公开(公告)号：US06329711B1

公开(公告)日：2001-12-11

申请号：US09200846

申请日：1998-11-30

申请人： Toshimi Kawahara ,  Mamoru Suwa ,  Masanori Onodera ,  Syuichi Monma ,  Shinya Nakaseko ,  Takashi Hozumi ,  Yoshiyuki Yoneda ,  Ryuji Nomoto

发明人： Toshimi Kawahara ,  Mamoru Suwa ,  Masanori Onodera ,  Syuichi Monma ,  Shinya Nakaseko ,  Takashi Hozumi ,  Yoshiyuki Yoneda ,  Ryuji Nomoto

IPC分类号： H01L2304

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85664 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01082 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding from a mounting surface of the resin package, metallic film parts provided to the resin projections, connecting members electrically connecting electrode pads on the semiconductor element and the metallic film parts, and connection pads extending from the metallic film parts, the connecting members being connected to the connection pads.

摘要翻译： 半导体器件包括半导体元件，密封半导体元件的树脂封装，从树脂封装的安装表面突出的树脂突起，设置在树脂突起上的金属膜部分，将半导体元件上的电极焊盘电连接到金属 薄膜部分和从金属薄膜部分延伸的连接焊盘，连接部件连接到连接焊盘。

公开(公告)号：US06541848B2

公开(公告)日：2003-04-01

申请号：US09170260

申请日：1998-10-13

申请人： Toshimi Kawahara ,  Mamoru Suwa ,  Masanori Onodera ,  Syuichi Monma ,  Shinya Nakaseko ,  Takashi Hozumi

发明人： Toshimi Kawahara ,  Mamoru Suwa ,  Masanori Onodera ,  Syuichi Monma ,  Shinya Nakaseko ,  Takashi Hozumi

IPC分类号： H01L2348

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85986 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/20752 ,  H05K3/3426 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/10689 ,  Y02P70/613 ,  H01L2224/85186 ,  H01L2224/48465 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.

摘要翻译： 半导体器件包括半导体芯片，用于密封所述半导体芯片的树脂封装，以暴露方式设置在所述树脂封装的安装侧表面上的金属层和用于电连接设置在半导体芯片上的电极焊盘和金属的连接构件 层。 金属层在安装侧设置有螺柱凸块，柱凸起用作外部连接端子。

公开(公告)号：US5844309A

公开(公告)日：1998-12-01

申请号：US754061

申请日：1996-12-03

申请人： Yukio Takigawa ,  Shigeaki Yagi ,  Toshimi Kawahara ,  Mitsunada Osawa ,  Hiroyuki Ishiguro ,  Shinya Nakaseko ,  Takashi Hozumi ,  Masaaki Seki

发明人： Yukio Takigawa ,  Shigeaki Yagi ,  Toshimi Kawahara ,  Mitsunada Osawa ,  Hiroyuki Ishiguro ,  Shinya Nakaseko ,  Takashi Hozumi ,  Masaaki Seki

IPC分类号： H01L21/58 ,  H01L23/10 ,  H01L23/053

CPC分类号： H01L24/83 ,  H01L23/10 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351

摘要： An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.

摘要翻译： 一种粘合剂组合物，其包括：主要成分，其包含树脂材料，用于溶解所述主要成分的溶剂和添加到所述主要成分中的填料，其中所述填料具有使得其表面的凹凸深度 所述粘合剂组合物在所述粘合剂组合物施加到被粘物上之后等于或小于15μm，并干燥以在热压缩过程之前蒸发所述溶剂。 本发明还公开了一种使用粘合剂组合物的半导体器件，使用粘合剂组合物的粘合方法和使用该粘合剂组合物的半导体器件的制造方法。

公开(公告)号：US5804467A

公开(公告)日：1998-09-08

申请号：US855647

申请日：1997-05-13

申请人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011 ,  Y10T29/49146 ,  Y10T29/49171

摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

摘要翻译： 半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。 衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

公开(公告)号：US5679978A

公开(公告)日：1997-10-21

申请号：US330848

申请日：1994-10-24

申请人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L23/10

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011 ,  Y10T29/49146 ,  Y10T29/49171

摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

摘要翻译： 半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。 衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

公开(公告)号：US6034428A

公开(公告)日：2000-03-07

申请号：US745203

申请日：1996-11-08

申请人： Toshimi Kawahara ,  Hiroyuki Ishiguro ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Shinya Nakaseko ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Hiroyuki Ishiguro ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Shinya Nakaseko ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H05K3/40 ,  H01L23/053

CPC分类号： H01L23/3121 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/49 ,  H05K3/4084 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K2201/0394 ,  H05K2203/0195 ,  H05K2203/063

摘要： A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of insulating layers have holes. The multi-layered member has electrode parts which include deformed portions of the above one or the plurality of wiring layers obtained by deforming the above one or the plurality of wiring layers via said holes.

摘要翻译： 半导体器件包括半导体芯片和连接到半导体芯片的多层构件。 多层构件包括交替堆叠的一个或多个布线层和一个或多个绝缘层。 一个或多个绝缘层具有孔。 多层构件具有电极部件，其包括通过所述孔使上述一个或多个布线层变形而获得的上述一个或多个布线层的变形部分。

公开(公告)号：US06511620B1

公开(公告)日：2003-01-28

申请号：US09511496

申请日：2000-02-23

申请人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

发明人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

IPC分类号： B29C3318

CPC分类号： B29C33/0055 ,  B29C33/68 ,  B29C43/18 ,  B29C43/36 ,  B29C43/3642 ,  B29C43/56 ,  H01L21/566 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of producing semiconductor devices which have an excellent separability from a metal mold after resin encapsulation and thus eliminates the need to clean the metal mold. A metal mold for producing such semiconductor devices is also provided. According to the method of the present invention, the metal mold is first opened, and two separation sheets are disposed on dividing surfaces including cavity forming surfaces of a first metal mold and a second metal mold. A substrate is then placed on one of the separation sheets, with its semiconductor chip formed surface facing the second metal mold. An encapsulation resin is provided on the substrate placed on one of the separation sheets. The metal mold in a heated state is closed and pressed to form a resin layer for encapsulating electrodes formed on the substrate. The metal mold is again opened, and the resin-encapsulated substrate is taken out of the metal mold. After the separation sheets are removed, the substrate is divided into individual semiconductor devices.

摘要翻译： 一种制造半导体器件的方法，其在树脂封装之后与金属模具具有优异的可分离性，因此不需要清洁金属模具。 还提供了用于制造这种半导体器件的金属模具。 根据本发明的方法，首先打开金属模具，并且在包括第一金属模具和第二金属模具的空腔形成表面的分割表面上设置两个分离片。 然后将基板放置在一个分离片上，其半导体芯片形成表面面向第二金属模具。 在放置在一个分离片上的基板上设置封装树脂。 将处于加热状态的金属模封闭并压制以形成用于封装形成在基板上的电极的树脂层。 再次打开金属模具，将树脂封装的基板从金属模具中取出。 在分离片被去除之后，将衬底分成单独的半导体器件。

公开(公告)号：US06881611B1

公开(公告)日：2005-04-19

申请号：US09635124

申请日：2000-08-08

申请人： Norio Fukasawa ,  Toshimi Kawahara ,  Muneharu Morioka ,  Mitsunada Osawa ,  Yasuhiro Shinma ,  Hirohisa Matsuki ,  Masanori Onodera ,  Junichi Kasai ,  Shigeyuki Maruyama ,  Masao Sakuma ,  Yoshimi Suzuki ,  Masashi Takenaka

发明人： Norio Fukasawa ,  Toshimi Kawahara ,  Muneharu Morioka ,  Mitsunada Osawa ,  Yasuhiro Shinma ,  Hirohisa Matsuki ,  Masanori Onodera ,  Junichi Kasai ,  Shigeyuki Maruyama ,  Masao Sakuma ,  Yoshimi Suzuki ,  Masashi Takenaka

IPC分类号： B29C43/18 ,  H01L21/301 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L29/06 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/568 ,  B29C43/18 ,  B29C2043/3444 ,  B29C2043/3628 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/566 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L29/0657 ,  H01L2221/68377 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/85001 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1005 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0134 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

摘要翻译： 一种方法包括：树脂密封步骤，在模具20的空腔28中，将布置有凸块12的半导体元件11的基板16设置在树脂密封步骤中，将树脂35供应到凸块12的位置，使得 形成密封凸块12的树脂层13，使由树脂层13密封的凸块12的至少端部露出使突出部12的端部从树脂层13露出的突出电极曝光工序，以及分离工序 与树脂层13一起切割基板16，使得半导体元件11彼此分离。

公开(公告)号：US06507092B1

公开(公告)日：2003-01-14

申请号：US09714648

申请日：2000-11-17

申请人： Norio Fukasawa ,  Takashi Hozumi ,  Toshimi Kawahara

发明人： Norio Fukasawa ,  Takashi Hozumi ,  Toshimi Kawahara

IPC分类号： H01L23544

CPC分类号： H01L23/3114 ,  H01L21/56 ,  H01L29/0657 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10157 ,  H01L2924/15311 ,  H01L2224/05599

摘要： A semiconductor device is provided, which device includes a semiconductor chip including external terminals formed on a surface thereof and a sealing resin formed on the surface of the semiconductor chip. A contaminant film formed on the surface of said semiconductor chip has a laser-processed edge so that a peripheral portion of the surface of said semiconductor chip is bonded to the sealing resin.

摘要翻译： 提供了一种半导体器件，该器件包括其表面上形成有外部端子的半导体芯片和形成在半导体芯片的表面上的密封树脂。 形成在所述半导体芯片的表面上的污染膜具有激光加工边缘，使得所述半导体芯片的表面的周边部分结合到密封树脂。

公开(公告)号：US06469370B1

公开(公告)日：2002-10-22

申请号：US09495332

申请日：2000-02-01

申请人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

发明人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

IPC分类号： H01L2348

CPC分类号： H01L24/10 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/06 ,  H01L24/13 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/731 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： In a semiconductor device of the present invention and a production method thereof, an electronic circuit is provided in a semiconductor substrate, the electronic circuit having terminals. An internal wiring pattern is provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals. A protective layer is provided on the substrate, the protective layer covering the substrate. Vias are provided on the substrate so as to project from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate. An external wiring pattern is provided on the protective layer, the external wiring pattern being connected to the vias. Projection electrodes are connected to the external wiring pattern, the projection electrodes having a predetermined height above the external wiring pattern. An enclosure layer of a resin material is provided on the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.

摘要翻译： 在本发明的半导体器件及其制造方法中，电子电路设置在半导体衬底中，该电子电路具有端子。 内部布线图案设置在基板中，内部布线图案连接到电子电路端子。 保护层设置在基板上，保护层覆盖基板。 在基板上设置通孔，从保护层突出，通孔在基板的任意位置连接到内部布线图案。 外部布线图案设置在保护层上，外部布线图形与通孔相连。 投射电极连接到外部布线图案，突起电极在外部布线图案上方具有预定的高度。 树脂材料的外壳层设置在保护层上，外壳层覆盖突起电极的侧面和外部布线图案的外表面。