a brake pad attached on an interior surface of the clutch compartment of the pulley, a clutch disk disposed corresponding to the brake pad in the clutch compartment, a hub rotatably mounted into the penetrating hole and coupled to the clutch disk through a plurality of spring pins, the plurality of spring pins connecting slidably the clutch disk to the hub, a magnetic actuator fixed to the hub and disposed to the clutch disk to selectively move the clutch disk toward or away from the brake pad, and a main shaft, one end of which is fixed to the center of the hub and the other end of which is fixed to an impeller. Furthermore, a method of controlling the clutch water pump according to the engine rotation speed, the coolant temperature, and a condition of the coolant temperature sensor is provided.