公开(公告)号：US20090315167A1

公开(公告)日：2009-12-24

申请号：US12522816

申请日：2008-01-11

申请人： Hideki Sasaki ,  Yuuki Fujimura ,  Katsumi Kikuchi

发明人： Hideki Sasaki ,  Yuuki Fujimura ,  Katsumi Kikuchi

IPC分类号： H01L23/52

CPC分类号： H01L25/0657 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/18 ,  H01L2223/6688 ,  H01L2224/05624 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device in which a plurality of semiconductor chips is stacked. A first semiconductor chip is stacked in a region, on a second semiconductor chip, in which a circuit that generates noise is not disposed within said second semiconductor chip, and a wire of a circuit that easily receives noise within said first semiconductor chip is disposed so as not to extend over said circuit that generates noise.

摘要翻译： 堆叠多个半导体芯片的半导体装置。 第一半导体芯片堆叠在第二半导体芯片上，其中产生噪声的电路不设置在所述第二半导体芯片内，并且容易接收所述第一半导体芯片内的噪声的电路的布线被布置成 因为不能在产生噪声的电路上延伸。

公开(公告)号：US07585699B2

公开(公告)日：2009-09-08

申请号：US11477111

申请日：2006-06-29

申请人： Katsumi Kikuchi ,  Tadanori Shimoto ,  Koji Matsui ,  Kazuhiro Baba

发明人： Katsumi Kikuchi ,  Tadanori Shimoto ,  Koji Matsui ,  Kazuhiro Baba

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/4857 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/81 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/20 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/44 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/0376 ,  H05K2203/061 ,  H05K2203/1536 ,  H01L2924/00

摘要： A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.

公开(公告)号：US07566834B2

公开(公告)日：2009-07-28

申请号：US12140041

申请日：2008-06-16

申请人： Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

发明人： Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

IPC分类号： H05K1/00

CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0366 ,  H05K3/205 ,  H05K3/423 ,  H05K2201/0376 ,  H05K2201/068 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less. (2) D23≧5 (3) D150≧2.5 (4) (D−65/D150)≦3.0 (5) H23≧140 (6) (H−65/H150)≦2.3.

摘要翻译： 布线板具有基底绝缘膜。 基底绝缘膜的厚度为20〜100μm，由玻璃化转变温度为150℃以上的含有玻璃或芳族聚酰胺的增强纤维的耐热性树脂构成。 当T℃温度下的弹性模量为DT（GPa）时，基体绝缘膜具有以下物理性质（1）〜（6）），在温度T℃下的断裂强度为 HT（MPa）。 （1）其厚度方向的热膨胀系数为90ppm / K以下。 （2）D23> = 5（3）D150> = 2.5（4）（D-65 / D150）<= 3.0（5）H23> = 140（6）（H-65 / H150）<= 2.3。

公开(公告)号：US20060244137A1

公开(公告)日：2006-11-02

申请号：US11477111

申请日：2006-06-29

申请人： Katsumi Kikuchi ,  Tadanori Shimoto ,  Koji Matsui ,  Kazuhiro Baba

发明人： Katsumi Kikuchi ,  Tadanori Shimoto ,  Koji Matsui ,  Kazuhiro Baba

IPC分类号： H01L23/48

CPC分类号： H01L21/4857 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/81 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/20 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/44 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/0376 ,  H05K2203/061 ,  H05K2203/1536 ,  H01L2924/00

摘要： A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.

公开(公告)号：US20050252682A1

公开(公告)日：2005-11-17

申请号：US11125158

申请日：2005-05-10

申请人： Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

发明人： Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L21/68 ,  H01L23/14 ,  H01L23/498 ,  H01L25/065 ,  H05K1/03 ,  H05K1/11 ,  H05K3/20 ,  H05K3/42

CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0366 ,  H05K3/205 ,  H05K3/423 ,  H05K2201/0376 ,  H05K2201/068 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less. (2) D23≧5 (3) D150≧2.5 (4) (D-65/D150)≦3.0 (5) H23≧140 (6) (H-65/H150)≦2.3

摘要翻译： 布线板具有基底绝缘膜。 基底绝缘膜的厚度为20〜100μm，由玻璃化转变温度为150℃以上的含有玻璃或芳族聚酰胺的增强纤维的耐热性树脂构成。 当在T℃的温度下的弹性模量为D T（GPa）时，基体绝缘膜具有以下物理性质（1）至（6））和在温度下的断裂强度 的T℃给出为H T（MPa）。 （1）其厚度方向的热膨胀系数为90ppm / K以下。 （2）D 23 = 5（3）D 150 > = 2.5（4）（D-65 / D 150 <= 3.0（5）H 23 = 140（6）（H-65 / H 150） 2.3

公开(公告)号：US06841862B2

公开(公告)日：2005-01-11

申请号：US09894123

申请日：2001-06-29

申请人： Katsumi Kikuchi ,  Tadanori Shimoto ,  Koji Matsui ,  Kazuhiro Baba

发明人： Katsumi Kikuchi ,  Tadanori Shimoto ,  Koji Matsui ,  Kazuhiro Baba

IPC分类号： H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H05K3/00 ,  H05K3/06 ,  H05K3/20 ,  H05K3/40 ,  H05K3/44 ,  H05K3/46 ,  H01L23/02 ,  H05K1/03

CPC分类号： H01L21/4857 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/81 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/20 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/44 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/0376 ,  H05K2203/061 ,  H05K2203/1536 ,  H01L2924/00

摘要： A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.

摘要翻译： 用于安装半导体芯片的半导体封装板包括具有用于在其中接收半导体芯片的开口的金属基体和层叠在金属基底上的多层布线膜。 将半导体芯片倒装芯片接合到设置在开口内的多层布线膜上的金属焊盘上。 金属基体的表面与容纳在开口中的半导体芯片的顶表面齐平。 所得的半导体器件在不使用加强件的情况下具有较大数量的外部引脚和较小的变形。

公开(公告)号：USD492254S1

公开(公告)日：2004-06-29

申请号：US29172349

申请日：2002-12-10

申请人： Yoshiyuki Nakashima ,  Katsumi Kikuchi

设计人： Yoshiyuki Nakashima ,  Katsumi Kikuchi

公开(公告)号：US06299208B1

公开(公告)日：2001-10-09

申请号：US09312606

申请日：1999-05-17

申请人： Hisao Kasahara ,  Yoshinobu Inomoto ,  Katsumi Kikuchi

发明人： Hisao Kasahara ,  Yoshinobu Inomoto ,  Katsumi Kikuchi

IPC分类号： B60R2102

CPC分类号： B60R21/045 ,  B60R7/06 ,  B60R21/205 ,  B60R2021/0051

摘要： A knee guard on the passenger side of a vehicle includes left and right knee guard brackets disposed along left and right side faces of a glove box and secured at a front end thereof to a steering support beam, a connecting member transversely connecting these left and right knee guard brackets and a closure member of the glove box. The closure member includes a reinforcement therein and the reinforcement has a closed cross section which extends in the widthwise direction of the vehicle. When the knees of a passenger abut against the closure member of the glove box in the event of a head-on impact, the closure member is displaced forwardly and abuts against the left and right knee guard brackets, thereby an impact load is transmitted to the knee guard brackets.

摘要翻译： 车辆乘客侧的护膝包括沿着手套箱的左右侧面设置的左右膝部保护支架，其前端固定在转向支撑梁上，横向连接左右两侧的连接部件 护膝支架和手套箱的关闭构件。 封闭构件在其中包括加强件，并且加强件具有在车辆的宽度方向上延伸的封闭横截面。 当乘客的膝盖在头部碰撞的情况下抵靠手套箱的关闭构件时，封闭构件向前移动并抵靠左右膝盖保护支架，从而将冲击载荷传递到 膝盖保护支架。