摘要:
An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要:
An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要:
To restrain the stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion even when the electronic component is mounted on the curved board. A flexible wiring board in which a plurality of insulation layers (11, 13) and wiring layers (12, 15) are piled up alternately and the wiring layers (12, 15) are connected each other by a via conductor (14), and the board comprises a reinforced area (10a) being reinforced against an external stress, a bending area (10c) bending easier than the reinforced area (10a) by the external stress, and a stress relaxation area (10b) being provided in an area between the reinforced area (10a) and the bending area (10c), bending easier than the reinforced area (10a) by the external stress and not easier than the bending area (10c) by the external stress, and relaxing the stress carried from the bending area (10c) to the reinforced area (10a). The electronic component (20) is connected electrically and mechanically via solder balls (30) with a pad portion (15a) arranged inside an area surrounded by an outer circumferential boundary line of the reinforced area (10a).
摘要:
An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要:
An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要:
Stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion is suppressed. In a flexible wiring board, insulation layers (11, 13) and wiring layers (12, 15) are piled up alternately and wiring layers (12, 15) are via-connected each other. The board comprises reinforced area (10a) reinforced against external stress, bending area (10c) bending easier than the reinforced area (10a) by external stress, and a stress relaxation area (10b) provided in area between the reinforced area (10a) and the bending area (10c), bending easier than the reinforced area (10a) but not easier than the bending area (10c) by the external stress, and relaxing the stress carried from the bending area (10c) to the reinforced area (10a).
摘要:
An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要:
A holder of a magnetic storage apparatus is suggested that can efficiently absorb the shock when a vibration or shock is applied to the magnetic storage apparatus. A plurality of holding members (first shock absorbing material foam rubber 340 and second shock absorbing material foam rubber 350) that hold at least two corner parts of the magnetic storage apparatus 320 is included. The holding members are configured in a way that a total sum of holding power to hold one of opposite angles of the magnetic storage apparatus 320 and a total sum of holding power to hold the other of opposite angles are different. The first shock absorbing material foam rubber 340 is disposed on one of opposite angles, and the second shock absorbing material foam rubber 350 is disposed on the other of the opposite angles. The first shock absorbing material foam rubber 340 has greater hardness than the hardness of the second shock absorbing material foam rubber 350.
摘要:
A holder of a magnetic storage apparatus is suggested that can efficiently absorb the shock when a vibration or shock is applied to the magnetic storage apparatus. A plurality of holding members (first shock absorbing material foam rubber 340 and second shock absorbing material foam rubber 350) that hold at least two corner parts of the magnetic storage apparatus 320 is included. The holding members are configured in a way that a total sum of holding power to hold one of opposite angles of the magnetic storage apparatus 320 and a total sum of holding power to hold the other of opposite angles are different. The first shock absorbing material foam rubber 340 is disposed on one of opposite angles, and the second shock absorbing material foam rubber 350 is disposed on the other of the opposite angles. The first shock absorbing material foam rubber 340 has greater hardness than the hardness of the second shock absorbing material foam rubber 350.