摘要:
A master-slave flip-flop circuiting having transistors connected in cascade in two stages between a power supply and ground. A clock differential amplifier, a master flip-flop, a slave flip-flop, and a waveform-shaping amplifier are all connected mutually in parallel to a power supply. High-speed operation at a minimum operation power supply voltage is achieved.
摘要:
Disclosed is a database management control system based on the client/server architecture including a client process operating on a client machine and a server process operating on a server machine, which prevents resources from remaining allocated without being properly relinquished. When a client makes a request for connection to the server, a starting order identifier notifying device notifies the server process of a starting order identifier indicating the starting order of an operating system on which the client process operates. An executing entity search device of the server process searches for executing entities under control of an executing entity control device, which are correlated to the same network address as a network address of the client machine on which the client process operates. From the executing entities searched out, a starting order identifier comparing device selects executing entities correlated to a starting order identifier older than the starting order identifier notified, and a recovery device terminates these executing entities and recovers or relinquishes resources allocated thereto. This makes it possible to recover resources remaining uselessly unavailable, when the client machine, the power of which was once turned off, is started again and the client process thereof makes a request for connection to the server process.
摘要:
A dielectric ceramic composition having the composition represented by formula (1):(BaTiO.sub.3).sub.e +(BaZrO.sub.3).sub.f +(CaTiO.sub.3).sub.g +(MgTiO.sub.3).sub.h +(R1+R2+R3+R4 ) (1)wherein e is from 60.3 to 67.5 mol %, f is from 11.9 to 15.6 mol %, q is from 15.8 to 23.0 mol %, and h is from 2.6 to 5.8 mol %, provided that the total of e, f, q, and h is 100 mol %; and R1 is from 0.05 to 0.4 wt % of NiO, R2 is from 0.05 to 0.3 wt % of CeO.sub.2, R3 is from 0.03 to 0.2 wt % of MnO, and R4 is from 0.0 to 0.25 wt % of SiO.sub.2, all based on 100 mol % in total of BaTiO.sub.3, BaZrO.sub.3, CaTiO.sub.3, and MgTiO.sub.3.
摘要:
A method of assembling a magnetic head in which a block of wear-resistant material is placed in an indentation at an upper corner of one or more core holders, over which the recording tape is to slide. Grooves are formed on lateral faces of the core holder and the wear-resistant material into which cores and shield plates are inserted. Then two core holders are abutted, with a gap between the so formed lateral faces.
摘要:
A metering light is projected onto an object to be photographed, and the reflection from the object with illumination of the metering light is analyzed to derive an electrical signal in accordance with which the focusing position of a photographic lens is adjusted. When the reflection is found to include a radiation resulting from foreign illumination which is harmonic with the pulsating frequency rate of the metering light, the output of the metering light source is modulated to a random pulsating form.
摘要:
A router bit comprises a shank and a fluted portion, for example two or four fluted bit. The two fluted bit comprises two upper cutting edges higher than a predetermined standard line and two lower cutting edges lower than the standard point. Helixes of the upper and lower cutting edges are twisted in the opposite direction relative to each other. Helix angles of the upper and lower cutting edges are equal or different in absolute angle.
摘要:
A circuit device of the present invention includes a wiring board 45, and circuit elements such as semiconductor elements 32 mounted on the wiring board 45. The wiring board 45 includes: a conductive pattern 12, which is a metal core layer; a first insulating layer 14 and a second insulating layer 16 respectively covering an upper surface and a lower surface of the conductive pattern 12; and a first wiring layer 18 and a second wiring layer 20 formed respectively on an upper surface of the first insulating layer 14 and a lower surface of the second insulating layer 16. The conductive pattern 12 is made of rolled metal. With this configuration, the thermal resistance of the conductive pattern 12, which is the metal core, is reduced, and the thermal dissipation of the entire device can be improved.
摘要:
It is intended to provide a vacuum pump so that without upsizing the vacuum pump, noise and vibration are reduced, heat dissipation property is secured, and the casing is downsized. Therefore, at least one turning part is provided in an exhausting path formed in a casing body. The casing body is formed of a material whose thermal conductivity is higher than that of a rotor and vanes, and a cylinder part where the vanes slide is press fitted in the casing body.
摘要:
A method of manufacturing a circuit device includes the steps of preparing a conductive foil, forming conductive patterns in convex shapes by forming an isolation trench on a surface of the conductive foil, covering the surface of the conductive foil with a resin film so as to form the resin film covering the isolation trench thicker than the resin film covering upper surfaces of the conductive patterns, exposing the upper surfaces of the conductive patterns out of the resin film by removing the resin film, electrically connecting the conductive pattern exposed out of the resin film to a circuit element, forming sealing resin to seal the circuit element, and removing a rear surface of the conductive foil until the conductive patterns are mutually isolated.
摘要:
After a trench 54 is formed in a conductive foil 60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being inverted, the conductive foil 60 is polished on the insulating resin 50 as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths 51 and the circuit elements 52 are supported by the insulating resin 50, without the use of the support substrate. And the interconnects L1 to L3 requisite for the circuit are formed, and can be prevented from slipping because of the curved structure 59 and a visor 58.