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12 条记录 (耗时 0.015 秒)

    SOLDER-BEARING ARTICLES AND METHOD OF RETAINING A SOLDER MASS ALONG A SIDE EDGE THEREOF
    2.
    发明申请
    SOLDER-BEARING ARTICLES AND METHOD OF RETAINING A SOLDER MASS ALONG A SIDE EDGE THEREOF 有权
    焊接轴承及其边缘保持焊料质量的方法

    公开(公告)号：US20100067209A1

    公开(公告)日：2010-03-18

    申请号：US12303083

    申请日：2007-05-31

    申请人： James R Zanolli

    发明人： James R Zanolli

    IPC分类号： H05K7/02 ,  B23K1/00 ,  B23K3/06 ,  B23K31/02

    CPC分类号： B23K3/0638 ,  B23K2101/36 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10984 ,  H05K2203/0415 ,  H05K2203/043 ,  Y02P70/613

    摘要： A method and device for depositing a solder mass within a plated opening that is formed in a side edge of an electronic device includes the steps of carrying the solder mass in a carrier device and orienting the carrier device with respect to the side edge such that the solder mass is aligned with the plated opening. The method further includes reflowing the solder mass to cause the solder mass to be deposited and securely held within the plated opening and then removing the carrier device leaving the solder mass behind within the plated opening and along the side edge of the electronic device.

    摘要翻译： 一种用于在形成在电子器件的侧边缘中的电镀开口内沉积焊料块的方法和装置包括以下步骤：将载体载体装载在载体装置中并使载体装置相对于侧边缘定向，使得 焊料质量与电镀开口对齐。 该方法还包括回流焊料质量以使得焊料质量被沉积并牢固地保持在电镀开口内，然后移除载体装置，使焊料块留在电镀开口内并沿电子器件的侧边缘。

    Press fit print circuit board connector
    4.
    发明授权
    Press fit print circuit board connector 失效
    压配合印刷电路板连接器

    公开(公告)号：US06206735B1

    公开(公告)日：2001-03-27

    申请号：US09143175

    申请日：1998-08-28

    申请人： James R. Zanolli

    发明人： James R. Zanolli

    IPC分类号： H01R13405

    CPC分类号： H01R12/585 ,  H01R43/205 ,  H01R43/24

    摘要： A press fit contact for through hole mounting has a longitudinal axis and a contact portion along the axis for mounting with an associated electrical component to make electrical contact therewith. A leg portion is configured and dimensioned to be inserted through a mounting plated through hole of a support member. The leg portion includes an interference element along at least a portion thereof dimensioned to be receivable within the plated through hole to establish a press-fit or interference-fit and mechanical and electrical contact with the plating on the mounting hole. An intermediate portion is provided between and integrally formed with the contact and leg portions, the portions all being generally aligned along the longitudinal axis. A pressure-bearing, in each instance element, in the form of one or more holes and with or without associated blade tabs, is formed on the intermediate portion within the perimeter or inside the lateral edges defined by the intermediate portion. A pressure member element in the form of a molded plastic member is arranged on the intermediate portion to encapsulate the pressure-bearing, in each instance element or elements to transmit forces applied thereto acting along the longitudinal axis in the direction from the contact portion towards the leg portion. In this manner, insertion forces applied to the pressure-applying member are transmitting to the intermediate and leg portions for facilitating insertion of the leg portion through the plated through hole by coupling the forces to the pressure bearing elements or elements.

    摘要翻译： 用于通孔安装的压配合接头具有纵向轴线和沿轴线的接触部分，用于安装相关联的电气部件以与其电接触。 腿部被构造和尺寸设置成通过支撑构件的安装电镀通孔插入。 腿部包括沿着其至少一部分的干涉元件，该干涉元件的尺寸设计成可接收在电镀通孔内，以建立压配合或干涉配合，并与安装孔上的电镀机械和电接触。 中间部分设置在接触部分和腿部之间并且与接触部分和腿部部分一体形成，所述部分全部沿着纵向轴线对准。 每个实例元件中的压力为一个或多个孔的形式，并且具有或不具有相关联的叶片突出部，形成在周边内的中间部分或由中间部分限定的侧向边缘内。 模制塑料构件形式的压力构件元件设置在中间部分上，以封装承压，在每种情况下均包括元件或元件，以将施加到其上的力沿着纵向轴线沿着从接触部分向着 腿部。 以这种方式，施加到压力施加构件的插入力传递到中间和腿部，以便于通过将力联接到承压元件而将腿部穿过电镀通孔插入。

    ELECTRICAL CONNECTORS FOR USE IN SOLDERING OPERATIONS
    5.
    发明申请
    ELECTRICAL CONNECTORS FOR USE IN SOLDERING OPERATIONS 有权
    用于焊接操作的电气连接器

    公开(公告)号：US20080268676A1

    公开(公告)日：2008-10-30

    申请号：US12038635

    申请日：2008-02-27

    申请人： James R. Zanolli ,  Joseph S. Cachina

    发明人： James R. Zanolli ,  Joseph S. Cachina

    IPC分类号： B23K31/02 ,  H01R12/00

    CPC分类号： B23K1/0016 ,  B23K2101/38 ,  B23K2101/40 ,  H01R4/027 ,  H01R4/028 ,  H01R12/52 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/366 ,  H05K2201/10424 ,  Y10S439/951

    摘要： An electrical connector for electrically connecting a first electronic device to a second electronic device includes a housing that includes a plurality of solder retention channels that hold a plurality of solder segments in a vertical orientation such that at least a vertical surface and one end of each solder segment are exposed. The solder retention channels are formed in first and second opposing rows with an open space formed therebetween. The exposed vertical surfaces of the solder segments face one another.

    摘要翻译： 用于将第一电子设备电连接到第二电子设备的电连接器包括壳体，其包括多个焊接保持通道，其保持垂直取向的多个焊料段，使得每个焊料的至少垂直表面和一端 段被暴露。 焊料保持通道形成在第一和第二相对的行中，其间形成有开放空间。 焊接段的暴露的垂直表面彼此面对。

    Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connector
    6.
    发明授权
    Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connector 有权
    焊接接触件及其制造方法，并用于焊球栅格阵列连接器

    公开(公告)号：US06543129B2

    公开(公告)日：2003-04-08

    申请号：US09801226

    申请日：2001-03-07

    申请人： Joseph Cachina ,  Jack Seidler ,  James R. Zanolli

    发明人： Joseph Cachina ,  Jack Seidler ,  James R. Zanolli

    IPC分类号： H01R900

    CPC分类号： H01R4/024 ,  B23K35/0244 ,  H01R12/57 ,  H01R43/0235 ,  H01R43/0256 ,  H01R43/16 ,  H05K3/3447 ,  H05K3/3478 ,  H05K2201/10189 ,  H05K2201/10984 ,  H05K2203/0415 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/4916 ,  Y10T29/49179

    摘要： The present invention provides a method of forming a solder ball on a portion, e.g., one end, of a contact. In one exemplary embodiment, the contact is a terminal pin which is intended for use in an electrical connector and more particularly, for use in a solder ball grid array (SBGA) connector. Generally and according to one embodiment, the method includes providing the contact along with a solder-holding clip having a body with an opening. The body has a solder-holding conformation adjacent the opening and a solder mass is held by the conformation. The contact is then positioned proximate to the body opening and heat is applied to the solder mass causing the solder to reflow so that the solder flows into a spherical shape. This results in a solder ball being formed on the portion of the contact. Subsequent to forming the solder ball, the solder-holding clip is separated from the contact leaving a contact with a solder ball affixed thereto. Preferably, a series of solder-holding clips are provided along a carrier strip of material so that a number of solder balls may be formed on corresponding contacts during a single reflow operation.

    摘要翻译： 本发明提供了一种在触点的一个部分（例如一端）上形成焊球的方法。 在一个示例性实施例中，触点是旨在用于电连接器中的端子销，更具体地，用于焊球格栅阵列（SBGA）连接器中。 一般而言，根据一个实施例，该方法包括提供触点以及具有开口的主体的焊料保持夹。 本体具有与开口相邻的焊料保持构型，并且通过构象保持焊料质量。 然后将接触件定位成靠近体开口，并且将热量施加到焊料质量上，导致焊料回流，使得焊料流入球形。 这导致在接触部分上形成焊球。 在形成焊球之后，焊料保持夹与触点分离，留下与固定在其上的焊球接触。 优选地，沿着材料的载体带提供一系列焊料保持夹，使得在单个回流操作期间可以在对应的触点上形成多个焊球。

    Electrical connector with solder retention means for assembly
    9.
    发明授权
    Electrical connector with solder retention means for assembly 有权
    具有焊接保持装置的电连接器用于组装

    公开(公告)号：US07758350B2

    公开(公告)日：2010-07-20

    申请号：US12038635

    申请日：2008-02-27

    申请人： James R. Zanolli ,  Joseph S. Cachina

    发明人： James R. Zanolli ,  Joseph S. Cachina

    IPC分类号： H01R12/00

    CPC分类号： B23K1/0016 ,  B23K2101/38 ,  B23K2101/40 ,  H01R4/027 ,  H01R4/028 ,  H01R12/52 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/366 ,  H05K2201/10424 ,  Y10S439/951

    摘要： An electrical connector for electrically connecting a first electronic device to a second electronic device includes a housing that includes a plurality of solder retention channels that hold a plurality of solder segments in a vertical orientation such that at least a vertical surface and one end of each solder segment are exposed. The solder retention channels are formed in first and second opposing rows with an open space formed therebetween. The exposed vertical surfaces of the solder segments face one another.

    摘要翻译： 用于将第一电子设备电连接到第二电子设备的电连接器包括壳体，其包括多个焊接保持通道，其保持垂直取向的多个焊料段，使得每个焊料的至少垂直表面和一端 段被暴露。 焊料保持通道形成在第一和第二相对的行中，其间形成有开放空间。 焊接段的暴露的垂直表面彼此面对。