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公开(公告)号：US06348416B1
公开(公告)日：2002-02-19
申请号：US09455374
申请日：1999-12-06
申请人： Hideki Toya , Mitsuyoshi Imai , Masaki Sakaguchi , Naoki Yamabe , Mamoru Suwa , Toshiyuki Motooka , Hideharu Sakoda , Muneharu Morioka
发明人： Hideki Toya , Mitsuyoshi Imai , Masaki Sakaguchi , Naoki Yamabe , Mamoru Suwa , Toshiyuki Motooka , Hideharu Sakoda , Muneharu Morioka
IPC分类号： H01L21311
CPC分类号： H01L24/85 , H01L21/4832 , H01L21/568 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48475 , H01L2224/4848 , H01L2224/48599 , H01L2224/85001 , H01L2224/85005 , H01L2224/85051 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate 12 which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess 16 formed at a position of the metal substrate 12 corresponding to the resin protuberance and having a rugged bottom surface 16a and/or a rugged side surface, and a plated film 14 formed on the inner surface of the recess 16.
摘要翻译： 为了提高作为半导体装置的外部连接端子的电镀膜与树脂突起的表面之间的粘附性并提高可靠性，载体基板包括成形为片状的金属基板12， 半导体芯片被固定，并且在半导体器件完成之前被去除，形成在与树脂突起相对应的金属基板12的位置处并具有粗糙的底表面16a和/或粗糙的侧表面的凹部16，以及 形成在凹部16的内表面上的镀膜14。
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公开(公告)号：US06700198B2
公开(公告)日：2004-03-02
申请号：US09970983
申请日：2001-10-05
申请人： Hideki Toya , Mitsuyoshi Imai , Masaki Sakaguchi , Naoki Yamabe , Mamoru Suwa , Toshiyuki Motooka , Hideharu Sakoda , Muneharu Morioka
发明人： Hideki Toya , Mitsuyoshi Imai , Masaki Sakaguchi , Naoki Yamabe , Mamoru Suwa , Toshiyuki Motooka , Hideharu Sakoda , Muneharu Morioka
IPC分类号： H01L2348
CPC分类号： H01L24/85 , H01L21/4832 , H01L21/568 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48475 , H01L2224/4848 , H01L2224/48599 , H01L2224/85001 , H01L2224/85005 , H01L2224/85051 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess.
摘要翻译： 为了提高用作半导体装置的外部连接端子的镀膜与树脂突起的表面之间的粘附性，并且为了提高可靠性，载体基板包括成形为片状的金属基板， 半导体芯片是固定的，并且在半导体器件完成之前被去除，形成在与树脂突起相对应的金属基板的位置处并且具有粗糙的底表面和/或粗糙的侧表面的凹部和形成的镀膜 在凹槽的内表面上。
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公开(公告)号：US06339261B1
公开(公告)日：2002-01-15
申请号：US09531273
申请日：2000-03-20
IPC分类号： H01L2348
CPC分类号： H01L21/568 , H01L23/3107 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/85001 , H01L2224/85399 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00012
摘要： A semiconductor device which comprises a semiconductor chip packaged in a resin package and having an electrode terminal wire-bonded to a conductor cap having one end defining an exposed top of an external connection terminal protruding from the resin package and the other end defining an orifice embedded in the resin package, wherein the orifice of the conductor cap has a radially outward extending flange which anchors the conductor cap to the resin package. The process of producing the semiconductor device is also disclosed.
摘要翻译： 一种半导体器件，其包括封装在树脂封装中的半导体芯片，并且具有引线接合到导体帽的电极端子，导体帽的一端限定从树脂封装件突出的外部连接端子的暴露顶部，另一端限定嵌入的孔 在树脂封装中，其中导体盖的孔具有径向向外延伸的凸缘，其将导体盖锚固到树脂封装。 还公开了制造半导体器件的工艺。
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公开(公告)号：US06329711B1
公开(公告)日：2001-12-11
申请号：US09200846
申请日：1998-11-30
申请人： Toshimi Kawahara , Mamoru Suwa , Masanori Onodera , Syuichi Monma , Shinya Nakaseko , Takashi Hozumi , Yoshiyuki Yoneda , Ryuji Nomoto
发明人： Toshimi Kawahara , Mamoru Suwa , Masanori Onodera , Syuichi Monma , Shinya Nakaseko , Takashi Hozumi , Yoshiyuki Yoneda , Ryuji Nomoto
IPC分类号： H01L2304
CPC分类号： H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6833 , H01L23/3107 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/29111 , H01L2224/32057 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/83385 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85664 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/10158 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3011 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/01082 , H01L2924/00012
摘要： A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding from a mounting surface of the resin package, metallic film parts provided to the resin projections, connecting members electrically connecting electrode pads on the semiconductor element and the metallic film parts, and connection pads extending from the metallic film parts, the connecting members being connected to the connection pads.
摘要翻译： 半导体器件包括半导体元件，密封半导体元件的树脂封装，从树脂封装的安装表面突出的树脂突起，设置在树脂突起上的金属膜部分，将半导体元件上的电极焊盘电连接到金属 薄膜部分和从金属薄膜部分延伸的连接焊盘，连接部件连接到连接焊盘。
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5.发明授权公开(公告)号：US06541848B2
公开(公告)日：2003-04-01
申请号：US09170260
申请日：1998-10-13
申请人： Toshimi Kawahara , Mamoru Suwa , Masanori Onodera , Syuichi Monma , Shinya Nakaseko , Takashi Hozumi
发明人： Toshimi Kawahara , Mamoru Suwa , Masanori Onodera , Syuichi Monma , Shinya Nakaseko , Takashi Hozumi
IPC分类号： H01L2348
CPC分类号： H01L21/568 , H01L21/4832 , H01L21/561 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2221/68377 , H01L2224/05554 , H01L2224/1134 , H01L2224/1308 , H01L2224/13099 , H01L2224/13144 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/4848 , H01L2224/49171 , H01L2224/4943 , H01L2224/73265 , H01L2224/85051 , H01L2224/85986 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/20752 , H05K3/3426 , H05K3/3436 , H05K2201/0367 , H05K2201/10689 , Y02P70/613 , H01L2224/85186 , H01L2224/48465 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/4554
摘要： A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.
摘要翻译： 半导体器件包括半导体芯片，用于密封所述半导体芯片的树脂封装，以暴露方式设置在所述树脂封装的安装侧表面上的金属层和用于电连接设置在半导体芯片上的电极焊盘和金属的连接构件 层。 金属层在安装侧设置有螺柱凸块，柱凸起用作外部连接端子。
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