公开(公告)号：USD856554S1

公开(公告)日：2019-08-13

申请号：US29638809

申请日：2018-03-01

Applicant: Chung Woo Lee ,  Ian Richard Cartabiano ,  Tatsuya Kobayashi

Designer： Chung Woo Lee ,  Ian Richard Cartabiano ,  Tatsuya Kobayashi

公开(公告)号：USD840875S1

公开(公告)日：2019-02-19

申请号：US29638825

申请日：2018-03-01

Applicant: Chung Woo Lee ,  Ian Richard Cartabiano ,  Takeo Sowa ,  Kouji Katsuno

Designer： Chung Woo Lee ,  Ian Richard Cartabiano ,  Takeo Sowa ,  Kouji Katsuno

公开(公告)号：US09333867B2

公开(公告)日：2016-05-10

申请号：US13193535

申请日：2011-07-28

Applicant: Chung Woo Lee

Inventor： Chung Woo Lee

IPC: H02J7/00 ,  G08B13/08 ,  B60L11/18 ,  B60L3/12

CPC classification number: B60L11/1816 ,  B60L3/12 ,  B60L11/1825 ,  B60L2230/16 ,  B60L2250/10 ,  B60L2270/32 ,  B60L2270/34 ,  Y02T10/7005 ,  Y02T10/7088 ,  Y02T90/121 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/163

Abstract: Disclosed is a charging stand for an electric vehicle, the charging stand including a main body, a door coupled to the main body in such a way as to be opened or closed, and an alarm device generating an alarm if the door is opened, wherein the alarm device has a door sensing unit causing a change in impedance if the door is opened, a controller receiving a signal transmitted from the door sensing unit, and a switching circuit activated by the controller to generate an alarm or store an alarm history, so that the charging stand is advantageous in that the opening of the door can be precisely detected, and the alarm history can be checked later.

Abstract translation: 公开了一种电动车辆的充电座，充电架包括主体，以打开或关闭方式联接到主体的门以及如果门打开则产生报警的报警装置，其中， 报警装置具有门检测单元，如果门打开则导致阻抗变化，控制器接收从门感测单元发送的信号，以及由控制器激活的切换电路以产生报警或存储报警历史，因此 充电台的优点在于可以精确地检测门的打开，并且可以稍后检查报警历史。

公开(公告)号：US08503457B2

公开(公告)日：2013-08-06

申请号：US12014685

申请日：2008-01-15

Applicant: Addepalli Sateesh Kumar ,  Chandrasekaran Nageswara Gupta ,  Tushar Ramanlal Shah ,  Debaditya Mukherjee ,  Thomas Yat Chung Woo ,  Khalid Sheikh ,  Jai Prakash Agrawal

Inventor： Addepalli Sateesh Kumar ,  Chandrasekaran Nageswara Gupta ,  Tushar Ramanlal Shah ,  Debaditya Mukherjee ,  Thomas Yat Chung Woo ,  Khalid Sheikh ,  Jai Prakash Agrawal

IPC: H04L12/28

CPC classification number: H04W28/20 ,  H04L1/0003 ,  H04L1/0009 ,  H04L1/0026 ,  H04L12/6402 ,  H04L12/6418 ,  H04Q11/0066 ,  H04Q11/0071 ,  H04Q2011/0033 ,  H04Q2011/0084

Abstract: To more fully utilize the available bandwidth of a network link, network nodes in accordance with the present invention allow TDM data to be combined with packet data. A Packet/TDM cross connect switch, having both a TDM switch and a packet switch, is used in these embodiments. Data packets are transformed into TDM packet columns. The TDM packet columns are combined with standard TDM data columns in the payload of a TDM data frame. Data packets may be sorted based on a priority scheme, in which high priority data packets are given precedence over lower priority data. However, both high priority and low priority may be combined in a TDM packet column.

Abstract translation: 为了更充分地利用网络链路的可用带宽，根据本发明的网络节点允许TDM数据与分组数据组合。 在这些实施例中使用具有TDM交换机和分组交换机的分组/ TDM交叉连接交换机。 数据分组被转换成TDM分组列。 TDM分组列与TDM数据帧的有效载荷中的标准TDM数据列组合。 可以基于优先级方案对数据分组进行排序，其中高优先级数据分组优先于较低优先级的数据。 然而，高优先级和低优先级都可以组合在TDM分组列中。

公开(公告)号：US20120081208A1

公开(公告)日：2012-04-05

申请号：US13239276

申请日：2011-09-21

Applicant: Chung Woo LEE

Inventor： Chung Woo LEE

IPC: G08B29/00

CPC classification number: B60L3/00 ,  B60L53/14 ,  B60L53/65 ,  B60L2270/32 ,  B60L2270/36 ,  Y02T10/7005 ,  Y02T10/7072 ,  Y02T90/121 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/163 ,  Y02T90/169 ,  Y04S30/14

Abstract: Disclosed is an apparatus for operating a door of a connector connection part in an EV charging stand, which is configured to control an operation of opening or closing the door of the connector connection part of the EV charging stand to which a connector of an electric vehicle is connected for a charging operation, using ID information of an EV user, and which is advantageous in that the connector connection part of the EV charging stand is prevented from being randomly opened when the electric vehicle is not charged, thus preventing an electric shock accident or damage to the connection part, and an unauthorized user is prevented from using the EV charging stand, thus effectively preventing the electric vehicle from being stolen.

Abstract translation: 公开了一种用于操作EV充电座中的连接器连接部分的门的装置，其被配置为控制打开或关闭电动充电台的连接器连接部分的门的操作，电动车辆的连接器 连接用于充电操作，使用EV用户的ID信息，并且其优点在于，当电动车辆未被充电时，防止EV充电座的连接器连接部被随机地打开，从而防止电击事故 或损坏连接部件，并且防止未经授权的用户使用EV充电台，从而有效地防止电动车辆被盗。

公开(公告)号：US08139387B2

公开(公告)日：2012-03-20

申请号：US12662989

申请日：2010-05-14

Applicant: Yoon-dong Park ,  Jo-won Lee ,  Chung-woo Kim ,  Eun-hong Lee ,  Sun-ae Seo ,  Woo-joo Kim ,  Hee-soon Chae ,  Soo-doo Chae ,  I-hun Song

Inventor： Yoon-dong Park ,  Jo-won Lee ,  Chung-woo Kim ,  Eun-hong Lee ,  Sun-ae Seo ,  Woo-joo Kim ,  Hee-soon Chae ,  Soo-doo Chae ,  I-hun Song

IPC: G11C5/06

CPC classification number: G11C11/5621 ,  H01L27/0688 ,  H01L27/11521 ,  H01L27/11551

Abstract: Provided are a complementary nonvolatile memory device, methods of operating and manufacturing the same, a logic device and semiconductor device having the same, and a reading circuit for the same. The complementary nonvolatile memory device includes a first nonvolatile memory and a second nonvolatile memory which are sequentially stacked and have a complementary relationship. The first and second nonvolatile memories are arranged so that upper surfaces thereof are contiguous.

Abstract translation: 提供了一种互补的非易失性存储器件，其操作和制造方法，逻辑器件和具有该非易失性存储器件的半导体器件及其读取电路。 互补非易失性存储器件包括顺序堆叠并具有互补关系的第一非易失性存储器和第二非易失性存储器。 第一和第二非易失性存储器被布置成使得其上表面相邻。

公开(公告)号：US20110267727A1

公开(公告)日：2011-11-03

申请号：US13091030

申请日：2011-04-20

Applicant: Chung Woo LEE

Inventor： Chung Woo LEE

IPC: H02H3/26

CPC classification number: G01R19/16547 ,  G01R19/10 ,  G01R19/16571

Abstract: Disclosed is an apparatus for monitoring a fault current in a power system. The apparatus does not rectify an AC signal detected from a power system but full wave-rectifies the AC signal using a bridge diode and then monitors a fault current. Particularly, current and voltage in the power system are respectively detected through a current transformer and a Rogowski coil, and presence of occurrence of an accident is parallely monitored using the detected current and voltage. Thus, it is possible to prevent a response delay due to a rising time generated when the AC signal is smoothed to a DC signal through a capacitor and to prevent malfunction caused by chattering while performing a fast response at the time when a fault current is generated for the first time.

Abstract translation: 公开了一种用于监视电力系统中的故障电流的装置。 该装置不会纠正从电力系统检测到的交流信号，而是使用桥二极管对AC信号进行全波整流，然后监视故障电流。 特别地，电力系统中的电流和电压分别通过电流互感器和罗戈夫斯基线圈检测，并且使用检测到的电流和电压平行地监视事故的发生。 因此，可以防止当通过电容器将AC信号平滑到DC信号时产生的上升时间的响应延迟，并且在产生故障电流时执行快速响应时防止由抖动引起的故障 首次。

公开(公告)号：US20090181531A1

公开(公告)日：2009-07-16

申请号：US12346934

申请日：2008-12-31

Applicant: Soo-doo Chae ,  Chung-woo Kim ,  Choong-man Lee ,  Yung-hee Lee ,  Chan-jin Park ,  Sung-wook Hwang ,  Jeong-hee Han ,  Do-haing Lee ,  Jin-seok Lee

Inventor： Soo-doo Chae ,  Chung-woo Kim ,  Choong-man Lee ,  Yung-hee Lee ,  Chan-jin Park ,  Sung-wook Hwang ,  Jeong-hee Han ,  Do-haing Lee ,  Jin-seok Lee

IPC: H01L21/28

CPC classification number: H01L21/31155 ,  H01L27/11568 ,  H01L29/66833 ,  H01L29/792

Abstract: Methods of manufacturing non-volatile memory devices that can reduce or prevent loss of charges stored in a charge storage layer and/or that can improve charge storage capacity by neutral beam irradiation of an insulating layer are disclosed. The methods include forming a tunneling insulating layer on a substrate, forming a charge storage layer on the tunneling insulating layer, forming a blocking insulating layer on the charge storage layer, irradiating the blocking insulating layer and/or the tunneling insulating layer with a neutral beam, and forming a gate conductive layer on the blocking insulating layer.

Abstract translation: 公开了制造可以减少或防止存储在电荷存储层中的电荷损失和/或可通过绝缘层的中性束照射改善电荷存储容量的非易失性存储器件的制造方法。 所述方法包括在衬底上形成隧道绝缘层，在隧道绝缘层上形成电荷存储层，在电荷存储层上形成阻挡绝缘层，用中性光束照射阻挡绝缘层和/或隧道绝缘层 并且在所述阻挡绝缘层上形成栅极导电层。

公开(公告)号：US07547977B2

公开(公告)日：2009-06-16

申请号：US11616850

申请日：2006-12-27

Applicant: Young-Hee Song ,  Il-Heung Choi ,  Jeong-Jin Kim ,  Hae-Jeong Sohn ,  Chung-Woo Lee

Inventor： Young-Hee Song ,  Il-Heung Choi ,  Jeong-Jin Kim ,  Hae-Jeong Sohn ,  Chung-Woo Lee

IPC: H01L23/52 ,  H01L23/50 ,  H01L23/495 ,  H01L23/525 ,  H01L25/065

CPC classification number: H01L24/05 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/525 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05116 ,  H01L2224/05118 ,  H01L2224/05155 ,  H01L2224/0516 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05616 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/05669 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48463 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06558 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10161 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: In one embodiment, a semiconductor chip has one or more peripheral bond pads. The semiconductor chip comprises a semiconductor substrate having a cell region and a peripheral circuit region adjacent to each other; a bond pad-wiring pattern formed on at least a part of the peripheral region of the semiconductor substrate; a passivation layer formed on the bond pad-wiring pattern and exposed portions of the semiconductor substrate; a pad-rearrangement pattern disposed over the passivation layer and electrically connected to the bond pad-wiring pattern; and an insulating layer formed over the pad-rearrangement pattern. The insulating layer has an opening therein that exposes a portion of the pad-rearrangement pattern to define a bond pad. The bond pad is disposed over at least a part of the cell region.

Abstract translation: 在一个实施例中，半导体芯片具有一个或多个外围接合焊盘。 半导体芯片包括具有彼此相邻的单元区域和外围电路区域的半导体衬底; 形成在半导体衬底的周边区域的至少一部分上的接合焊盘布线图案; 形成在所述接合焊盘布线图案上的钝化层和所述半导体基板的暴露部分; 衬垫重排图案，设置在钝化层上并电连接到接合焊盘布线图案; 以及形成在垫重排图案上的绝缘层。 绝缘层在其中具有露出焊盘重排图案的一部分以限定接合焊盘的开口。 接合焊盘设置在电池区域的至少一部分上。

公开(公告)号：US20090026169A1

公开(公告)日：2009-01-29

申请号：US12010195

申请日：2008-01-22

Applicant: Chung-Woo Cho ,  Soon-Jin Cho ,  Byung-Bae Seo ,  Ki-Young Yoo ,  Seok-Hwan Ahn

Inventor： Chung-Woo Cho ,  Soon-Jin Cho ,  Byung-Bae Seo ,  Ki-Young Yoo ,  Seok-Hwan Ahn

IPC: H01B13/00 ,  B23K26/36

CPC classification number: H05K3/0008 ,  H05K1/0269 ,  H05K3/0035 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2201/0108 ,  H05K2201/09918

Abstract: A printed circuit board manufacturing system and a manufacturing method thereof are disclosed. A method of manufacturing printed circuit board, comprising: providing a substrate that comprises a pad and an insulation layer covering the pad; acquiring an image of the substrate; acquiring location information of the pad by analyzing the image of the substrate; forming a via hole by removing a part of the insulation layer that corresponds the location information of the pad; and forming a via by filling the via hole with a conductive material, provides improved process conformity, even if the substrate has partial or nonlinear deformation, by considering the location information of the pad in the via hole forming. The improved conformity may allow more flexibility to substrate design and more integrity for circuitries on printed circuit board.

Abstract translation: 公开了印刷电路板制造系统及其制造方法。 一种制造印刷电路板的方法，包括：提供包括衬垫和覆盖所述衬垫的绝缘层的衬底; 获取所述基板的图像; 通过分析衬底的图像来获取衬垫的位置信息; 通过去除与衬垫的位置信息相对应的绝缘层的一部分来形成通孔; 并且通过用导电材料填充通孔形成通孔，通过考虑通孔形成中的焊盘的位置信息，即使衬底具有部分或非线性变形也提供了改进的工艺一致性。 改进的一致性可以允许对印刷电路板上的电路板的基板设计和更完整性的更大的灵活性。