公开(公告)号：US20090133906A1

公开(公告)日：2009-05-28

申请号：US12273634

申请日：2008-11-19

申请人： Jae Myung BAEK

发明人： Jae Myung BAEK

IPC分类号： H05K1/02 ,  H05K3/36

CPC分类号： H05K1/0218 ,  H05K1/0259 ,  H05K1/0393 ,  H05K3/281 ,  H05K2201/0715 ,  H05K2201/09109 ,  H05K2201/09236 ,  H05K2201/09481 ,  Y10T29/49126

摘要： A flexible printed circuit board (FPCB) and FPCB manufacturing method that improves a signal transfer characteristic at a high speed. The FPCB includes an insulating layer having a signal pattern that transfers signals, a cover layer formed on the signal pattern, and a shielding layer formed at a position opposite to the signal pattern. The shielding layer faces at least one of the insulating layer and the cover layer across anspace formed there between.

摘要翻译： 一种柔性印刷电路板（FPCB）和FPCB制造方法，其高速地改善信号传递特性。 FPCB包括具有传递信号的信号图案的绝缘层，形成在信号图案上的覆盖层，以及形成在与信号图案相对的位置处的屏蔽层。 屏蔽层面对绝缘层和覆盖层中的至少一个穿过其间形成的空间。

公开(公告)号：US20080136021A1

公开(公告)日：2008-06-12

申请号：US11856867

申请日：2007-09-18

申请人： Chih-kuang Yang

发明人： Chih-kuang Yang

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/142 ,  H05K3/361 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  Y10T428/31678 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section.

摘要翻译： 公开了一种制造多层基板的混合结构的方法。 该方法包括以下步骤：将与相应电介质层的边界区连接的至少一个金属层的边界区域与相邻的金属层和相邻的电介质层分别用于每个多层基板并连接金属层的金属层的分离边界 一个多层基板，具有另一多层基板的金属层的分离边界区域，以形成连接部分。 所述混合结构至少包括第一多层基板和第二多层基板。 至少一个第一金属层与至少一个第二金属层连接以形成连接部分。

公开(公告)号：US07371970B2

公开(公告)日：2008-05-13

申请号：US10731390

申请日：2003-12-08

申请人： Jeffrey D. Flammer ,  Robert Forcier

发明人： Jeffrey D. Flammer ,  Robert Forcier

IPC分类号： H05K1/03

CPC分类号： H05K3/4691 ,  H05K1/0278 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/0061 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09109 ,  H05K2201/09536 ,  H05K2201/09745 ,  H05K2203/1572 ,  H05K2203/302 ,  Y10T29/49126

摘要： A rigid-flex circuit board system that can be manufactured using less expensive and more reliable rigid circuit board methods and equipment, and can maintain rigidity and dimensional stability until the time when it is first desired to flex.

摘要翻译： 可以使用更便宜和更可靠的刚性电路板方法和设备制造的刚性 - 柔性电路板系统，并且可以保持刚性和尺寸稳定性，直到首次需要弯曲时为止。

公开(公告)号：US20060198994A1

公开(公告)日：2006-09-07

申请号：US11365887

申请日：2006-03-02

申请人： Yoshiharu Itahana ,  Junji Nakamura ,  Akio Sawabe

发明人： Yoshiharu Itahana ,  Junji Nakamura ,  Akio Sawabe

IPC分类号： B32B3/00

CPC分类号： H01L23/3735 ,  H01L23/5386 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09109 ,  H05K2203/0545 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

摘要： A ceramic circuit substrate and a manufacturing method thereof are provided, which has excellent thermal shock tolerance by forming a gap between a circuit pattern section and a ceramic substrate, and has a capability to prevent etchant residue from remaining therein. The ceramic circuit substrate according to the present invention includes patterns of brazing material 8 and 9 formed on the ceramic substrate, a circuit pattern section jointed onto the pattern of brazing material; wherein the pattern of brazing material includes a line pattern along the edge of the circuit pattern, and a gap is formed within the line pattern located between the ceramic substrate and the circuit pattern.

摘要翻译： 提供一种陶瓷电路基板及其制造方法，其通过在电路图案部和陶瓷基板之间形成间隙而具有优异的耐热冲击性，并且具有防止蚀刻残渣残留的能力。 根据本发明的陶瓷电路基板包括形成在陶瓷基板上的钎焊材料8和9的图案，连接到钎焊材料图案上的电路图形部分; 其中钎焊材料的图案包括沿着电路图案的边缘的线图案，并且在位于陶瓷基板和电路图案之间的线图案内形成间隙。

公开(公告)号：US07082679B2

公开(公告)日：2006-08-01

申请号：US10969407

申请日：2004-10-20

申请人： Bum-Young Myoung ,  Dek-Gin Yang ,  Dong-Kuk Kim

发明人： Bum-Young Myoung ,  Dek-Gin Yang ,  Dong-Kuk Kim

IPC分类号： H05K3/36

CPC分类号： H05K3/4691 ,  H05K3/281 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0141 ,  H05K2201/0394 ,  H05K2201/09109 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917

摘要： Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the recent requirements of electric appliances for low energy consumption, high frequency adoption, and slimness.

摘要翻译： 公开了一种刚性柔性PCB和一种用于制造刚挠柔PCB的方法。 通过使用液晶聚合物在柔性区域上形成覆盖层的特征是，全层处理方法具有防止层间分层的优点，从而提供高度可靠的刚性柔性PCB，从而满足近来对电器的要求低 能源消耗，高频率采用和纤细性。

公开(公告)号：US20060019075A1

公开(公告)日：2006-01-26

申请号：US10969407

申请日：2004-10-20

申请人： Burn-Young Myoung ,  Dek-Gin Yang ,  Dong-Kuk Kim

发明人： Burn-Young Myoung ,  Dek-Gin Yang ,  Dong-Kuk Kim

IPC分类号： B32B15/00

CPC分类号： H05K3/4691 ,  H05K3/281 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0141 ,  H05K2201/0394 ,  H05K2201/09109 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917

摘要： Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the recent requirements of electric appliances for low energy consumption, high frequency adoption, and slimness.

公开(公告)号：US06972962B2

公开(公告)日：2005-12-06

申请号：US10444703

申请日：2003-05-23

申请人： Kazuo Fujii ,  Yoshihisa Ishihara ,  Aaron M. Stewart

发明人： Kazuo Fujii ,  Yoshihisa Ishihara ,  Aaron M. Stewart

IPC分类号： G06F1/16 ,  G06F1/18 ,  H01R13/11 ,  H01R13/115 ,  H01R43/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K7/10

CPC分类号： H01R13/112 ,  H01R43/0207 ,  H05K1/141 ,  H05K3/281 ,  H05K3/30 ,  H05K2201/09109 ,  H05K2203/0271

摘要： In part, and in addition to apparatus and methods presented, an expansion board to be connected/disconnected to/from its mother board easily is provided. A face of a CDC (Communication Daughter Card), which is an expansion board to be connected to the mother board of a computer system is covered by an insulating sheet. In the CDC, an edge of one end of this insulating sheet is extended so as to form a projection. A user can take this projection with fingers, thereby carrying and connecting/disconnecting the CDC to/from the mother board easily.

摘要翻译： 部分地，除了所提出的装置和方法之外，还提供了容易地与母板连接/断开的扩展板。 作为连接到计算机系统的母板的扩展板的CDC（通信子卡）的面由绝缘片覆盖。 在CDC中，该绝缘片的一端的边缘延伸以形成突起。 用户可以用手指取出投影，从而轻松地携带和连接/断开CDC与母板的连接/断开。

公开(公告)号：US20040101696A1

公开(公告)日：2004-05-27

申请号：US10448431

申请日：2003-05-30

发明人： Kazuhiro Yamazaki ,  Tetsuro Sato

IPC分类号： B32B015/08

CPC分类号： H05K1/162 ,  B32B15/08 ,  H05K1/0256 ,  H05K3/0052 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09109 ,  H05K2201/09309 ,  Y10T428/31678

摘要： The present invention provides a double-sided copper clad laminate which enables the interlayer withstand voltage of a copper clad laminate used for the formation of a capacity layer to be more easily measured and a method for manufacturing this double-sided copper clad laminate. The invention is based on the use of a double-sided copper clad laminate 1a, etc. in which copper foil is clad to both sides of a dielectric layer, wherein the copper foil shape on both sides of the double-sided copper clad laminate is in an analogous relation, with the size of first copper foil 2 on one side being smaller than that of second copper foil 4 on the other side, the first copper foil 2 and the second copper foil 4 being disposed concentrically via the dielectric layer 3, and wherein a peripheral portion of an edge end of the side of the double-sided copper clad laminate to which the first copper foil 2 is clad has a dielectric region in which the dielectric layer is exposed.

摘要翻译： 本发明提供一种双面覆铜层压板，其能够容易地测量用于形成电容层的覆铜层压板的层间耐电压，以及制造该双面覆铜层压板的方法。 本发明基于使用铜箔包覆在电介质层的两侧的双面铜箔层叠体1a等，其中双面覆铜层压板的两侧的铜箔形状为 以类似的关系，第一铜箔2的一侧的尺寸小于另一侧的第二铜箔4的尺寸，第一铜箔2和第二铜箔4通过电介质层3同心地设置， 并且其中，所述第一铜箔2被包覆的所述双面铜箔层叠体的所述侧面的边缘端部的周边部分具有其中所述电介质层露出的电介质区域。

公开(公告)号：US20040066640A1

公开(公告)日：2004-04-08

申请号：US10444703

申请日：2003-05-23

申请人： International Business Machines Corporation

发明人： Kazuo Fujii ,  Yoshihisa Ishihara ,  Aaron M. Stewart

IPC分类号： H05K001/11 ,  H05K001/14

CPC分类号： H01R13/112 ,  H01R43/0207 ,  H05K1/141 ,  H05K3/281 ,  H05K3/30 ,  H05K2201/09109 ,  H05K2203/0271

摘要： In part, and in addition to apparatus and methods presented, an expansion board to be connected/disconnected to/from its mother board easily is provided. A face of a CDC (Communication Daughter Card), which is an expansion board to be connected to the mother board of a computer system is covered by an insulating sheet. In the CDC, an edge of one end of this insulating sheet is extended so as to form a projection. A user can take this projection with fingers, thereby carrying and connecting/disconnecting the CDC to/from the mother board easily.

摘要翻译： 部分地，除了所提出的装置和方法之外，还提供了容易地与母板连接/断开的扩展板。 作为连接到计算机系统的母板的扩展板的CDC（通信子卡）的面由绝缘片覆盖。 在CDC中，该绝缘片的一端的边缘延伸以形成突起。 用户可以用手指取出投影，从而轻松地携带和连接/断开CDC与母板的连接/断开。

公开(公告)号：US20030202329A1

公开(公告)日：2003-10-30

申请号：US10444193

申请日：2003-05-23

申请人： International Business Machines Corporation

发明人： Kazuo Fujii ,  Yoshihisa Ishihara ,  Aaron M. Stewart

IPC分类号： H05K007/20

CPC分类号： H01R13/112 ,  H01R43/0207 ,  H05K1/141 ,  H05K3/281 ,  H05K3/30 ,  H05K2201/09109 ,  H05K2203/0271

摘要： In part, and in addition to apparatus and methods presented, an expansion board to be connected/disconnected to/from its mother board easily is provided. A face of a CDC (Communication Daughter Card), which is an expansion board to be connected to the mother board of a computer system is covered by an insulating sheet. In the CDC, an edge of one end of this insulating sheet is extended so as to form a projection. A user can take this projection with fingers, thereby carrying and connecting/disconnecting the CDC to/from the mother board easily.

摘要翻译： 部分地，除了所提出的装置和方法之外，还提供了容易地与母板连接/断开的扩展板。 作为连接到计算机系统的母板的扩展板的CDC（通信子卡）的面由绝缘片覆盖。 在CDC中，该绝缘片的一端的边缘延伸以形成突起。 用户可以用手指取出投影，从而轻松地携带和连接/断开CDC与母板的连接/断开。