公开(公告)号：US06927077B2

公开(公告)日：2005-08-09

申请号：US10704753

申请日：2003-11-12

申请人： Tae-Min Eom ,  Yu-Sin Yang ,  Kwan-Woo Ryu ,  Park-Song Kim ,  Sang-Mun Chon ,  Sun-Yong Choi ,  Chung-Sam Jun

发明人： Tae-Min Eom ,  Yu-Sin Yang ,  Kwan-Woo Ryu ,  Park-Song Kim ,  Sang-Mun Chon ,  Sun-Yong Choi ,  Chung-Sam Jun

IPC分类号： H01L21/66 ,  G01R31/303 ,  G01R31/311 ,  H01L21/00 ,  G01N21/00 ,  G01R31/302

CPC分类号： G01R31/303 ,  G01R31/311

摘要： An apparatus for measuring contamination of a semiconductor substrate includes a chuck for loading a substrate, a position detection means for recognizing a front surface of the loaded substrate to obtain position data of a portion of the substrate to be measured, a first driving part for moving the chuck in accordance with the position data to measure a rear portion of the substrate, and a surface measurement means disposed under the chuck for selectively measuring metal contamination of the substrate at the rear portion of the substrate. In operation, the substrate is loaded onto a chuck, position data of a portion of the substrate to be measured is obtained by recognizing patterns formed on the substrate, the substrate is then moved in accordance with the position data to measure a rear portion of the substrate, and metal contamination is selectively measured at the rear portion of the substrate.

摘要翻译： 一种用于测量半导体衬底的污染的装置，包括用于装载衬底的卡盘，位置检测装置，用于识别所加载的衬底的前表面，以获得要测量的衬底的一部分的位置数据，用于移动的第一驱动部件 所述卡盘根据位置数据来测量所述基板的后部;以及表面测量装置，设置在所述卡盘下方，用于选择性地测量所述基板的后部处的所述基板的金属污染。 在操作中，将基板装载到卡盘上，通过识别形成在基板上的图案来获得要测量的基板的一部分的位置数据，然后根据位置数据移动基板，以测量基板的后部 衬底和金属污染物在衬底的后部被选择性地测量。

公开(公告)号：US20050163915A1

公开(公告)日：2005-07-28

申请号：US11087280

申请日：2005-03-22

申请人： Robert Baumann

发明人： Robert Baumann

IPC分类号： A61M36/14 ,  G01R31/26 ,  G01R31/302 ,  G11C7/00 ,  G11C11/00 ,  G11C29/00 ,  G21K5/02

CPC分类号： G21K5/02

摘要： The present invention pertains to radiation sources that mimic radiation environment(s) encountered by packaged semiconductor devices. The sources are suitable for use in test systems operative to test for soft error and/or failure rates in devices sensitive to such radiation. The radiation is highly active to exacerbate soft error rates and thereby accelerate testing and reduce test times. The sources are also relatively uniformly distributed within a medium to simulate the direction(s) and energy spectra of radiation that would actually be encountered by semiconductor devices in device operation.

公开(公告)号：US06919716B1

公开(公告)日：2005-07-19

申请号：US10229665

申请日：2002-08-28

申请人： Kevin Buehler

发明人： Kevin Buehler

IPC分类号： G01R19/00 ,  G01R31/302 ,  G01R31/305 ,  G01R31/308 ,  H03F3/08 ,  H04B10/158

CPC分类号： H03F3/08 ,  H04B10/6911

摘要： Precision measurement of optical signal power is provided. In one implementation, a Wilson current mirror senses current through an avalanche photodiode (APD) that has been exposed to the optical signal. The output of this APD may also be used to recover data. By incorporating a high voltage transistor as the buffer, the Wilson current mirror is able to operate in series with the APD at a high bias level.

摘要翻译： 提供光信号功率的精确测量。 在一个实施方案中，威尔逊电流镜通过暴露于光信号的雪崩光电二极管（APD）感测电流。 该APD的输出也可用于恢复数据。 通过结合高电压晶体管作为缓冲器，威尔逊电流镜能够以高偏置电平与APD串联工作。

公开(公告)号：US20050140367A1

公开(公告)日：2005-06-30

申请号：US10974694

申请日：2004-10-28

申请人： Kiyoshi Nikawa

发明人： Kiyoshi Nikawa

IPC分类号： G01N27/72 ,  G01R31/302 ,  G01R31/311 ,  G01R33/02 ,  G01R33/12

CPC分类号： G01R31/311

摘要： In a nondestructive and noncontact analysis system for analyzing and evaluating an object, a light beam generation/modulation apparatus emits a modulated and focused light beam to thereby irradiate the object, and the modulation of the modulated and focused light beam is carried out with a modulation signal synchronized with a reference signal composed of a series of regular pulses. A magnetism detection apparatus detects a magnetic field, which is generated by an electric current induced by irradiating the object with the modulated and focused light beam, to thereby produce a magnetic field signal. A signal extraction circuit extracts a phase difference signal between the reference signal and the magnetic field signal. An image data production system produces phase difference image data based on the phase difference signal.

摘要翻译： 在用于分析和评估物体的非破坏性和非接触分析系统中，光束产生/调制装置发射调制和聚焦的光束，从而照射物体，调制和聚焦的光束的调制是通过调制 信号与由一系列规则脉冲组成的参考信号同步。 磁检测装置检测由通过用调制聚焦光束照射物体而产生的电流产生的磁场，从而产生磁场信号。 信号提取电路提取参考信号和磁场信号之间的相位差信号。 图像数据生成系统基于相位差信号生成相位差图像数据。

公开(公告)号：US06900645B2

公开(公告)日：2005-05-31

申请号：US10863704

申请日：2004-06-08

申请人： Keizo Yamada

发明人： Keizo Yamada

IPC分类号： G01B15/00 ,  G01N23/225 ,  G01N27/00 ,  G01R1/06 ,  G01R31/02 ,  G01R31/302 ,  G01R31/305 ,  G01R31/307 ,  G01R31/311 ,  H01J37/28 ,  H01L21/66

CPC分类号： G01R31/307 ,  G01R31/2853

摘要： A defective position of a sample to be tested is detected by irradiating the test sample and another test sample with electron beam while scanning the test samples, storing values of current generated in the test samples correspondingly to electron beam irradiation positions as current waveforms and comparing the current waveforms.

公开(公告)号：US06894519B2

公开(公告)日：2005-05-17

申请号：US10121130

申请日：2002-04-11

申请人： William H. Howland

发明人： William H. Howland

IPC分类号： G01R1/073 ,  G01R1/067 ,  G01R31/28 ,  G01R31/302 ,  H01L21/66 ,  G01R31/26

CPC分类号： G01R31/2648 ,  G01R1/06738 ,  G01R31/312

摘要： An apparatus for measuring an electrical property of a semiconductor wafer includes a probe having an electrically conductive tip formed at least in part of a material that is transparent to light and a probe guard disposed adjacent the electrically conductive tip. The apparatus includes a device for selectively applying a first electrical stimulus between a semiconductor wafer and the electrically conductive tip of each probe when it is positioned in spaced relation to the semiconducting material forming the semiconductor wafer, and a device for selectively applying a second electrical stimulus between the semiconductor wafer and the probe guard of each probe. A device for measuring a response of the semiconductor wafer to the electrical stimuli and for determining from the response at least one electrical property thereof is provided. A light source can be positioned to selectively emit light through the transparent material toward the semiconductor wafer.

摘要翻译： 一种用于测量半导体晶片的电性能的装置包括具有至少部分由光透明的材料形成的导电尖端的探针和邻近导电尖端设置的探针护罩。 该装置包括一种用于在半导体晶片和每个探针的导电尖端之间选择性地施加第一电刺激的装置，当其与形成半导体晶片的半导体材料间隔开时，以及用于选择性地施加第二电刺激 在每个探针的半导体晶片和探针护罩之间。 提供了一种用于测量半导体晶片对电刺激的响应并根据响应确定其至少一种电特性的装置。 光源可以被定位成选择性地通过透明材料朝向半导体晶片发射光。

公开(公告)号：US20050099190A1

公开(公告)日：2005-05-12

申请号：US10996194

申请日：2004-11-22

申请人： Jiping Li ,  Peter Borden

发明人： Jiping Li ,  Peter Borden

IPC分类号： G01N21/55 ,  G01R31/307 ,  G01R31/26 ,  G01R31/302 ,  H01L21/66

CPC分类号： G01N21/55 ,  G01R31/307

摘要： A sidewall or other feature in a semiconductor wafer is evaluated by illuminating the wafer with at least one beam of electromagnetic radiation, and measuring intensity of a portion of the beam reflected by the wafer. Change in reflectance between measurements provides a measure of a property of the feature. The change may be either a decrease in reflectance or an increase in reflectance, depending on the embodiment. A single beam may be used if it is polarized in a direction substantially perpendicular to a longitudinal direction of the sidewall. A portion of the energy of the beam is absorbed by the sidewall, thereby to cause a decrease in reflectance when compared to reflectance by a flat region. Alternatively, two beams may be used, of which a first beam applies heat to the feature itself or to a region adjacent to the feature, and a second beam is used to measure an increase in reflectance caused by an elevation in temperature due to heat transfer through the feature. The elevation in temperature that is measured can be either of the feature itself, or of a region adjacent to the feature.

公开(公告)号：US06870379B1

公开(公告)日：2005-03-22

申请号：US10164739

申请日：2002-06-06

申请人： Brennan V. Davis ,  Victoria J. Bruce ,  Michael R. Bruce ,  Rosalinda M. Ring ,  David H. Eppes

发明人： Brennan V. Davis ,  Victoria J. Bruce ,  Michael R. Bruce ,  Rosalinda M. Ring ,  David H. Eppes

IPC分类号： G01R31/311 ,  G01R31/302 ,  G01R31/26

CPC分类号： G01R31/311

摘要： Analysis of a semiconductor die is enhanced by the stimulation the die and the detection of a response to the stimulation. According to an example embodiment of the present invention, a semiconductor die is analyzed using indirect stimulation of a portion of the die, and detecting a response therefrom. First, selected portion of circuitry within the die is stimulated. The stimulation of the selected portion induces a second portion of circuitry within the die to generate an external emission. The emission is detected and the die is analyzed therefrom. In one particular implementation, a response from the selected portion is inhibited from interfering with the detection of the emission from the second portion of circuitry.

摘要翻译： 通过刺激模具和检测对刺激的响应来增强半导体管芯的分析。 根据本发明的示例性实施例，使用间接刺激芯片的一部分并且从其检测响应来分析半导体管芯。 首先，刺激模具内的电路的选定部分。 所选部分的刺激引起管芯内的电路的第二部分以产生外部发射。 检测发射并从中分析模具。 在一个具体实现中，来自所选择的部分的响应被禁止干扰来自电路的第二部分的发射的检测。

公开(公告)号：US06861863B2

公开(公告)日：2005-03-01

申请号：US09926347

申请日：2001-02-16

申请人： Shogo Ishioka ,  Tatuhisa Fujii

发明人： Shogo Ishioka ,  Tatuhisa Fujii

IPC分类号： G01R1/06 ,  G01R1/04 ,  G01R31/02 ,  G01R31/28 ,  G01R31/302 ,  H01L21/66 ,  H01R31/02

CPC分类号： G01R1/0433 ,  G01R1/0483 ,  G01R31/2886

摘要： An inspection apparatus is provided capable of adequately positioning an inspection chip to a conductive pattern as an inspection object. For connecting an electrode pad 1b of an inspection chip 1 with a lead 2a of a package 2, bump electrodes 3 and 4 are first provided at the inspection chip and at the package, respectively. Then, an anisotropic conductor 5 is provided to cover between the bump electrodes 3 and 4, and a conductor film 6 is provided on the anisotropic conductor 5 to extend between the bump electrodes 3 and 4. The anisotropic conductor 5 is thermo-compression bonded to provide an electrical connection between the conductor film 6 and the bump electrodes 3 and 4. This structure may provide a desirable surface of the inspection chip 1 having a sufficiently reduced thickness.

摘要翻译： 提供一种能够将检查芯片适当地定位到作为检查对象的导电图案的检查装置。 为了将检查芯片1的电极焊盘1b与封装2的引线2a连接起来，首先在检查芯片和封装处设置凸起电极3和4。 然后，提供各向异性导体5以覆盖凸起电极3和4之间，并且在各向异性导体5上设置导体膜6以在凸起电极3和4之间延伸。各向异性导体5被热压接合到 在导体膜6和凸起电极3和4之间提供电连接。该结构可以提供具有足够减小的厚度的检查芯片1的期望表面。

公开(公告)号：US20050017739A1

公开(公告)日：2005-01-27

申请号：US10919667

申请日：2004-08-16

申请人： Steven Hamren ,  Daniel Cram

发明人： Steven Hamren ,  Daniel Cram

IPC分类号： G01R1/04 ,  H05K3/32 ,  G01R31/302 ,  G01R31/02

CPC分类号： G01R1/0408 ,  G01R1/0433 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/321 ,  H01L2224/29099 ,  H01L2224/05599

摘要： Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are temporarily attached to the die carrier in singulated form to enable testing the dice with conventional contact technology. The die carrier may include a flex circuit base substrate and a rigid support frame. Further embodiments comprise materials and methods for attaching the semiconductor dice to the die carrier and for providing a temporary electrical connection with the semiconductor dice during testing. Exemplary materials for providing the temporary electrical connection may comprise a conductive film or tape, a conductive or conductor-filled epoxy, resin or RTV adhesive-based materials, a water-soluble material impregnated with a conductive filler or non-reflowed solder paste.

摘要翻译： 为半导体器件的处理和测试提供了改进的方法和设备。 一个实施例包括用于一个或多个具有非常细间距的电I / O（输入/输出）元件的半导体管芯的管芯载体。 半导体裸片以单一形式临时附接到模具载体，以便能够用常规接触技术测试骰子。 模具载体可以包括柔性电路基底基板和刚性支撑框架。 另外的实施例包括用于将半导体管芯附接到管芯载体并用于在测试期间提供与半导体管芯的临时电连接的材料和方法。 用于提供临时电连接的示例性材料可以包括导电膜或带，导电或导体填充的环氧树脂或基于RTV粘合剂的材料，浸渍有导电填料或非回流焊膏的水溶性材料。