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公开(公告)号：US07294909B2
公开(公告)日：2007-11-13
申请号：US11099161
申请日：2005-04-05
申请人： Jon A. Casey , James G. Balz , Michael Berger , Jerome Cohen , Charles Hendricks , Richard Indyk , Mark LaPlante , David C. Long , Lori A. Maiorino , Arthur G. Merryman , Glenn A. Pomerantz , Robert A. Rita , Krystyna W. Semkow , Patrick E. Spencer , Brian R. Sundlof , Richard P. Surprenant , Donald R. Wall , Thomas A. Wassick , Kathleen M. Wiley
发明人： Jon A. Casey , James G. Balz , Michael Berger , Jerome Cohen , Charles Hendricks , Richard Indyk , Mark LaPlante , David C. Long , Lori A. Maiorino , Arthur G. Merryman , Glenn A. Pomerantz , Robert A. Rita , Krystyna W. Semkow , Patrick E. Spencer , Brian R. Sundlof , Richard P. Surprenant , Donald R. Wall , Thomas A. Wassick , Kathleen M. Wiley
IPC分类号： H01L27/148 , H01L29/768
CPC分类号： H05K3/225 , H01L21/4846 , H01L23/49811 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K3/0029 , H05K3/4629 , H05K2203/173 , Y10T29/49124 , Y10T29/49135 , H01L2924/00
摘要： A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.
摘要翻译： 一种多层陶瓷修复工艺，提供了一个新的电气修复路径，以连接顶面通孔。 修复路径是建立在有缺陷的网和包含在多层陶瓷基板内的冗余修复网之间。 有缺陷的网和修复网各自终止在基板的表面通孔处。 使用激光器在基板上和基板上形成点火电路。 之后是有缺陷的网络与电气修复结构的电气隔离和电气修复线路的钝化。
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公开(公告)号：US06916670B2
公开(公告)日：2005-07-12
申请号：US10358431
申请日：2003-02-04
申请人： Jon A. Casey , James G. Balz , Michael Berger , Jerome Cohen , Charles Hendricks , Richard Indyk , Mark LaPlante , David C. Long , Lori A. Maiorino , Arthur G. Merryman , Glenn A. Pomerantz , Robert A. Rita , Krystyna W. Semkow , Patrick E. Spencer , Brian R. Sundlof , Richard P. Surprenant , Donald R. Wall , Thomas A. Wassick , Kathleen M. Wiley
发明人： Jon A. Casey , James G. Balz , Michael Berger , Jerome Cohen , Charles Hendricks , Richard Indyk , Mark LaPlante , David C. Long , Lori A. Maiorino , Arthur G. Merryman , Glenn A. Pomerantz , Robert A. Rita , Krystyna W. Semkow , Patrick E. Spencer , Brian R. Sundlof , Richard P. Surprenant , Donald R. Wall , Thomas A. Wassick , Kathleen M. Wiley
CPC分类号： H05K3/225 , H01L21/4846 , H01L23/49811 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K3/0029 , H05K3/4629 , H05K2203/173 , Y10T29/49124 , Y10T29/49135 , H01L2924/00
摘要： A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.
摘要翻译： 一种多层陶瓷修复工艺，提供了一种新的电气修复路径，以连接顶部表面通孔。 修复路径是建立在有缺陷的网和包含在多层陶瓷基片内的冗余修复网之间。 有缺陷的网和修复网各自终止在基板的表面通孔处。 使用激光器在基板上和基板上形成点火电路。 之后是有缺陷的网络与电气修复结构的电气隔离和电气修复线路的钝化。
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公开(公告)号：US06823585B2
公开(公告)日：2004-11-30
申请号：US10249305
申请日：2003-03-28
申请人： Mark J. LaPlante , Jon A. Casey , Thomas A. Wassick , David C. Long , Krystyna W. Semkow , Patrick E. Spencer , Robert A. Rita , Richard F. Indyk , Kathleen M. Wiley , Brian R. Sundlof , James Balz , Lori A. Maiorino , Donald R. Wall , Glenn A. Pomerantz
发明人： Mark J. LaPlante , Jon A. Casey , Thomas A. Wassick , David C. Long , Krystyna W. Semkow , Patrick E. Spencer , Robert A. Rita , Richard F. Indyk , Kathleen M. Wiley , Brian R. Sundlof , James Balz , Lori A. Maiorino , Donald R. Wall , Glenn A. Pomerantz
IPC分类号： H01R4300
CPC分类号： H05K3/242 , H05K1/0306 , H05K3/0035 , H05K3/048 , H05K3/184 , H05K3/225 , H05K2203/0191 , H05K2203/0264 , H05K2203/0574 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49163 , Y10T29/49165 , Y10T29/49171 , Y10T29/49172 , Y10T29/49721 , Y10T29/49732 , Y10T29/49737 , Y10T29/49746
摘要： A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing the substrate surface. The first path connects at least one conductive via on the top surface of the substrate. A second path is cut through the second layer of tape exposing the first layer of tape. The second path is routed from the first path to an edge of the substrate A seed layer is deposited over the surface of the second layer of tape thereby creating a seeded plating path in the first path and a sacrificial seeded conduction path in the second path. Connecting the sacrificial seeded conduction path to a plating potential at the edge of the substrate creates a plated path on the surface of the substrate. The sacrificial path is removed when the tape is removed.
摘要翻译： 在基板上形成表面电镀金属化的方法和结构。 将两层胶带施加到基材的表面。 通过暴露衬底表面的两层带切割第一路径。 第一路径在衬底的顶表面上连接至少一个导电通孔。 通过暴露第一层胶带的第二层胶带切割第二条路径。 第二路径从第一路径路由到衬底的边缘。种子层沉积在第二层带的表面上，从而在第一路径中形成种子电镀路径，并在第二路径中形成牺牲种子传导路径。 将牺牲种子传导路径连接到衬底边缘处的电镀电位在衬底的表面上产生电镀路径。 去除胶带时，去除牺牲路径。
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公开(公告)号：US5927193A
公开(公告)日：1999-07-27
申请号：US951704
申请日：1997-10-16
申请人： James G. Balz , Cynthia J. Calli , Jon A. Casey , David C. Long , Daniel S. Mackin , Keith C. O'Neil , Brenda L. Peterson , Glenn A. Pomerantz
发明人： James G. Balz , Cynthia J. Calli , Jon A. Casey , David C. Long , Daniel S. Mackin , Keith C. O'Neil , Brenda L. Peterson , Glenn A. Pomerantz
CPC分类号： B41M1/12 , H01L21/486 , H01L21/4867 , H05K3/4061 , H05K1/0306 , H05K2203/0156 , H05K2203/082
摘要： An apparatus and method is provided for vacuum screen printing a greensheet having vias and both vias and open areas whereby vacuum leakage in the apparatus is minimized and avoids bowing of the screen over the open area of the greensheet. An interposer apparatus is provided comprising at least two layers having vertical through openings in registration with the via openings of the greensheet and screen. The interposer also comprises vertical through openings communicating with the open area of the greensheet and with vent channels of the interposer. A porous membrane is also used either alone or in conjunction with the interposer to provide enhanced screening results.
摘要翻译： 提供了一种用于真空丝网印刷具有通孔和通孔和开口区域的毛坯的装置和方法，从而使装置中的真空泄漏最小化，并避免了筛板在毛坯的开放区域上的弯曲。 提供了一种插入器装置，其包括至少两层，具有与毛坯和筛网的通孔开口对准的垂直通孔。 插入器还包括垂直通孔，其与毛坯的开放区域和插入器的通气通道连通。 多孔膜也可单独使用或与插入物结合使用以提供增强的筛选结果。
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公开(公告)号：US6032683A
公开(公告)日：2000-03-07
申请号：US258970
申请日：1999-02-26
申请人： Jon A. Casey , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , John U. Knickerbocker , David C. Long , Daniel S. Mackin , Glenn A. Pomerantz , Krishna G. Sachdev , David E. Speed , Candace A. Sullivan , Robert J. Sullivan , Bruce E. Tripp , James C. Utter
发明人： Jon A. Casey , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , John U. Knickerbocker , David C. Long , Daniel S. Mackin , Glenn A. Pomerantz , Krishna G. Sachdev , David E. Speed , Candace A. Sullivan , Robert J. Sullivan , Bruce E. Tripp , James C. Utter
IPC分类号： B08B3/02 , B41F35/00 , G03F1/82 , G03F7/12 , G03F7/42 , H01L21/00 , H05K3/12 , H05K3/26 , B08B3/00
CPC分类号： H01L21/67028 , B08B3/02 , B41F35/005 , G03F1/82 , G03F7/425 , B41P2235/26 , B41P2235/50 , G03F7/12 , H05K3/1216 , H05K3/26
摘要： A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.
摘要翻译： 一种清洁方法和相关设备，用于使用在面罩的两侧同时施加的高压下的碱性洗涤剂水溶液来清洗半导体掩模掩模，随后进行干燥步骤，其使用空气刀将掩模表面吹出任何残余的清洁剂溶液。
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公开(公告)号：US5916374A
公开(公告)日：1999-06-29
申请号：US21046
申请日：1998-02-09
申请人： Jon A. Casey , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , John U. Knickerbocker , David C. Long , Daniel S. Mackin , Glenn A. Pomerantz , Krishna G. Sachdev , David E. Speed , Candace A. Sullivan , Robert J. Sullivan , Bruce E. Tripp , James C. Utter
发明人： Jon A. Casey , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , John U. Knickerbocker , David C. Long , Daniel S. Mackin , Glenn A. Pomerantz , Krishna G. Sachdev , David E. Speed , Candace A. Sullivan , Robert J. Sullivan , Bruce E. Tripp , James C. Utter
IPC分类号： B08B3/02 , B41F35/00 , G03F1/82 , G03F7/12 , G03F7/42 , H01L21/00 , H05K3/12 , H05K3/26 , B08B3/04
CPC分类号： H01L21/67028 , B08B3/02 , B41F35/005 , G03F1/82 , G03F7/425 , B41P2235/26 , B41P2235/50 , G03F7/12 , H05K3/1216 , H05K3/26
摘要： A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.
摘要翻译： 一种清洁方法和相关设备，用于使用在面罩的两侧同时施加的高压下的碱性洗涤剂水溶液来清洗半导体掩模掩模，随后进行干燥步骤，其使用空气刀将掩模表面吹出任何残余的清洁剂溶液。
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7.发明授权Method of forming a multilayer electronic packaging substrate with integral cooling channels 失效形成具有整体冷却通道的多层电子封装基板的方法
公开(公告)号：US5870823A
公开(公告)日：1999-02-16
申请号：US756362
申请日：1996-11-27
IPC分类号： H01L23/473 , H05K3/22 , H05K3/46
CPC分类号： H01L23/473 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/09701 , H01L2924/15312 , Y10T29/49126 , Y10T29/4913 , Y10T29/49158 , Y10T29/49163
摘要： Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the sintered ceramic body for cooling a heat-generating electronic device placed on the sintered body. Also disclosed is a method of making the electronic packaging substrate.
摘要翻译： 公开了一种电子封装基板，其包括具有至少一个布线内层和至少一个内部并与烧结陶瓷体一体的冷却通道的烧结陶瓷体，用于冷却放置在烧结体上的发热电子器件。 还公开了制造电子封装基板的方法。
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公开(公告)号：US6038931A
公开(公告)日：2000-03-21
申请号：US25672
申请日：1998-02-18
申请人： David C. Long , Thomas P. Moyer , Keith C. O'Neil , Charles H. Perry , Glenn A. Pomerantz , James R. Case , Laszlo Kando , John E. Kozol
发明人： David C. Long , Thomas P. Moyer , Keith C. O'Neil , Charles H. Perry , Glenn A. Pomerantz , James R. Case , Laszlo Kando , John E. Kozol
CPC分类号： G01N3/24
摘要： A method for testing the integrity at least two test objects, each object is made of a plastically deformable material, by a. contacting a moving means with the objects at a first point in time, the moving means at a first position and the objects at a first position, the moving means having a shaped portion; b. shifting at least a portion of the objects to a second position at a second time, subsequent to the first time, wherein at least a portion of the objects were displaced during the interval between the first time and the second time; c. evaluating the objects after the shifting in step b. 22.
摘要翻译： 一种用于测试至少两个测试对象的完整性的方法，每个对象由可塑性变形的材料制成，由a。 在第一时间点将移动装置与物体接触，移动装置处于第一位置，并且物体处于第一位置，移动装置具有成形部分; b。 在第一次之后的第二时间将至少一部分物体移动到第二位置，其中至少一部分物体在第一时间和第二时间之间的间隔期间被移位; C。 在步骤b中移动后评估对象。 22。
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公开(公告)号：US06525009B2
公开(公告)日：2003-02-25
申请号：US09731621
申请日：2000-12-07
IPC分类号： C11D172
CPC分类号： C11D7/3209 , C11D1/72 , C11D3/3719 , C11D3/3765 , C11D7/06 , C11D7/12 , C11D7/14 , C11D7/3218 , C11D11/0047 , C11D11/007 , H05K1/092 , H05K3/1216 , H05K3/26
摘要： An aqueous alkaline cleaning composition for efficient removal of Mo, Cu, W, or Cu/Ni-based conductive paste residue from screening masks, associated screening equipment and the like by using alkali metal salt and/or tetramethyl ammonium salt of polyacrylic acid, acrylic acid-methacrylic acid co-polymer, polyaspartic acid, polylactic acid, poly(acrylic acid-co-maleic anhydride), poly(maleic acid), with excess alkali for pH adjustment in the range of about 11.5-13.5, and a surfactant which may be a medium foam, low foam or no-foam surfactant, and is preferably an amphoteric and/or non-ionic and/or ionic surfactant.
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公开(公告)号：US6152807A
公开(公告)日：2000-11-28
申请号：US111303
申请日：1998-07-07
申请人： Glenn A. Pomerantz
发明人： Glenn A. Pomerantz
CPC分类号： B24B37/08 , B24B37/30 , B24B41/06 , Y10T29/49996 , Y10T29/49998
摘要： A fixture for holding a workpiece in a machining apparatus comprises at least one opening having at least one flexible side for elastically holding the workpiece and a slot adjacent each of the at least one side for allowing the side to flex.
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