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    Method for fabricating semiconductor packages, and structure and method for positioning semiconductor components
    81.
    发明申请
    Method for fabricating semiconductor packages, and structure and method for positioning semiconductor components 审中-公开
    制造半导体封装的方法以及用于定位半导体元件的结构和方法

    公开(公告)号：US20070141761A1

    公开(公告)日：2007-06-21

    申请号：US11703517

    申请日：2007-02-06

    申请人： Ying-Ren Lin ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    发明人： Ying-Ren Lin ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L21/00

    CPC分类号： H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A method for fabricating semiconductor packages includes the steps of: providing a plurality of substrates and a carrier having a plurality of openings, wherein, each of the substrates has at least one chip (die) disposed thereon, length and width of the substrates are approximately equal to the predefined length and width of semiconductor packages, and length and width of the openings of the carrier are bigger than length and width of the substrates; respectively positioning the substrates in the openings of the carrier and blocking the gaps between the substrates and the carrier so as to prevent the gaps from penetrating through the carrier; performing a mold press process so as to form an encapsulant on each of the openings for encapsulating the chip, wherein length and width of the area covered by the encapsulant are bigger than length and width of the opening; performing a mold releasing process; and cutting along edges of the substrates according to the predefined length and width of semiconductor packages, thereby obtaining a plurality of semiconductor packages. The present invention also discloses a structure and method for positioning the substrates.

    摘要翻译： 一种制造半导体封装的方法包括以下步骤：提供多个基板和具有多个开口的载体，其中每个基板具有设置在其上的至少一个芯片（芯片），基板的长度和宽度大致为 等于半导体封装的预定长度和宽度，载体的开口的长度和宽度大于基板的长度和宽度; 分别将基板定位在载体的开口中并阻挡基板和载体之间的间隙，以防止间隙穿透载体; 进行模压加工，以在封装芯片的每个开口上形成密封剂，其中由密封剂覆盖的区域的长度和宽度大于开口的长度和宽度; 执行脱模工艺; 并且根据半导体封装的预定长度和宽度切割基板的边缘，从而获得多个半导体封装。 本发明还公开了一种用于定位基板的结构和方法。

    METHOD FOR FABRICATING HEAT DISSIPATION PACKAGE STRUCTURE
    86.
    发明申请
    METHOD FOR FABRICATING HEAT DISSIPATION PACKAGE STRUCTURE 有权
    制造散热包装结构的方法

    公开(公告)号：US20110287587A1

    公开(公告)日：2011-11-24

    申请号：US13195617

    申请日：2011-08-01

    申请人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    发明人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L21/52

    CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/0401 ,  H01L2224/45099

    摘要： A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant. Therefore, the heat dissipation package structure is fabricated through simplified fabrication steps at low cost, and also the problem that the chip is easily damaged in a package molding process of the prior art is overcome.

    摘要翻译： 公开了一种散热封装结构及其制造方法，其包括通过其有源表面安装和电连接半导体芯片到芯片载体; 将具有散热部和支撑部的散热部件安装在所述芯片载体上，使得所述半导体芯片能够容纳在由所述散热部和所述支撑部形成的空间中，其中，所述散热部具有对应的开口 到半导体芯片; 形成密封剂以封装半导体芯片和散热构件; 并且使所述密封剂变薄以除去形成在所述半导体芯片上的所述密封剂，以从所述密封剂暴露所述半导体芯片的无效表面和所述散热部分的顶表面。 因此，通过以低成本的简化的制造步骤制造散热封装结构，并且克服了在现有技术的封装成型工艺中芯片容易损坏的问题。

    Fabrication method of multi-chip stack structure
    89.
    发明授权
    Fabrication method of multi-chip stack structure 有权
    多芯片堆叠结构的制作方法

    公开(公告)号：US07981729B2

    公开(公告)日：2011-07-19

    申请号：US12818701

    申请日：2010-06-18

    申请人： Jung-Pin Huang ,  Chin-Huang Chang ,  Chien-Ping Huang ,  Chung-Lun Liu ,  Cheng-Hsu Hsiao

    发明人： Jung-Pin Huang ,  Chin-Huang Chang ,  Chien-Ping Huang ,  Chung-Lun Liu ,  Cheng-Hsu Hsiao

    IPC分类号： H01L21/60

    CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48496 ,  H01L2224/49175 ,  H01L2224/78 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00

    摘要： A multi-chip stack structure and a fabrication method thereof are proposed, including providing a leadframe having a die base and a plurality of leads and disposing a first and a second chips on the two surfaces of the die base respectively; disposing the leadframe on a heating block having a cavity in a wire bonding process with the second chip received in the cavity of the heating block; performing a first wire bonding process to electrically connect the first chip to the leads through a plurality of first bonding wires, and forming a bump on one side of the leads connected with the first bonding wires; disposing the leadframe in an upside down manner to the heating block via the bump with the first chip and the first bonding wires received in the cavity of the heating block; and performing a second wire bonding process to electrically connect the second chip to the leads through a plurality of second bonding wires. The bump is used for supporting the leads to a certain height so as to keep the bonding wires from contacting the heating block and eliminate the need of using a second heating block in the second wire bonding process of the prior art, thereby saving time and costs in a fabrication process. Also, as positions where the first and second bonding wires are bonded to the leads on opposite sides of the leadframe correspond with each other, the conventional problems of adversely affected electrical performance and electrical mismatch can be prevented.

    摘要翻译： 提出了一种多芯片堆叠结构及其制造方法，包括提供具有芯片基底和多个引线的引线框架，并分别在模具基座的两个表面上设置第一和第二芯片; 将引线框架布置在具有引线接合工艺中的空腔的加热块上，第二芯片容纳在加热块的空腔中; 执行第一引线接合工艺，以通过多个第一接合线将第一芯片电连接到引线，以及在与第一接合线连接的引线的一侧上形成凸块; 通过第一芯片和第一接合线容纳在加热块的空腔中，通过凸块将引线框倒置放置到加热块， 以及执行第二引线接合处理，以通过多个第二接合线将所述第二芯片电连接到所述引线。 凸块用于将引线支撑到一定高度，以便使接合线不会接触加热块，并且在现有技术的第二引线接合过程中不需要使用第二加热块，从而节省了时间和成本 在制造过程中。 此外，由于第一和第二接合线与引线框架的相对侧上的引线接合的位置彼此对应，可以防止电性能和电不匹配受到不利影响的常规问题。

    Fabrication method of semiconductor package having heat dissipation device
    90.
    发明授权
    Fabrication method of semiconductor package having heat dissipation device 有权
    具有散热装置的半导体封装的制造方法

    公开(公告)号：US07759170B2

    公开(公告)日：2010-07-20

    申请号：US12710450

    申请日：2010-02-23

    申请人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    发明人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L21/00 ,  H01L23/34 ,  H05K7/20

    CPC分类号： H01L23/473 ,  H01L21/563 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253

    摘要： A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.

    摘要翻译： 提供了具有散热装置的半导体封装和半导体封装的制造方法。 芯片安装在基板上。 散热装置安装在芯片上，并且包括容纳室，以及与容纳室连通的第一开口和第二开口。 在散热装置和衬底之间形成密封剂以封装芯片。 执行切割处理以去除结构的非电气部分并且从密封剂暴露第一和第二开口。 冷却流体容纳在容纳室中以吸收和散发由芯片产生的热量。 散热装置覆盖密封剂和芯片，以为半导体封装提供最大的传热面积。