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14 条记录 (耗时 0.019 秒)

    Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components
    6.
    发明授权
    Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components 失效
    在电磁致动的微制造部件上形成和定位成型永久磁铁的方法

    公开(公告)号：US5472539A

    公开(公告)日：1995-12-05

    申请号：US254725

    申请日：1994-06-06

    申请人： Richard J. Saia ,  Kevin M. Durocher ,  Thomas B. Gorczyca ,  Mario Ghezzo

    发明人： Richard J. Saia ,  Kevin M. Durocher ,  Thomas B. Gorczyca ,  Mario Ghezzo

    IPC分类号： H01H50/00 ,  B32B31/28

    CPC分类号： H01H50/005 ,  H02K99/00 ,  H01H2050/007

    摘要： A low temperature batch method for forming and positioning permanent magnets on electromagnetically actuated micro-fabricated components, such as electrical switches employs a first adhesive, such as a Siltem/epoxy blend of an epoxy resin and a siloxane polyimide polymer, to releasably attach a mold layer of Kapton polyimide to a substrate, which may be the movable portion of a micromechanical structure, or a precursor to such movable portion. A well-shape cavity is formed in the mold layer, and filled with a slurry of rare earth NdFeB magnetic particles suspended in a second adhesive, which is cured to form the body of a magnet. The second adhesive is an SPI/epoxy blend, also of an epoxy resin and a siloxane polyimide polymer, but with a greater adhesion strength and a higher temperature softening point compared to the Siltem/epoxy blend. The entire structure is heated, and the mold layer is pulled off the substrate, while the body of magnetic material remains firmly attached. Selective etchants may be subsequently employed to remove metal sacrificial layers, while the NdFeB magnetic particles are protected from attack by the etchant by being effectively encased in plastic.

    摘要翻译： 用于在诸如电气开关的电磁致动微制造部件上形成和定位永磁体的低温分批方法采用第一粘合剂，例如环氧树脂的Siltem /环氧共混物和硅氧烷聚酰亚胺聚合物，以可释放地附接模具 Kapton聚酰亚胺层可以是基底，其可以是微机械结构的可移动部分，或者是可移动部分的前体。 在模具层中形成良好的形状的空腔，并填充悬浮在第二粘合剂中的稀土NdFeB磁性颗粒的浆料，其被固化以形成磁体的主体。 第二种粘合剂是SPI /环氧共混物，也是环氧树脂和硅氧烷聚酰亚胺聚合物，但是与Siltem /环氧树脂共混物相比具有更大的粘合强度和更高的温度软化点。 整个结构被加热，并且模具层被拉离基板，而磁性材料的主体保持牢固地附着。 随后可以选择性蚀刻剂去除金属牺牲层，同时通过被有效地包裹在塑料中来保护NdFeB磁性颗粒免受蚀刻剂的侵蚀。

    Electronic chip package with reduced contact pad pitch
    8.
    发明授权
    Electronic chip package with reduced contact pad pitch 有权
    具有降低接触垫间距的电子芯片封装

    公开(公告)号：US07964974B2

    公开(公告)日：2011-06-21

    申请号：US12326231

    申请日：2008-12-02

    申请人： Raymond Albert Fillion ,  Kevin M. Durocher ,  Richard Joseph Saia ,  Paul Alan McConnelee

    发明人： Raymond Albert Fillion ,  Kevin M. Durocher ,  Richard Joseph Saia ,  Paul Alan McConnelee

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H01L23/53295 ,  H01L21/76804 ,  H01L21/76816 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus and method, the apparatus includes an electronic chip package including an electronic chip having a first and a second contact pad formed thereon, a first dielectric layer coupled to the electronic chip, a second dielectric layer coupled to the first dielectric layer such that a dielectric boundary lies therebetween, a first and a second cover pad positioned along the dielectric boundary, a metal interconnect formed along a first multi-layer via and coupled to the first cover pad and contact pad, and a metal interconnect formed along a second multi-layer via and coupled to the second cover pad and contact pad. The first multi-layer via extends through the second dielectric layer, the first cover pad, and the first dielectric layer to the first contact pad. The second multi-layer via extends through the second dielectric layer, the second cover pad, and the first dielectric layer to the second contact pad.

    摘要翻译： 一种装置和方法，该装置包括电子芯片封装，其包括电子芯片，该电子芯片具有形成在其上的第一和第二接触焊盘，耦合到电子芯片的第一介电层，耦合到第一介电层的第二介电层， 电介质边界位于其间，沿着电介质边界定位的第一和第二覆盖垫，沿着第一多层通孔形成并耦合到第一覆盖焊盘和接触焊盘的金属互连以及沿着第二多层通孔形成的金属互连， 并且耦合到第二盖板和接触垫。 第一多层通孔延伸穿过第二介电层，第一覆盖层和第一介电层到第一接触焊盘。 第二多层通孔延伸穿过第二介电层，第二覆盖层和第一介电层延伸到第二接触焊盘。

    Techniques for fabricating a resistor on a flexible base material
    10.
    发明授权
    Techniques for fabricating a resistor on a flexible base material 有权
    在柔性基材上制造电阻器的技术

    公开(公告)号：US06709944B1

    公开(公告)日：2004-03-23

    申请号：US10261052

    申请日：2002-09-30

    申请人： Kevin M. Durocher ,  Richard J. Saia ,  Vikram B. Krishnamurthy

    发明人： Kevin M. Durocher ,  Richard J. Saia ,  Vikram B. Krishnamurthy

    IPC分类号： H01L2702

    CPC分类号： H01C17/12 ,  B29C59/14 ,  H01C7/006 ,  H05K1/0346 ,  H05K1/167 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2203/095 ,  H05K2203/1136

    摘要： A technique for fabricating a resistor on a flexible substrate. Specifically, at least a portion of a polyimide substrate is activated by exposure to a ion sputter etch techniques. A metal layer is disposed over the activated portion of the substrate, thereby resulting in the formation of a highly resistive metal-carbide region. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal carbide region. The metal-carbide region is patterned to form a resistor between the terminals. Alternatively, only a selected area of the polyimide substrate is activated. The selected area forms the area in which the metal-carbide region is formed. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal-carbide region.

    摘要翻译： 一种在柔性基板上制造电阻器的技术。 具体地，通过暴露于离子溅射蚀刻技术来活化聚酰亚胺基底的至少一部分。 金属层设置在基板的激活部分上，从而形成高电阻金属碳化物区域。 互连层设置在金属碳化物区域上并被图案化以在金属碳化物区域的相对端形成端子。 将金属碳化物区域图案化以在端子之间形成电阻器。 或者，仅激活聚酰亚胺基板的选定区域。 所选区域形成形成金属碳化物区域的区域。 互连层设置在金属碳化物区域上并被图案化以在金属碳化物区域的相对端形成端子。