公开(公告)号：US20150202857A1

公开(公告)日：2015-07-23

申请号：US14591339

申请日：2015-01-07

申请人： DISCO CORPORATION

发明人： Hiroshi Morikazu ,  Tasuku Koyanagi ,  Shin Tabata

IPC分类号： B32B43/00

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B2457/14 ,  Y10T156/1137 ,  Y10T156/1184 ,  Y10T156/1906 ,  Y10T156/1939 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1972

摘要： A separation apparatus for separating a composite substrate formed from a first substrate and a second substrate joined together includes an exfoliation unit for advancing into a boundary region between the first substrate and the second substrate of the composite substrate supported by a supporting face of a supporting base and a side face supporting unit to exfoliate the composite substrate into the first substrate and the second substrate. The exfoliation unit includes a wedge portion for advancing into the boundary region between the first substrate and the second substrate, an exfoliation member having a gas outlet open at a tip end of the wedge portion, and an exfoliation member advancing and retracting unit for advancing and retracting the wedge portion of the exfoliation member to and from the boundary region between the first substrate and the second substrate which configure the composite substrate.

摘要翻译： 用于分离由第一基板和第二基板形成的复合基板的分离装置包括：剥离单元，用于前进到由支撑基座的支撑面支撑的复合基板的第一基板和第二基板之间的边界区域 以及侧面支撑单元，用于将复合基板剥离成第一基板和第二基板。 剥离单元包括用于前进到第一基板和第二基板之间的边界区域的楔形部分，具有在楔形部分的尖端处开口的气体出口的剥离构件，以及用于推进的剥离构件前进和后退单元， 将剥离构件的楔形部分从构造复合衬底的第一衬底和第二衬底之间的边界区域缩回。

公开(公告)号：US20150060933A1

公开(公告)日：2015-03-05

申请号：US14468808

申请日：2014-08-26

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Masakatsu OHNO ,  Kohei YOKOYAMA ,  Satoru IDOJIRI ,  Hisao IKEDA ,  Yasuhiro JINBO ,  Hiroki ADACHI ,  Yoshiharu HIRAKATA ,  Shingo EGUCHI

IPC分类号： H01L51/52 ,  H01L51/56 ,  H01L27/32 ,  B08B5/02 ,  B08B5/04

CPC分类号： B65G49/068 ,  B32B17/06 ,  B32B37/025 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/00 ,  B32B2457/14 ,  B32B2457/20 ,  B65G49/069 ,  B65G2249/04 ,  B65H3/0816 ,  B65H3/48 ,  B65H16/00 ,  B65H35/0006 ,  H01L21/673 ,  H01L21/67333 ,  H01L21/67715 ,  H01L21/68 ,  H01L27/3244 ,  H01L51/5237 ,  H01L51/56 ,  H01L2221/68318 ,  H01L2227/323 ,  Y10T29/53091 ,  Y10T29/5317 ,  Y10T156/1121 ,  Y10T156/1137 ,  Y10T156/1158 ,  Y10T156/1184 ,  Y10T156/1917 ,  Y10T156/1922 ,  Y10T156/1939 ,  Y10T156/1967

摘要： An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.

摘要翻译： 提供了一种用于提供具有干净表面的支撑件的装置。 或者，提供一种用于制造包括支撑体的堆叠的装置和其一个表面层被分离的被处理构件的剩余部分。 包括定位部分，狭缝形成部分和剥离部分。 定位部设置有包括支撑体和隔板的层叠膜的第一传送机构和用于固定层叠膜的台。 狭缝形成部设置有能够形成不通过隔板的狭缝的切割器。 剥离部设置有第二传送机构和剥离机构，其使隔板延伸，然后剥离隔膜。 此外，包括激活支撑表面的预处理部分。

公开(公告)号：US20150059986A1

公开(公告)日：2015-03-05

申请号：US14468801

申请日：2014-08-26

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Ryu KOMATSU ,  Kohei YOKOYAMA ,  Masakatsu OHNO ,  Satoru IDOJIRI ,  Hisao IKEDA ,  Yasuhiro JINBO ,  Hiroki ADACHI ,  Yoshiharu HIRAKATA ,  Shingo EGUCHI ,  Daiki NAKAMURA

IPC分类号： B26D3/28 ,  B32B38/00 ,  B32B38/10 ,  B26D1/14

CPC分类号： B26D3/282 ,  B26D3/08 ,  B26F1/3826 ,  C03B33/027 ,  C03B33/037 ,  C03B33/07 ,  G02F1/1303 ,  Y02P40/57 ,  Y10T83/0281 ,  Y10T156/1051 ,  Y10T156/1082 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1168 ,  Y10T156/1195 ,  Y10T156/12 ,  Y10T156/1348 ,  Y10T156/1788 ,  Y10T156/1793 ,  Y10T156/1928 ,  Y10T156/1933 ,  Y10T156/1939 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1994

摘要： A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.

摘要翻译： 提供一种用于形成分离起始点的装置，其允许分离加工部件的表面层以形成剩余部分。 提供了一种包括支撑体的堆叠的制造装置和其表面层被分离的处理的构件的剩余部分。 用于形成分离起点的装置包括支撑加工构件的台，面向台的切割器，支撑切割器的头部，支撑头部的臂部，以及使切割器相对移动的移动机构 到舞台。

公开(公告)号：US20140367015A1

公开(公告)日：2014-12-18

申请号：US13920541

申请日：2013-06-18

申请人： Infineon Technologies AG

发明人： Mathias VAUPEL ,  Kurt GEHRING ,  Kian Pin QUECK

IPC分类号： H01L21/78 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L21/78 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/67098 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/10 ,  Y10T156/1121 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1911 ,  Y10T156/1922 ,  Y10T156/1939

摘要： An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.

摘要翻译： 用于从晶片分离半导体器件的实施例方法包括使用对半导体器件施加可调节的粘合力的载体，并通过对载体施加机械或声学冲击而从载体上移除半导体器件。

公开(公告)号：US08715802B2

公开(公告)日：2014-05-06

申请号：US12488444

申请日：2009-06-19

申请人： Pao-Ming Tsai ,  Liang-You Jiang ,  Yu-Yang Chang ,  Hung-Yuan Li

发明人： Pao-Ming Tsai ,  Liang-You Jiang ,  Yu-Yang Chang ,  Hung-Yuan Li

IPC分类号： B32B7/00 ,  B32B3/10 ,  B32B7/04 ,  B32B7/06 ,  B32B7/12 ,  B32B37/12 ,  B32B38/00 ,  B32B38/04 ,  B32B38/10 ,  B32B38/12 ,  H01L21/70 ,  H01L21/77

CPC分类号： H01L21/6835 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/1266 ,  H01L2221/68381 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1158 ,  Y10T156/1195 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/149 ,  Y10T428/1495 ,  Y10T428/24612 ,  Y10T428/24752 ,  Y10T428/24942

摘要： The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.

摘要翻译： 本发明提供了一种用于柔性电子装置的转移装置和用于制造柔性电子装置的方法。 用于柔性电子器件的转移装置包括载体衬底。 释放层设置在载体基底上。 粘合层设置在载体基底的一部分上，围绕释放层并且邻近释放层的侧壁。 柔性电子器件设置在剥离层和粘合层上，其中柔性电子器件包括柔性衬底。

公开(公告)号：US20140008022A1

公开(公告)日：2014-01-09

申请号：US13936298

申请日：2013-07-08

申请人： Kyung-Hyun AHN ,  Jin-Han PARK ,  Dong-Sul KIM ,  Byung-Chul LEE

发明人： Kyung-Hyun AHN ,  Jin-Han PARK ,  Dong-Sul KIM ,  Byung-Chul LEE

IPC分类号： B29C69/00

CPC分类号： B29C69/006 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/20 ,  Y10T156/1132 ,  Y10T156/1137 ,  Y10T156/1174 ,  Y10T156/1939 ,  Y10T156/195 ,  Y10T156/1956 ,  Y10T156/1978

摘要： A delamination apparatus that includes a stage to which a lower support, an acceptor substrate disposed on the lower support, and a donor film laminated with the lower support along the edge of the acceptor substrate, interposing the acceptor substrate therebetween are mounted. The delamination apparatus further includes a first gripper disposed in an end side of the stage to move an end of the donor film to a direction far away from the acceptor substrate by gripping the end of the donor film; and a first peeling roll disposed on the donor film to support the donor film disposed between the acceptor substrate and the first gripper, and rotating itself to a direction of the first gripper.

摘要翻译： 一种分层装置，其包括下部支撑体，设置在下部支撑体上的受主基板和沿着受主基板的边缘与下部支撑体层叠的供体膜，在其间插入受体基板的阶段。 分层装置还包括设置在台架的端侧的第一夹持器，通过夹持施主膜的端部将施主膜的端部移动到远离受主基板的方向; 以及第一剥离辊，其设置在供体膜上以支撑设置在受主基板和第一夹持器之间的供体膜，并且将其自身旋转到第一夹持器的方向。

公开(公告)号：US20130327484A1

公开(公告)日：2013-12-12

申请号：US14000625

申请日：2012-03-16

申请人： Osamu Hirakawa ,  Masaru Honda

发明人： Osamu Hirakawa ,  Masaru Honda

IPC分类号： B32B43/00

CPC分类号： B32B43/006 ,  B32B38/10 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67748 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1933 ,  Y10T156/1939 ,  Y10T156/1972

摘要： A method includes: a first step of disposing the superposed substrate at a position where the superposed substrate is not in contact with a first holding unit and a second holding unit in a space between the first holding unit and the second holding unit, and supplying an inert gas into the space; a second step of thereafter relatively moving the first holding unit and the second holding unit in the vertical direction, and holding the processing target substrate by the first holding unit and holding the supporting substrate by the second holding unit; and a third step of thereafter relatively moving the first holding unit and the second holding unit in the horizontal direction while heating the processing target substrate held by the first holding unit and the supporting substrate held by the second holding unit, to separate the processing target substrate and the supporting substrate from each other.

摘要翻译： 一种方法包括：第一步骤，将叠置的基板设置在第一保持单元和第二保持单元之间的空间中与第一保持单元和第二保持单元不接触的位置处， 惰性气体进入空间; 其特征在于，使所述第一保持单元和所述第二保持单元沿垂直方向相对移动，并且通过所述第一保持单元保持所述处理对象基板，并且通过所述第二保持单元保持所述支撑基板; 以及第三步骤，在对由第一保持单元保持的处理对象基板和由第二保持单元保持的支撑基板进行加热的同时使水平方向相对移动第一保持单元和第二保持单元，以分离处理对象基板 和支撑基板。

公开(公告)号：US08263231B2

公开(公告)日：2012-09-11

申请号：US12513910

申请日：2007-11-08

申请人： Robert Mesa

发明人： Robert Mesa

IPC分类号： B32B27/42 ,  B05D3/00 ,  C08K3/20 ,  C08K3/34 ,  C08K3/36 ,  C08K3/40

CPC分类号： C09D5/20 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1168 ,  Y10T428/31942

摘要： Methods and compositions are provided for protecting exterior surfaces of automobiles and other products, or components of products, against abrasion, abrasive dust, water, acid rain, etc. The methods involve applying to a surface a protective coating composition comprising a polyvinyl butyrate emulsion and a relatively inert extender. The emulsion is dried to form a water-resistant protective coating that can be removed from the underlying surface by peeling when no longer desired.

摘要翻译： 提供了用于保护汽车和其他产品或产品部件的外表面的方法和组合物，以防磨损，研磨粉尘，水，酸雨等。该方法涉及向表面施加包含聚丁酸乙烯酯乳液的保护性涂料组合物， 相对惰性的增量剂。 将乳液干燥以形成防水保护涂层，当不再需要时，可以通过剥离从下面的表面除去乳液。

公开(公告)号：US07909959B2

公开(公告)日：2011-03-22

申请号：US10553177

申请日：2004-04-14

申请人： Toshio Tada ,  Yohei Nishimura ,  Katsunori Toyoshima ,  Juichi Fukatani ,  Tadahiko Yoshioka

发明人： Toshio Tada ,  Yohei Nishimura ,  Katsunori Toyoshima ,  Juichi Fukatani ,  Tadahiko Yoshioka

IPC分类号： B32B38/10

CPC分类号： H01L21/6835 ,  B32B17/1099 ,  B32B43/006 ,  C08J11/04 ,  C09J5/00 ,  C09J2205/302 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2224/81052 ,  H01L2224/81801 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/3025 ,  Y02P20/143 ,  Y02W30/70 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1928

摘要： It is an object of the invention to provide a separation method of an adherend capable of easily and reliably separating an adherend stuck using an adhesive, a method for recovering an electronic part from an electronic part laminate, and a separation method of laminate glass.The invention provides a separation method of an adherend, which is a method of separating an adherend stuck by using an adhesive, and comprises the steps of: air-tightly sealing the adherend together with a fluid being a gas at a normal temperature and normal pressure in a pressure resistant container, making the inside of the pressure resistant container in a high pressure state, and releasing the pressure of the inside of the pressure resistant container.

摘要翻译： 本发明的目的是提供一种能够容易且可靠地分离使用粘合剂粘贴的被粘物的被粘物的分离方法，电子部件层叠体的电子部件的回收方法以及层叠玻璃的分离方法。 本发明提供了一种被粘物的分离方法，该方法是通过使用粘合剂分离粘附的被粘物的方法，包括以下步骤：将被粘物与常温常压气体一起气密地密封 在耐压容器中，使耐压容器的内部处于高压状态，并且释放耐压容器的内部的压力。

公开(公告)号：US20100167075A1

公开(公告)日：2010-07-01

申请号：US12513910

申请日：2007-11-08

申请人： Robert Mesa

发明人： Robert Mesa

IPC分类号： B32B27/42 ,  B05D3/00 ,  B32B43/00 ,  C09D1/00 ,  C08K3/26 ,  C08K3/34 ,  C08K3/40 ,  C08K3/36 ,  C08L1/00 ,  C08K3/30 ,  C09D5/00

CPC分类号： C09D5/20 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1168 ,  Y10T428/31942

摘要： Methods and compositions are provided for protecting exterior surfaces of automobiles and other products, or components of products, against abrasion, abrasive dust, water, acid rain, etc. The methods involve applying to a surface a protective coating composition comprising a polyvinyl butyrate emulsion and a relatively inert extender. The emulsion is dried to form a water-resistant protective coating that can be removed from the underlying surface by peeling when no longer desired.

摘要翻译： 提供了用于保护汽车和其他产品或产品部件的外表面的方法和组合物，以防磨损，研磨粉尘，水，酸雨等。该方法涉及向表面施加包含聚丁酸乙烯酯乳液的保护性涂料组合物， 相对惰性的增量剂。 将乳液干燥以形成防水保护涂层，当不再需要时，可以通过剥离从下面的表面除去乳液。