摘要:
A method for the fabrication of a semiconductor device is characterized by a series of steps comprising successively forming a trench in a field region of monosilicon substrate and forming an oxidation-preventive layer and a silicon layer in the trench, and oxidizing the silicon layer into a field oxide film to produce a channel stop region beneath the trench in the substrate. The method alternatively comprises forming a trench having a small pattern in a field region of a monosilicon substrate, sequentially forming an oxidation-preventive layer and a silicon layer on the surface of the trench, and oxidizing the silicon layer and the substrate of a field region having a large pattern size, at the same time, to produce a field oxide film and channel stop diffusion regions below both the trench and the field oxide film having a large pattern. Such channel stop diffusion regions contribute to minimizing the redistribution of channel stop ions in the monosilicon substrate below both the trench and the field oxide film having a large pattern. In addition, the channel stop diffusion region restrains stress caused by oxidation of the monosilicon substrate and improves the insulation properties of the field region.
摘要:
A power down circuit for a memory device is provided that includes a burn-in voltage detector to generate a burn-in voltage detecting signal to control a power down signal when a burn-in voltage reaches a predetermined level. The power down circuit enhances a burn-in function by operating the memory cells and peripheral circuits for a relatively long time at a high level voltage when a burn-in is performed on the memory device with an auto power down function. Thus, the memory device reliability is also enhanced. The memory device includes a power down timer for generating a power down signal to control an input/output operation of a memory cell in response to a plurality of address transition detecting signals, a plurality of data input detecting signals, a chip select detecting signal, a write mode detecting signal and the burn-in voltage detecting signal.
摘要:
A nonvolatile memory cell includes a floating gate; a programming region, having a first current path to the floating gate, for programming by providing charge carriers to the floating gate through the first current path or extracting charge carriers stored in the floating gate; and a verification region, having a second current path separated from the first current path, for verifying the charge amount of the floating gate through the second current path during programming.
摘要:
A storage element for a semiconductor device in accordance with preferred embodiments exhibit less noise and consumes less power with faster speed. A first circuit maintains a first storage node at a same signal level of a previous state when an input signal at an input electrode transits from one of (i) first signal level to second signal level and (ii) third signal level to second signal level. The first circuit includes a first plurality of transistors coupled to the input electrode, and a first pair of transistors coupled to said first plurality of transistors and coupled to each other at the first storage node. A second circuit, coupled to said first circuit, changes a condition of said first storage node to one of (i) first signal level when the input signal transits from the second signal level to the first signal level and (ii) third signal level when the input signal transits from the second signal level to the third signal level.
摘要:
A thin film transistor includes a substrate, a gate electrode formed on the substrate, and including opposing edge portions and a middle portion. An insulating film is formed on the surface of the gate electrode having a greater thickness on one of the gate edge portions. An active region is formed on the surface of the insulating film and the exposed substrate. The active region includes an off-set region, a channel region, a source region, and a drain region.
摘要:
A semiconductor memory device includes a semiconductor substrate of a first conductivity-type, a first electrode formed on the semiconductor substrate for charging/discharging charges, a second electrode formed on the first electrode for controlling charging/discharging and data reading/writing of the first electrode, and a charge input/output stage formed on the semiconductor substrate on at least one side of the second electrode for supplying charges.
摘要:
A charge coupled device and a method of manufacturing a charged coupled device includes a semiconductor substrate, a plurality of photoelectrical conversion cells formed in the semiconductor substrate in a matrix form, a plurality of vertical charge coupled device regions formed between the plurality of photoelectrical conversion cells, a plurality of stripe layers formed on the semiconductor substrate and corresponding to the plurality of vertical charge coupled device regions, and a plurality of microlenses formed on the semiconductor substrate and corresponding to the plurality of photoelectrical conversion cells.
摘要:
A method for forming an interconnection of a semiconductor device, includes the steps of forming an insulating layer on a substrate on which a lower conductive layer is formed, selectively removing the insulating layer to form a first connecting hole and a second connecting hole for the pattern of an upper conductive layer, growing a first conductive material in the first connecting hole to form a buried plug and then depositing a second conductive material on the surface of the insulating layer to form a barrier layer, and depositing a third conductive material on the barrier layer to fill the second connecting hole and then patterning it to form an upper conductive layer.
摘要:
A data output control circuit for a semiconductor memory device sequentially transmits input data via a main amplifier controlled by an address transition detecting signal, a multiplex/latch unit, a data output buffer and an output operator. The data output control circuit prevents false data output, which also improves data processing speed by using a control signal. The data output control circuit includes an output control unit that converts an address transition detecting signal into a kill signal. The kill signal is applied to the data output buffer to cause the output operator to generate a zero level signal based on the address transition detecting signal. The data output control circuit enables the output operator to generate a zero level signal by applying the kill signal to the data output buffer when the transition of an address signal is detected. Accordingly, an interval for a data reversal or a full swing is prevented to enhance data processing speed and reduce current consumption.
摘要:
A semiconductor fabrication method for forming an insulation film and a first anti-oxidation film sequentially on a substrate which is sectioned into each of a peri region and a cell region. An active pattern is formed in the cell region and a first field ion-implanted region in a first conductive well of the cell region. Side wall spacers are formed on each side wall of the active pattern in the cell region. An active pattern is formed in the peri region by selectively etching the first anti-oxidation film and the insulation film so as to expose a certain surface portion of the peri region substrate therethrough. A first field ion-implanting region is formed in a first conductive well of the peri region by ion-implanting highly concentrated first conductive impurities through the exposed substrate and a second field ion-implanted region in a second conductive well of the peri region. Lastly, a field oxide layer created using a field oxidation process after removing the first anti-oxidation film, the insulation film and the side wall spacers. The method beings by forming a semiconductor device which eliminates double hump phenomenon, decreases leakage current and lowers stand-by current to improve the operating properties of the device.