公开(公告)号：US07244803B2

公开(公告)日：2007-07-17

申请号：US10609453

申请日：2003-06-27

Applicant: Recai Sezi ,  Andreas Walter ,  Anna Maltenberger ,  Klaus Lowack ,  Marcus Halik

Inventor： Recai Sezi ,  Andreas Walter ,  Anna Maltenberger ,  Klaus Lowack ,  Marcus Halik

IPC: C08G63/44 ,  C08G73/22

CPC classification number: C08G69/265 ,  C08G69/26 ,  C08G69/32 ,  C08G73/22 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A dielectric for aluminum and copper metalizations is stable at high temperatures. Surprisingly, in spite of the elimination of water during the cyclization, the polymeric dielectrics are very suitable for filling narrow trenches. The filled trenches exhibit no defects and bubbles or cracks. The polybenzoxazoles have dielectric constants of k≦2.7 and are suitable as an electrical insulator. Furthermore, these materials adhere very well on all surfaces relevant for micro-electronics.

Abstract translation: 用于铝和铜金属化的电介质在高温下是稳定的。 令人惊奇的是，尽管在环化过程中消除了水，但聚合物电介质非常适用于填充窄沟槽。 填充的沟槽没有表现出缺陷和气泡或裂缝。 聚苯并恶唑的介电常数k <= 2.7，适合作为电绝缘体。 此外，这些材料在与微电子相关的所有表面上都很好地粘附。

公开(公告)号：US07211856B2

公开(公告)日：2007-05-01

申请号：US11041760

申请日：2005-01-24

Applicant: Recai Sezi ,  Andreas Walter ,  Reimund Engl ,  Anna Maltenberger ,  Joerg Schumann ,  Thomas Weitz

Inventor： Recai Sezi ,  Andreas Walter ,  Reimund Engl ,  Anna Maltenberger ,  Joerg Schumann ,  Thomas Weitz

IPC: H01L27/108 ,  H01L21/8242

CPC classification number: H01L51/0051 ,  B82Y10/00 ,  G11C13/0014 ,  G11C13/0016 ,  H01L27/285 ,  H01L51/005 ,  H01L51/0595

Abstract: Memory cells having two electrodes and a layer arranged in between and including an active material which contains hexakisbenzylthiobenzene, dichlorodicyano-p-benzoquinone and optionally a polymer are provided. Furthermore, a process for the production of the cells according to the invention is provided, as well as the novel use of a composition which can be used as active material for the memory cells.

Abstract translation: 提供具有两个电极和布置在其中并包含含有六苯基苯硫基苯，二氯二氰基对苯醌和任选的聚合物的活性材料的层的记忆单元。 此外，提供了根据本发明的细胞的制备方法，以及可用作记忆单元的活性材料的组合物的新用途。

公开(公告)号：US20060014374A1

公开(公告)日：2006-01-19

申请号：US10518880

申请日：2003-06-03

Applicant: Hans-Joachim Barth ,  Recai Sezi

Inventor： Hans-Joachim Barth ,  Recai Sezi

IPC: H01L21/4763

CPC classification number: H01L21/768 ,  H01L21/7682 ,  H01L23/5222 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a layer arrangement and to a process for producing a layer arrangement. The layer arrangement has a layer which is arranged on a substrate and includes a first subregion comprising decomposable material and a second subregion which is arranged next to the first subregion and has a useful structure comprising a non-decomposable material. Furthermore, the layer arrangement has a covering layer on the layer comprising decomposable material and the useful structure, the layer arrangement being designed in such a manner that the decomposable material can be removed from the layer arrangement.

Abstract translation: 本发明涉及层布置和用于生产层布置的方法。 层布置具有布置在基板上的层，并且包括第一子区域，其包括可分解材料，第二子区域布置在第一子区域旁边，并且具有包含不可分解材料的有用结构。 此外，层布置在包括可分解材料和有用结构的层上具有覆盖层，层布置被设计成使得可分解材料可以从层布置中移除。

公开(公告)号：US20050179033A1

公开(公告)日：2005-08-18

申请号：US11044762

申请日：2005-01-27

Applicant: Andreas Walter ,  Recai Sezi ,  Reimund Engl ,  Anna Maltenberger ,  Joerg Schumann ,  Thomas Weitz

Inventor： Andreas Walter ,  Recai Sezi ,  Reimund Engl ,  Anna Maltenberger ,  Joerg Schumann ,  Thomas Weitz

IPC: C07C211/50 ,  C07D345/00 ,  G11C11/21 ,  G11C13/00 ,  G11C13/02 ,  H01L27/24 ,  H01L27/28 ,  H01L29/08 ,  H01L35/24 ,  H01L51/30

CPC classification number: H01L51/0595 ,  B82Y10/00 ,  G11C13/0014 ,  G11C13/0016 ,  H01L27/285 ,  H01L51/0051

Abstract: A memory cell is provided which comprises two electrodes and a layer arranged in between and comprising an active material comprising (a) a compound selected from the group consisting of in which R1 and R4, independently of one another, may have the following meaning: —H, -alkyl, -aryl, -heteroaryl, —O-alkyl, —O-aryl, —O-heteroaryl, —SH, —S-alkyl, —S-aryl, —S-heteroaryl, —CO-alkyl, —CO-aryl, —CO-heteroaryl, —CS-alkyl, —CS-aryl, —CS-heteroaryl, -halogen, —CN and/or —NO2, in which R1 and R2, R2 and R3, R3 and R4 together may form a ring, (b) a compound of the general formula II: in which R5 to R7, independently of one another, may have the following meaning: —H, -alkyl, -aryl, -heteroaryl, —O-alkyl, —O-aryl, —O-heteroaryl, —NH2, —N(alkyl)2, —N(aryl)2, —N(heteroaryl)2, —SH, —S-alkyl, —S-aryl, —S-heteroaryl, —CO-alkyl, —CO-aryl, —CO-heteroaryl, —CS-alkyl, —CS-aryl, —CS-heteroaryl, -halogen, —CN and/or —NO2, in which R5 and R6 or R7 and R8 together may form a ring, and optionally (c) a polymer. A method for the production of the cells according to the invention and the novel use of a composition which can be used as active material for the memory cells are furthermore provided.

Abstract translation: 提供了一种存储单元，其包括两个电极和布置在其间并包含活性材料的层，所述活性材料包含（a）选自下组的化合物：其中R 1和R 2， 可以具有以下含义：-H， - 烷基， - 芳基， - 杂芳基，-O-烷基，-O-芳基， - O-杂芳基，-SH - ， - S-烷基， -S-芳基，-S-杂芳基，-CO-烷基，-CO-芳基，-CO-杂芳基，-CS-烷基，-CS-芳基，-CS-杂芳基， - 卤素，-CN和/或-NO 其中R 1和R 2，R 2和R 3， R 3和R 4一起可以形成环，（b）通式II的化合物：其中R 5至R 可以具有如下含义：-H， - 烷基， - 芳基， - 杂芳基， - - - 烷基，-O-芳基， - O-杂芳基， N（烷基）2，-N（芳基）2 N，-N（杂芳基）2， -SH，-S-烷基，-S-芳基，-S-杂芳基，-CO-烷基，-CO-芳基 ，-CO-杂芳基，-CS-烷基，-CS-芳基，-CS-杂芳基， - 卤素，-CN和/或-NO 2，其中R 5 和R 6或R 7和R 8一起可以形成环，和任选地（c）聚合物。 此外还提供了用于生产根据本发明的电池的方法和可用作存储器电池的活性材料的组合物的新用途。

公开(公告)号：US06900284B2

公开(公告)日：2005-05-31

申请号：US10261034

申请日：2002-09-30

Applicant: Klaus Lowack ,  Anna Maltenberger ,  Recai Sezi ,  Andreas Walter

Inventor： Klaus Lowack ,  Anna Maltenberger ,  Recai Sezi ,  Andreas Walter

IPC: C08G73/00 ,  C08G73/10 ,  C09D5/25 ,  H01B3/30 ,  H01L21/312 ,  H01L23/532 ,  C08G73/22 ,  C08G69/00

CPC classification number: H01L21/02118 ,  C08G73/00 ,  C08G73/10 ,  H01B3/305 ,  H01L21/02282 ,  H01L21/312 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: Poly-o-hydroxyamides are cyclicized to obtain polybenzoxazoles. The poly-o-hydroxyamides provide effective filling of trenches. In particular, the poly-o-hydroxyamides can fill trenches having a width of less than 100 nm and an aspect ratio of more than 4. Further, the polybenzoxazoles of the invention are very suitable for the damascene process. A dielectric can be made from the polybenzoxazole. In turn, semiconductor devices can include the dieletric. Processes for making the poly-o-hydroxyamides, polybenzoxazoles, and semiconductor devices are included.

Abstract translation: 环氧化聚邻羟基酰胺得到聚苯并恶唑。 聚邻羟基酰胺提供有效填充沟槽。 特别地，聚邻羟基酰胺可以填充宽度小于100nm，纵横比大于4的沟槽。此外，本发明的聚苯并恶唑非常适用于镶嵌工艺。 电介质可以由聚苯并恶唑制成。 反过来，半导体器件可以包括消毒的。 包括制备聚邻羟基酰胺，聚苯并恶唑和半导体器件的方法。

公开(公告)号：US06866980B2

公开(公告)日：2005-03-15

申请号：US10244839

申请日：2002-09-16

Applicant: Recai Sezi

Inventor： Recai Sezi

IPC: C07C219/34 ,  G03F7/039 ,  C03F7/004 ,  C07C215/76

CPC classification number: G03F7/0392 ,  C07C219/34 ,  C07C2603/18

Abstract: Bis-o-aminophenols, which carry on at least one of their hydroxyl groups a tert-butoxy-carbonyl group, can be reacted with dicarboxylic acids to give the corresponding poly-o-hydroxyamides. Following cyclization to the polybenzoxazole, these polymers have a lower dielectric constant than compounds prepared from corresponding poly-o-hydroxyamides which do not carry any tert-butoxycarbonyl group.

Abstract translation: 携带其羟基中至少一个叔丁氧羰基的双邻氨基苯酚可与二羧酸反应，得到相应的聚邻羟基酰胺。 环聚到聚苯并恶唑后，这些聚合物的介电常数低于不含任何叔丁氧基羰基的相应聚邻羟基酰胺制备的化合物。

公开(公告)号：US06824642B2

公开(公告)日：2004-11-30

申请号：US10206505

申请日：2002-07-26

Applicant: Andreas Walter ,  Recai Sezi

Inventor： Andreas Walter ,  Recai Sezi

IPC: C09J17900

CPC classification number: H01B3/303 ,  C08G73/22

Abstract: The following invention relates to phenyl-linked polybenzoxazoles having terminal, aryl- or heteroaryl-attached cyanate groups which can be used for adhesive bonding and as dielectrics, especially for electronic components, and to a process for preparing them.

Abstract translation: 以下发明涉及具有端基，芳基或杂芳基连接的氰酸酯基团的苯基连接的聚苯并恶唑，其可用于粘合剂粘合，并且作为电介质，特别是电子部件，以及制备它们的方法。

公开(公告)号：US06787244B2

公开(公告)日：2004-09-07

申请号：US10208422

申请日：2002-07-30

Applicant: Recai Sezi ,  Andreas Walter

Inventor： Recai Sezi ,  Andreas Walter

IPC: B32B2700

CPC classification number: C09J5/06 ,  C08G69/265 ,  C08G69/32 ,  C08L77/00 ,  C09J5/00 ,  C09J177/00 ,  C09J177/06 ,  C09J177/10 ,  C09J179/00 ,  C09J2477/00 ,  H01L24/29 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10S526/935 ,  Y10T156/10 ,  Y10T428/28 ,  Y10T428/31504 ,  Y10T428/31562 ,  Y10T428/31591 ,  Y10T428/31598 ,  Y10T428/31601 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31725 ,  H01L2924/3512 ,  H01L2924/00

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Abstract translation: 本发明描述了多羟基酰胺（PHA）用于粘合物品或材料，特别是诸如芯片和晶片的半导体工业中使用的部件的粘合剂的使用，粘合材料特别是芯片和/或晶片的方法 ，由该方法生产的芯片和/或晶片叠层以及包含式（I）的聚邻羟基酰胺的粘合剂组合物。

公开(公告)号：US06531632B2

公开(公告)日：2003-03-11

申请号：US09803762

申请日：2001-03-12

Applicant: Jörg Haussmann ,  Gerhard Maier ,  Recai Sezi

Inventor： Jörg Haussmann ,  Gerhard Maier ,  Recai Sezi

IPC: C07C21143

CPC classification number: C07D471/04 ,  C07C205/38 ,  C07C217/90 ,  C07C2603/18

Abstract: Bis-o-aminophenols and o-aminophenolcarboxylic acids have the following structures: A1 to A7 are, independently of each other, H, F, CH3, CF3, OCH3 or OCF3. T is an aromatic or heterocyclic residue. A method for preparing bis-o-aminophenols and o-aminophenolcarboxylic acids is also provided.

Abstract translation: 双邻氨基苯酚和邻氨基苯甲酸具有以下结构：A 1至A 7彼此独立地为H，F，CH 3，CF 3，OCH 3或OCF 3。 T是芳族或杂环残基。 还提供了制备双邻氨基苯酚和邻氨基苯甲酸的方法。

公开(公告)号：US06194482B1

公开(公告)日：2001-02-27

申请号：US09444740

申请日：1999-11-22

Applicant: Barbara Lehner ,  Recai Sezi

Inventor： Barbara Lehner ,  Recai Sezi

IPC: C08F248

CPC classification number: H01L21/563 ,  C08G59/18 ,  C08L63/00 ,  C08L83/08 ,  G03F7/038 ,  G03F7/0755 ,  G03F7/0757 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01055 ,  H01L2924/181 ,  Y10T428/24893 ,  Y10T428/24917 ,  C08L83/00 ,  C08L2666/14 ,  C08L2666/28 ,  C08L2666/54 ,  H01L2924/00

Abstract: UV-hardenable and thermally hardenable epoxy resins for the underfilling process in electrical and electronic components are provided. A new casting resin component has an increased storage stability at room temperature of at least 6 months and improved characteristics for the underfilling process including faster hardening and lower viscosity. Filler material with a maximum grain size of 20 &mgr;m and a siloxane component are provided in addition to the casting resin formulation.

Abstract translation: 提供了用于电气和电子部件中的底部填充工艺的UV可硬化和热可硬化环氧树脂。 新型铸塑树脂组分在室温下具有增加的至少6个月的储存稳定性和改进的底部填充工艺的特性，包括更快的硬化和较低的粘度。 除了铸塑树脂配方之外，还提供了最大粒径为20μm的填料和硅氧烷组分。