摘要:
A cylinder pressure sensor is adapted to detect a cylinder pressure by detecting a change in the amount of light being transmitted through an optical fiber in an axial direction. Two support portions support the optical fiber at two points along the length thereof. A diaphragm in contact with the optical fiber causes bending of the optical fiber in dependence upon a change in the cylinder pressure. The position at which a force is applied against the optical fiber by the diaphragm is deviated from a center position between the two support portions. The resulting cylinder pressure sensor is capable of accurately measuring cylinder pressure and knocking over a long period of time with a low cost and reduced initial variations.
摘要:
A semiconductor substrate has a major surface, another major surface on the opposite side of the first major surface, a strain gauge stripe formed in the central portion of the second major surface by diffusing an impurity therein, and electrodes connected to the strain gauge stripes. These strain gauge stripes are spaced from the peripheral edge of the second major surface by a distance greater than 1/3 of the length of the same major surface. The first major surface of the semiconductor substrate is bonded to an elastic metal load plate.
摘要:
In a structure in which peripheral part of a diaphragm section of an electrical insulating film is covered with a protective film made of an organic material, the resistor wire on the diaphragm section crosses the peripheral part of the diaphragm section. At a place where a narrow wire of a resistance temperature detector and the like crosses the peripheral part of the diaphragm section, the protective film is thinner than the other part, and the dust impact resistance is reduced. At a place where a heating resistor wire connected to a heating resistor body or resistance temperature detector wires connected to resistance temperature detector bodies cross a periphery of the diaphragm section, a film component protruding from an electrical insulating film is arranged side by side with the heating resistor wire or the resistance temperature detector wires.
摘要:
An air flow measuring instrument, comprising: an auxiliary passage 8 arranged inside a main passage through which fluid flows, a tabular member 5 on which a pattern of a heating resistor for measuring an air flow is provided on one face 5a, the tabular member being disposed inside the auxiliary passage so that the one face 5a on which the heating resistor pattern of the tabular member is provided is disposed along a flow of fluid inside the auxiliary passage 8, a heating resistor pattern-side fluid passage 8a portion formed so that the fluid flows between the face 5a and a passage-forming surface 8d of the auxiliary passage, and a back-surface 8b side fluid passage portion formed so that fluid flows between a face 5b on a side opposite to the face of the tabular member and the passage-forming surface of the auxiliary passage. Guidance portion 13 guiding dust that collides against the end portion to back-surface side fluid passage portion 8b side is provided on upstream-side end of tabular member.
摘要:
A heating resistor type flow measuring device comprising a housing having a support part provided between a frame body and a connector and connected to the mounting part of a fluid passage, a flow rate detection element held on the frame body side of the housing, and an electronic circuit held on the housing and connected electrically to the flow rate detection element and the connector, wherein the electronic circuit is held on the frame body side of the housing and positioned in the fluid passage, a member with the rigidity higher than the material of the main structural member of the housing is formed integrally with the support part, the housing is fixed to the fluid passage through the member with high rigidity. A metal plate is inserted into the support part so as to increase rigidity. Further, a distance is provided between the support part and a metal plate forming a route for conducting the heat transferred to the metal base fixing an electronic circuit substrate by a plastic mold so as to form a structure obstructing a heat transfer, or a clearance is provided in a portion spaced by the plastic mold between the support part and the metal base so as to form a structure obstructing a heat transfer.
摘要:
By sealing a diaphragm with less processes and lower cost and reducing deformation due to remaining stress, a stable and highly reliable pressure sensor construction is proposed. The pressure sensor is low in measurement error and small in floating capacitance and leakage current and good in characteristic. As a means to attain the above object, a polycrystalline silicon diaphragm is sealed with a silicon oxide film deposited through a LPCVD method and then completely covered. The diaphragm is placed on a surface of a semiconductor substrate with a nearly constant gap of 0.15 to 1.3 μm, and has difference-in-grade constructions of a deformation reducing means due to remaining stress.
摘要:
An electric component part has its lead terminals bent in thickness directions in a middle section thereof at least two positions so that a step section virtually in parallel to the bottom of a circuit substrate is formed with the intention of absorbing the external force applied to the part by chaging the shape of the lead terminals. Increase in the part layout area due to the formation of the horizontal step section can be avoided, when necessary, by shifting the terminal lead out position on the component part inward thereby to minimize the jetty dimensions.
摘要:
An object of the present invention is to provide a structure unlikely to break in the dicing process while allowing easy execution of screening, for a measurement element in which a resistor constituting a heater is formed on a thin wall part thermally insulated from a semiconductor substrate by providing a cavity part formed in the semiconductor substrate.Provided is a measurement element including: a semiconductor substrate; an electrical insulating film formed on the semiconductor substrate; a resistor formed on the electrical insulating film, the resistor constituting a heater; and a cavity formed by removing a portion of the semiconductor substrate that corresponds to a region where a body part of the resistor is formed. The region where the body part of the resistor is formed is formed into a thin wall part by the cavity, and any of an opening and a slit is formed in a portion of the thin wall part in such a manner as to penetrate the thin wall part in a thickness direction thereof. The measurement element has a film formed covering a region of the opening or the slit.
摘要:
A wire bonding method and apparatus implement the flatly thinner plastic deformation for the joint section of a wire, which has a diameter ranging 100-600 &mgr;m, on its feed side, feed out and position the flatly deformed wire joint section to a target joint surface, and join the wire to it by pressing the positioned wire joint section, with vibration being applied, onto the joint surface with a ultrasonic wire bonder. A high-power semiconductor device fabricated based on this scheme has a long life of wire joints.
摘要:
In a capacitance type pressure sensor, a diaphragm is formed of a fragile material using an impurity-diffused monocrystal silicon and constitutes a stable pressure-responsive structure which does not undergo a plastic deformation. Between the diaphragm and a movable electrode is formed an oxide film to diminish stray capacitance between the movable electrode and a substrate and also between the movable electrode and a impurity-diffused layer. The oxide film and the movable electrode are each divided into plural regions so that the divided regions of the movable electrode are formed on the divided regions of the oxide film, thereby diminishing stress strain induced by a difference in therm expansion coefficient among the diaphragm, oxide film and movable electrode. The upper surface of a fixed electrode is covered with a structure for the fixed electrode which structure is formed by an insulating polycrystal silicon film not doped with impurity whereby the rigidity of the electrode is enhanced and it is possible to diminish a leak current.