摘要:
A solution is presented to securing endpoints without the need for a separate bus or communication path. The solution allows for controlling access to endpoints by utilizing a management protocol by overlapping with existing interconnect communication paths in a packet format and utilizing a PCI address BDF (Bus number, Device number, and Function number) for verification.
摘要:
In one embodiment, the present invention includes a method for receiving an information packet in a first port from an interconnect while an agent associated with the first port is in an idle low power state, transmitting a first signal from the first port along the interconnect to request re-transmission of the information packet, and sending a second signal from the first port to the agent to cause the agent to enter a fully active power state. Other embodiments are described and claimed.
摘要:
A method and structures are provided for implementing decoupling capacitors with hot spot thermal reduction on integrated circuit chips including silicon-on-insulator (SOI) circuits. A silicon-on-insulator (SOI) structure includes a silicon substrate layer, a thin buried oxide (BOX) layer carried by the silicon substrate layer, and an active layer carried by the thin BOX layer. A thermal conductive path is built proximate to a hotspot area in the active layer to reduce thermal effects including a backside thermal connection from a backside of the SOI structure. The backside thermal connection includes a backside etched opening extending from the backside of the SOI structure into the silicon substrate layer, a capacitor dielectric formed on said backside etched opening; and a thermal connection material deposited on said capacitor dielectric filling said backside etched opening.
摘要:
A memory chip suitable for use in a daisy chain of memory chips. The memory chip receives an address/command word on a first input, determines if the address command word is directed to the memory chip; if so, the memory chip accesses an array on the memory chip. If not, the memory chip re-drives the address/command word on a first output. Write data is received as part of the address/command word or from a first data bus port. A bus clock is received and is used to receive and transmit information on the first input, the first output, the first data bus port and the second data bus port. The memory chip is incorporated into a design structure that is embodied in a computer readable medium used for designing, manufacturing, or testing the memory chip.
摘要:
A method and apparatus implement redundant memory access using multiple controllers on the same bank of memory, and a design structure on which the subject circuit resides is provided. A first memory controller uses the memory as its primary address space, for storage and fetches. A second redundant controller is also connected to the same memory. System control logic is used to notify the redundant controller of the need to take over the memory interface. The redundant controller initializes if required and takes control of the memory. The memory only needs to be initialized if the system has to be brought down and restarted in the redundant mode. This invention allows the system to continue to stay up and continue running during a memory controller or link failure.
摘要:
A method and apparatus implement redundant memory access using multiple controllers on the same bank of memory. A first memory controller uses the memory as its primary address space, for storage and fetches. A second redundant controller is also connected to the same memory. System control logic is used to notify the redundant controller of the need to take over the memory interface. The redundant controller initializes if required and takes control of the memory. The memory only needs to be initialized if the system has to be brought down and restarted in the redundant mode. This invention allows the system to continue to stay up and continue running during a memory controller or link failure.
摘要:
A heat sink apparatus having a plurality of chips attached to a first surface of a flexible carrier and a plurality of heat sink fins. One or more additional chips may be attached to a second surface of the flexible carrier. The flexible carrier has at least one complementary fold, the complementary fold having a counterclockwise fold and a clockwise fold as seen from the side. A first chip back surface of a first chip and a second chip back surface of a second chip are in thermal contact with a particular heat sink fin, that is, sharing the same heat sink fin. Thermal contact between the chips and heat sink fins is effected by force, by thermally conducting adhesive, by thermal grease, or by a combination of force and/or thermally conducting adhesive and/or thermal grease.
摘要:
A power control method and power control structures are provided for managing a plurality of voltage islands of a functional chip. The power control structure includes a supply control and partition chip positioned between a substrate carrier and a functional chip including a plurality of voltage islands. The supply control and partition chip includes a plurality of first electrical connections to the functional chip including the plurality of voltage islands. The supply control and partition chip includes a plurality of second electrical connections to the substrate carrier. Power applied to predefined ones of the first electrical connections to the functional chip are selectively switched on and off by the supply control and partition chip.
摘要:
A method and structure are provided for implementing component placement suspended within electrical pin grid array packages for enhanced electrical performance. A solder column grid array is coupled between a printed circuit board and a first level package. A component is connected between a predefined pair of adjacent columns in the solder column grid array suspended between the printed circuit board and the first level package.
摘要:
A memory system having a memory controller and a memory. The memory comprises one or more daisy chains of self timed memory chips. An address/command word is chained through a daisy chain of memory chips and is handled by one of the memory chips in the daisy chain of memory chips. Data to be written to a memory chip is sent as part of the address/command word, or is transferred on an outgoing data bus chain. Data read from a memory chip is transferred on an incoming data bus chain. Access timing on a memory chip is determined by a self time block on the memory chip.