公开(公告)号：US20190239352A1

公开(公告)日：2019-08-01

申请号：US16261793

申请日：2019-01-30

Applicant: Sumitomo Osaka Cement Co., Ltd

Inventor： Norikazu MIYAZAKI ,  Kei KATOU ,  Toshio KATAOKA

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/11 ,  G02F1/0121 ,  H04B10/27 ,  H04B10/516 ,  H05K1/0243 ,  H05K1/028 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10462

Abstract: A transmission line has a signal electrode formed on one surface of a flexible printed circuit, and a ground electrode formed on the other surface of the flexible printed circuit. A connection terminal has signal terminals formed on both the surfaces of the flexible printed circuit and electrically connected to each other through a via hole, and ground terminals formed on both the surfaces of the flexible printed circuit and electrically connected to each other through the via hole. The signal terminal on the surface, on which the ground electrode is formed, is formed such that at least a width in an end portion on the transmission line side is narrower than a width of a part of the signal terminal on the surface, on which the signal electrode is formed, to be at the same position when the flexible printed circuit is seen in a plan view.

公开(公告)号：US09564698B2

公开(公告)日：2017-02-07

申请号：US14714916

申请日：2015-05-18

Applicant: Autoliv ASP, Inc.

Inventor： Boris G. Karasik ,  William M. Leach

IPC: H05K7/12 ,  H01R12/70 ,  H05K1/18

CPC classification number: H01R12/7076 ,  H01R12/724 ,  H01R13/719 ,  H05K1/18 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/10015 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/105 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10962

Abstract: An assembly provides a dual function for mounting a port connector on a circuit board and also secures a capacitor to the circuit board. The assembly includes the circuit board and a monolithic plastic frame having a flange, a snap structure, a capacitor cradle, and a socket section. The flange has a fastening structure for fastening the frame to the circuit board. The snap structure for a snap-in attachment of the port connector to the frame is arranged near an end edge of the circuit board. The capacitor cradle for holding a cylindrical capacitor is formed adjacent to the snap structure and is elevated from the circuit board by an air gap. The socket section bears socket contacts for receiving capacitor contact leads.

Abstract translation: 组件提供了用于将端口连接器安装在电路板上并且还将电容器固定到电路板的双重功能。 组件包括电路板和具有凸缘，卡扣结构，电容器支架和插座部分的整体式塑料框架。 凸缘具有用于将框架紧固到电路板的紧固结构。 用于端口连接器到框架的卡扣附接的卡扣结构布置在电路板的端部边缘附近。 用于保持圆柱形电容器的电容器支架邻近卡扣结构形成，并且通过气隙从电路板升高。 插座部分用于接收电容器接触引线的插座触点。

公开(公告)号：US20150080737A1

公开(公告)日：2015-03-19

申请号：US14549364

申请日：2014-11-20

Applicant: SAMSUNG MEDISON CO., LTD.

Inventor： Gil Ju JIN ,  Jung Lim PARK ,  Jae Yk KIM

IPC: A61B8/00

CPC classification number: A61B8/4494 ,  A61B8/00 ,  A61B8/4461 ,  A61B8/4483 ,  B06B1/0622 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/055 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10462 ,  Y02P70/613

Abstract: Probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract translation: 探头包括换能器，具有经由面对面接触而与换能器接触的图案部分的PCB以及将换能器接合到PCB的图案部分的接合构件。 PCB的接合部分设置有图案部分以增加接合部分的接合面积，并且允许接合部件不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善接合 传感器和PCB之间的力。 结果，换能器可以可靠地结合到PCB，使得可以防止换能器的性能由于PCB和换能器之间的不良连接而劣化。

公开(公告)号：US08451617B2

公开(公告)日：2013-05-28

申请号：US12847276

申请日：2010-07-30

Applicant: Chun-Kong Chan ,  Chi Ching Chen

Inventor： Chun-Kong Chan ,  Chi Ching Chen

IPC: H05K1/18 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/18 ,  H05K1/0231 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10757 ,  H05K2201/2018

Abstract: An integrated circuit board includes a bridging filtering capacitor, a bypass capacitor, a thermistor, and a varistor. The integrated circuit board further includes an electrolytic capacitor set having a plurality of electrolytic capacitors, which are arranged in parallel and adjacent to each other, and a mounting frame for grouping the electrolytic capacitors. The present invention uses the above elements to reduce the vertical height, the horizontal width, and the occupied area. Therefore, the overall dimension of the circuit board can be reduced to make the electronic devices smaller, especially for thin electronic devices such as LCD TVs and screens.

Abstract translation: 集成电路板包括桥接滤波电容器，旁路电容器，热敏电阻器和变阻器。 集成电路板还包括具有彼此平行并相邻布置的多个电解电容器的电解电容器组和用于分组电解电容器的安装框架。 本发明使用上述元件来减小垂直高度，水平宽度和占用面积。 因此，可以减小电路板的整体尺寸，使电子装置更小，特别是对于液晶电视和屏幕等薄型电子设备。

公开(公告)号：US20120268908A1

公开(公告)日：2012-10-25

申请号：US13533698

申请日：2012-06-26

Applicant: Gil Ju JIN ,  Jung Lim Park ,  Jae Yk Kim

Inventor： Gil Ju JIN ,  Jung Lim Park ,  Jae Yk Kim

IPC: H05K7/06

CPC classification number: A61B8/4494 ,  A61B8/00 ,  A61B8/4461 ,  A61B8/4483 ,  B06B1/0622 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/055 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10462 ,  Y02P70/613

Abstract: Disclosed herein arc a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract translation: 本文公开了一种印刷电路板（PCB）和包括该电路板的探针。 探头包括换能器，具有经由面对面接触与换能器接触的图案部分的PCB以及将换能器接合到PCB的图案部分的接合构件。 PCB的接合部分设置有图案部分以增加接合部分的接合面积，并且允许接合部件不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善接合 传感器和PCB之间的力。 结果，换能器可以可靠地结合到PCB，使得可以防止换能器的性能由于PCB和换能器之间的不良连接而劣化。

公开(公告)号：US08228143B2

公开(公告)日：2012-07-24

申请号：US12588955

申请日：2009-11-03

Applicant: Satoshi Takano

Inventor： Satoshi Takano

IPC: H01H51/22

CPC classification number: H01H50/047 ,  H01H50/14 ,  H01H2050/044 ,  H05K1/18 ,  H05K3/308 ,  H05K2201/10053 ,  H05K2201/10462 ,  H05K2201/10818

Abstract: An assembly including an electromagnetic relay and a circuit board. The electromagnetic relay includes a body having a lateral surface and a bottom surface, and a plurality of terminals protruding outward from the lateral surface of the body. The terminals respectively have distal portions extending beyond the bottom surface of the body. The circuit board is provided with a relay-mount surface. The electromagnetic relay is mounted on the relay-mount surface in an orientation such that the bottom surface of the body is opposed to the relay-mount surface, and the distal portions of the terminals being fixed to the circuit board. Each terminal is formed from a flat plate element and has a shape angled in a width direction of the flat plate element. The body has a height defined in a direction orthogonal to the relay-mount surface of the circuit board and corresponding to a length of a shortest edge of the lateral surface, the shortest edge being shorter than any of edges of the bottom surface.

Abstract translation: 包括电磁继电器和电路板的组件。 电磁继电器包括具有侧表面和底表面的主体，以及从主体的侧表面向外突出的多个端子。 端子分别具有延伸超出主体底表面的远端部分。 电路板设有继电器安装面。 电磁继电器以使得本体的底面与继电器安装面相对的方向安装在继电器安装面上，端子的前端部固定在电路基板上。 每个端子由平板元件形成，并且具有在平板元件的宽度方向上成角度的形状。 主体具有与电路板的继电器安装表面正交的方向上的高度，并且与侧表面的最短边缘的长度相对应，其最短边缘比底面的任何边缘短。

公开(公告)号：US07965146B2

公开(公告)日：2011-06-21

申请号：US12574006

申请日：2009-10-06

Applicant: Manabu Ito

Inventor： Manabu Ito

IPC: H03L1/04

CPC classification number: H03L1/04 ,  H03L1/022 ,  H05K1/0201 ,  H05K1/18 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10462 ,  H05K2203/165

Abstract: A constant-temperature type crystal oscillator includes: a crystal unit; an oscillator output circuit; a temperature control circuit; and a circuit substrate, on which circuit elements are installed. A principal surface of the crystal unit is installed so as to face one side board plane of the circuit substrate with interposing a first heat conducting resin, and the heating resistors are installed to be thermally coupled to the crystal unit via a second heat conducting resin. The principal surface of the crystal unit adheres to the one side board plane of the circuit substrate with interposing the first heat conducting resin. The heating resistors are installed on the one side board plane of the circuit substrate so as to sandwich the lead wires including a portion between the pair of lead wires of the crystal unit, and the heating resistors surround an outer circumference of the crystal unit.

Abstract translation: 恒温型晶体振荡器包括：晶体单元; 振荡器输出电路; 温度控制电路; 以及电路基板，其上安装有电路元件。 通过插入第一导热树脂将晶体单元的主表面安装成面对电路基板的一个侧板平面，并且加热电阻器被安装成经由第二导热树脂热耦合到晶体单元。 晶体单元的主表面通过插入第一导热树脂粘附到电路基板的一个侧板平面。 加热电阻器安装在电路基板的一个侧板平面上，以将包括晶体单元的一对引线之间的部分的引线夹在一起，并且加热电阻器围绕晶体单元的外周。

公开(公告)号：US07877867B2

公开(公告)日：2011-02-01

申请号：US12117126

申请日：2008-05-08

Applicant: Yoshihiro Kawamura

Inventor： Yoshihiro Kawamura

IPC: H05K3/30

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/10015 ,  H05K2201/10462 ,  H05K2201/10598 ,  H05K2201/2036 ,  H05K2203/0191 ,  H05K2203/0588 ,  Y10T29/43 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A resist having a predetermined thickness is formed on a printed circuit board except for portions of the printed circuit board that oppose a convex portion of a component when the component is mounted on the printed circuit board. A silk screen printed layer having a predetermined thickness is formed on the resist. Thereafter, a concave portion of the component is bonded to the silk screen printed layer using double coated tape having a predetermined thickness. The component is mounted such that the convex portions of the component oppose the portions of the printed circuit board that do not have a resist formed thereon. The sum of the thicknesses of the resist, the silk screen printed layer and the double coated tape is larger than a height difference between the concave portion and the convex portion of the component.

Abstract translation: 具有预定厚度的抗蚀剂形成在印刷电路板上，除了当该部件安装在印刷电路板上时，印刷电路板的与部件的凸部相对的部分。 在抗蚀剂上形成具有预定厚度的丝网印刷层。 此后，使用具有预定厚度的双面胶带将该部件的凹部与丝网印刷层结合。 该部件被安装成使得该部件的凸出部分与印刷电路板上没有形成抗蚀剂的部分相对。 抗蚀剂，丝网印刷层和双面胶带的厚度之和大于该部件的凹部与凸部之间的高度差。

公开(公告)号：US07797663B2

公开(公告)日：2010-09-14

申请号：US11696659

申请日：2007-04-04

Applicant: Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

Inventor： Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

IPC: G06F17/50

CPC classification number: G01R31/2818 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/0262 ,  H05K1/0268 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3457 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0367 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/10333 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

Abstract: Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (μVia) having a conductive dome disposed above the outer layer pad of the μVia. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.

Abstract translation: 提供了使用高密度互连（HDI技术）访问在印刷电路板（PCB）的内层上的导电迹线上路由的高速信号的方法和装置。 导电迹线可以耦合到具有设置在μVia的外层焊盘上方的导电圆顶的微孔（μVia）。 与使用电镀通孔（PTH）技术的常规测试点相比，在线测试（ICT）固定装置或高速测试探头可与导电圆顶接口以测试具有降低的反射损耗和其他寄生效应的高速信号。

公开(公告)号：US07791901B2

公开(公告)日：2010-09-07

申请号：US11805603

申请日：2007-05-24

Applicant: Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

Inventor： Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

IPC: H05K7/02 ,  H05K7/04

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the circuit board area under the mounting surface of the carrier is available for the placement of smaller non-temperature-sensitive components. The off-board components are mounted on the component-mounting surface of the carrier, and the carrier may include support features for providing additional mechanical support for the components. Electrical leads for electrically coupling the elevated components to the circuit board may be insert-molded in the carrier, or may be inserted into plated through-holes in the carrier.

Abstract translation: 一种悬挂式安装装置包括一个绝缘载体，用于使板状或表面安装部件脱离安装，特别是大的温度敏感的分立元件如电容器。 载体具有相对于电路板升高的部件安装表面，并且相对于电路板定位，使得载体安装表面下方的电路板区域可用于放置较小的非温度 - 敏感组件。 脱离板部件安装在载体的部件安装表面上，并且载体可以包括用于为部件提供额外的机械支撑的支撑特征。 用于将升高的部件电耦合到电路板的电引线可以嵌入成型在载体中，或者可以插入载体中的电镀通孔中。