公开(公告)号：US20070085201A1

公开(公告)日：2007-04-19

申请号：US11581678

申请日：2006-10-16

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/34

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12043 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： One aspect of the invention relates to a power semiconductor device in lead frame technology and a method for producing the same. The power semiconductor device has a vertical current path through a power semiconductor chip. The power semiconductor chip has at least one large-area electrode on its top side and a large-area electrode on its rear side. The rear side electrode is surface-mounted on a lead frame chip island of a lead frame and the top side electrode is electrically connected to an internal lead of the lead frame via a connecting element. The connecting element has an electrically conductive film on a surface facing the top side electrode, the electrically conductive film extending from the top side electrode to the internal lead.

摘要翻译： 本发明的一个方面涉及引线框技术中的功率半导体器件及其制造方法。 功率半导体器件具有穿过功率半导体芯片的垂直电流路径。 功率半导体芯片在其顶侧具有至少一个大面积电极，在其后侧具有大面积电极。 背面电极被表面安装在引线框架的引线框架芯片岛上，并且顶侧电极经由连接元件电连接到引线框架的内部引线。 连接元件在面向顶侧电极的表面上具有导电膜，导电膜从顶侧电极延伸到内部引线。

公开(公告)号：US20070042568A1

公开(公告)日：2007-02-22

申请号：US11465547

申请日：2006-08-18

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L21/00

CPC分类号： H01L23/49562 ,  H01L21/3081 ,  H01L21/78 ,  H01L23/49524 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A semiconductor device with a thinned semiconductor chip and a method for producing the latter is disclosed. In one embodiment, the thinned semiconductor chip has a top side with contact areas and a rear side with a rear side electrode. In this case, the rear side electrode is cohesively connected to a chip pad of a circuit carrier via an electrically conductive layer. In another embodiment, the thinned semiconductor chips of this semiconductor device according to the invention have low-microdefect edge side regions with semiconductor element structures and edge sides patterned by etching technology.

摘要翻译： 公开了一种具有薄型半导体芯片的半导体器件及其制造方法。 在一个实施例中，变薄的半导体芯片具有具有接触区域的顶侧和具有后侧电极的后侧。 在这种情况下，后侧电极经由导电层与电路载体的芯片焊盘粘结地连接。 在另一个实施例中，根据本发明的该半导体器件的薄化半导体芯片具有具有半导体元件结构和通过蚀刻技术图案化的边缘侧的低微细边缘侧区域。

公开(公告)号：US20060208106A1

公开(公告)日：2006-09-21

申请号：US10566755

申请日：2004-06-09

申请人： Peter Boehland ,  Hans-Christoph Magel ,  Sebastian Kanne ,  Godehard Nentwig ,  Michael Bauer

发明人： Peter Boehland ,  Hans-Christoph Magel ,  Sebastian Kanne ,  Godehard Nentwig ,  Michael Bauer

IPC分类号： F02M63/00

CPC分类号： F02M47/027 ,  F02M45/086 ,  F02M63/0026 ,  F02M63/0045 ,  F02M63/0061 ,  F02M2200/46

摘要： A fuel injection device for an internal combustion engine, having two valve elements each having a hydraulic control surface acting in the closing direction and associated with a hydraulic control chamber. A control valve influences the pressure in the control chamber, and loading devices act on the valve elements in the opening direction. The valve elements react at different hydraulic opening pressures prevailing in the control chamber. The control valve is able to set at least three different pressure levels in the control chamber: all of the valve elements are closed at a comparatively high pressure level; one valve element is open at a medium pressure level; and all of the valve elements are open at a comparatively low pressure level.

摘要翻译： 一种用于内燃机的燃料喷射装置，具有两个阀元件，每个阀元件具有沿关闭方向作用并与液压控制室相关联的液压控制表面。 控制阀影响控制室中的压力，并且装载装置沿打开方向作用在阀元件上。 阀元件在控制室中存在的不同液压打开压力下反应。 控制阀能够在控制室中设置至少三个不同的压力水平：所有阀元件在相对高的压力水平下关闭; 一个阀元件在中等压力水平打开; 并且所有阀元件在相对低的压力水平下打开。

公开(公告)号：US20060192377A1

公开(公告)日：2006-08-31

申请号：US10550493

申请日：2004-04-06

申请人： Michael Bauer ,  Harald Reiner

发明人： Michael Bauer ,  Harald Reiner

IPC分类号： B42D15/00 ,  B32B38/14 ,  G09F3/10

CPC分类号： G06K19/07783 ,  G06K19/02 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/0776 ,  G06K19/07779 ,  G07D7/01

摘要： A self-adhesive security label for a data carrier, such as a security document or document of value, with a substrate (40), to the front of which security features (12-18,42) are applied and the back of which is provided with a cold adhesive foil (34). The security label contains an integrated circuit (30) disposed in a recess (36) of the adhesive foil (34) for storing security data and an antenna (32) disposed intermediate between substrate (40) and adhesive foil (34) and connected with the integrated circuit (30) for a contactless communication with the integrated circuit (30).

摘要翻译： 用于数据载体的自粘安全标签，例如具有基板（40）的安全文件或有价值的文档，其前端应用安全特征（12-18,42），其背面是 设置有冷粘合箔（34）。 安全标签包含设置在用于存储安全数据的粘合箔（34）的凹部（36）中的集成电路（30），以及设置在基板（40）和粘合箔（34）之间的天线（32），并与 用于与集成电路（30）的非接触式通信的集成电路（30）。

公开(公告)号：US20060159856A1

公开(公告)日：2006-07-20

申请号：US10538890

申请日：2003-12-15

申请人： Martin Kunz ,  Michael Bauer ,  Andreas Baranyai

发明人： Martin Kunz ,  Michael Bauer ,  Andreas Baranyai

IPC分类号： B05D3/00 ,  B29C71/04 ,  B05D1/36

CPC分类号： B05D3/144 ,  B05D1/42 ,  B05D3/067 ,  C09J5/02

摘要： The invention relates to a method for forming coatings on an inorganic or organic substrate and to substrates coated in accordance with the method. In the method: a) a low-temperature plasma, a corona discharge, high-energy radiation and/or a flame treatment is caused to act on the inorganic or organic substrate, b) 1.) at least one activatable initiator or 2.) at least one activatable initiator and at least one ethylenically unsaturated compound is/are applied in the form of a melt, solution, suspension or emulsion to the inorganic or organic substrate, there being incorporated in the activatable initiator and/or the ethylenically unsaturated compound at least one group that interacts with a subsequently applied coating or reacts with groups contained therein, with the effect of promoting adhesion, and c) the coated substrate is heated and/or is irradiated with electromagnetic waves and an adhesion promoter layer is formed, d) the substrate so pretreated is provided with the further coating which contains reactive groups that react with those of the adhesion promoter layer and/or interact with the adhesion promoter layer.

摘要翻译： 本发明涉及一种在无机或有机基材上形成涂层的方法以及根据该方法涂覆的基材。 在该方法中：a）使低温等离子体，电晕放电，高能辐射和/或火焰处理作用于无机或有机基底上，b）1）至少一种可活化的引发剂或2。 ）将至少一种可活化的引发剂和至少一种烯键式不饱和化合物以熔体，溶液，悬浮液或乳液的形式施用于无机或有机底物，其中加入可活化的引发剂和/或烯属不饱和化合物 至少一组与随后涂覆的涂层相互作用或与其中所含的基团反应，具有促进粘合作用，以及c）涂覆的基材被电磁波加热和/或照射并形成粘附促进剂层，d ），所以预处理的基材具有另外的涂层，该涂层含有与粘附促进剂层的那些反应基团和/或与粘附促进剂层相互作用的反应性基团。

公开(公告)号：US20060088954A1

公开(公告)日：2006-04-27

申请号：US10515517

申请日：2003-10-20

申请人： Michael Bauer ,  Christian Birzer ,  Gerald Ofner ,  Stephan Stoeckl

发明人： Michael Bauer ,  Christian Birzer ,  Gerald Ofner ,  Stephan Stoeckl

IPC分类号： H01L21/48 ,  H01L21/50

CPC分类号： H01L21/563 ,  H01L23/3128 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2224/16225 ,  H01L2924/00

摘要： An electronic component and a method for fabricating it is disclosed, where the component comprises a semiconductor chips which has flip-chip contacts. These contacts are fixed on a rewiring substrate, the interspace between the rewiring substrate and the semiconductor chip being filled with a thermoplastic. The glass transition temperature of the thermoplastic is above the highest operating test temperature of the component and below the melting temperature of the solder material for external contacts.

摘要翻译： 公开了一种电子部件及其制造方法，其中该部件包括具有倒装芯片触点的半导体芯片。 这些触点固定在再布线基板上，重新布线基板和半导体芯片之间的间隙被热塑性塑料填充。 热塑性塑料的玻璃化转变温度高于组件的最高工作试验温度，低于用于外部接触的焊料材料的熔化温度。

公开(公告)号：US20060073280A1

公开(公告)日：2006-04-06

申请号：US10530614

申请日：2003-10-08

申请人： Michael Bauer ,  Andreas Baranyai ,  Martin Kunz

发明人： Michael Bauer ,  Andreas Baranyai ,  Martin Kunz

IPC分类号： B05D3/00

CPC分类号： B05D7/04 ,  B05D3/0254 ,  B05D3/067 ,  B05D3/144 ,  C08J7/18

摘要： A process for forming UV absorber layers on an inorganic or organic substrate is described. That process comprises a) allowing a low-temperature plasma, a corona discharge or high-energy radiation to act on the inorganic or organic substrate, b) applying to the treated inorganic or organic substrate at least one free-radical-forming initiator and at least one UV absorber containing at least one ethylenically unsaturated group, and, optionally in the form of melts, solutions, suspensions or emulsions, at least one synergist and/or at least one ethylenically unsaturated compound, c) heating the coated substrate and/or irradiating it with electromagnetic waves. The invention relates also to a substrate provided with a UV absorber layer in accordance with that process. That process substantially eliminates vacuum conditions and excessive thermal stress or energy stress and also destruction of the UV absorber. Clear, transparent UV absorber layers that exhibit good adhesion are formed, the properties of which, such as, for example, the optical density, are advantageously controllable.

摘要翻译： 描述了在无机或有机基底上形成UV吸收层的方法。 该方法包括a）允许低温等离子体，电晕放电或高能量辐射作用于无机或有机基底上，b）向经处理的无机或有机基底施加至少一种自由基形成引发剂， 至少一种含有至少一个烯属不饱和基团的紫外线吸收剂，以及任选呈熔体，溶液，悬浮液或乳液形式的至少一种紫外线吸收剂，至少一种增效剂和/或至少一种烯属不饱和化合物，c）加热涂覆的基材和/或 用电磁波照射。 本发明还涉及一种根据该方法设置有紫外线吸收剂层的基底。 该方法基本上消除了真空条件和过度的热应力或能量应力以及UV吸收剂的破坏。 形成表现出良好粘附性的透明的紫外线吸收剂层，其特性，例如光学密度是有利的可控的。

公开(公告)号：US20060027905A1

公开(公告)日：2006-02-09

申请号：US11196497

申请日：2005-08-04

申请人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

发明人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L29/82 ,  G01N33/48

CPC分类号： G01N33/48785 ,  B01L3/502715 ,  B01L9/52 ,  B01L2200/027 ,  B01L2300/0819 ,  B01L2300/0877 ,  H01L2924/0002 ,  H01L2924/00

摘要： A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.

公开(公告)号：US20050147919A1

公开(公告)日：2005-07-07

申请号：US10502208

申请日：2003-01-27

申请人： Martin Kunz ,  Michael Bauer ,  Andreas Baranyai ,  Giorgio Macor

发明人： Martin Kunz ,  Michael Bauer ,  Andreas Baranyai ,  Giorgio Macor

IPC分类号： B05D7/24 ,  B05C9/10 ,  B05C9/12 ,  B05C9/14 ,  B05D3/00 ,  B05D3/04 ,  B05D3/06 ,  B05D3/08 ,  B05D3/14 ,  B05D5/10 ,  B05D7/00 ,  B05D7/02 ,  C08F2/46 ,  C08J7/04 ,  G03C5/00

CPC分类号： B05D7/546 ,  B05D3/067 ,  B05D3/144 ,  B05D7/02 ,  C08F2/46

摘要： The invention relates to a process and to the corresponding apparatus for the production of strongly adherent coatings on an inorganic or organic substrate, wherein in a first step: a) a low-temperature plasma, a corona discharge or a flame is caused to act on the inorganic or organic substrate, in a second step: b) one or more photoinitiators or mixtures of photoinitiators with monomers, containing at least one ethylenically unsaturated group, or solutions, suspensions or emulsions of the afore-mentioned substances, are applied at normal pressure to the inorganic or organic substrate, in a third step: c) using suitable methods those afore-mentioned substances are dried and/or irradiated with electromagnetic waves and, optionally, in a fourth step d) the substrate so pretreated is provided with a coating and the coating is cured or dried.

摘要翻译： 本发明涉及用于在无机或有机基底上生产强粘附涂层的方法和相应的装置，其中在第一步骤中：a）使低温等离子体，电晕放电或火焰作用于 无机或有机底物，在第二步中：b）在常压下施用一种或多种光引发剂或光引发剂与含有至少一个烯属不饱和基团的单体或上述物质的溶液，悬浮液或乳液的混合物 在第三步骤中：c）使用合适的方法，将上述物质用电磁波干燥和/或照射，并且任选地在第四步骤中d）将经预处理的基材设置有涂层 并且涂层被固化或干燥。

公开(公告)号：US06528594B1

公开(公告)日：2003-03-04

申请号：US09743501

申请日：2001-01-10

申请人： Michael Bauer ,  Christoph Rickert

发明人： Michael Bauer ,  Christoph Rickert

IPC分类号： C08L6702

CPC分类号： C09D163/00 ,  C08J3/122 ,  C08J3/124 ,  C09D167/00 ,  C08L61/20 ,  C08L63/00

摘要： A process for the manufacture of a flowable granulate by means of spray granulation, which comprises using as starting material a formulation in liquid form comprising (a) a substance or a mixture of substances that is in the form of a waxy or cohesive solid at room temperature, and (b) up to 20% by weight, based on the amount of component (a), of a substance having a specific surface >3 m2/g that is insoluble in component (a), yields granulates that have a narrow particle size distribution and a low dust content and that are stable to storage.

摘要翻译： 一种用于通过喷雾造粒制造可流动颗粒的方法，其包括以液体形式使用制剂作为起始原料，其包括（a）在室内呈蜡状或粘性固体形式的物质或物质的混合物 温度，和（b）基于组分（a）的量，至多20重量％的不溶于组分（a）的比表面积> 3m 2 / g的物质，得到具有窄的 粒度分布和粉尘含量低，对储存稳定。