摘要:
A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet. The method then provides for retracting the punch until the punch face is substantially coplanar with the orifice member second surface, and then cleaning the punch face and coplanar orifice member second surface to remove any residual paste thereon.
摘要:
An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
摘要:
An apparatus and method is provided for forming a punch retaining ball at the end of a wire to form a headed punch pin for making vias in greensheets comprising advancing the wire through a die, contacting the end of the wire with a movable electrode which forms the ball by completing an electrical circuit with the wire and the electrode, after which the wire is retracted so that the formed punch pin is restrained from movement by the die and is cut forming the punch pin. A formed punch pin collection device is also provided as is a defective punch pin removal device. After the formation and removal from the apparatus of a formed punch pin or a reject defective punch pin, the apparatus is moved to its starting position and again activated to advance the wire through the die and the above procedure repeated.
摘要:
In a laser cavity having an optical axis, a laser medium for forming a laser beam, the laser medium having a central axis off-set from the optical axis, the laser medium exhibiting focusing characteristics that vary with changes in optical power pumped into the laser medium, at least one pair of mirrors oppositely positioned for reflecting at least a portion of the laser beam, one of the mirrors being an output coupler, the laser cavity further comprising at least one focusing element having a central axis positioned between one of the mirrors and the laser medium such that the central axis of the focusing element is displaced from the optical axis a distance that is a function of the displacement of the laser medium central axis from the optical axis and the optical axis passes through the focusing element to substantially eliminate lensing effects produced by the laser medium.
摘要:
The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.
摘要:
An apparatus tool for filling vias in a product greensheet and/or repairing vias in a product greensheet. The apparatus tool utilizes a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The apparatus tool employs position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the repair or fill method. The product greensheet is held by a vacuum plate.
摘要:
An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
摘要:
An apparatus and method are provided for loading punch pins into a punch pin holding plate of a gang-punch apparatus wherein an individual punch pin is removed from a preloaded punch pin holder or supply plate, transferred to a load station which precisely locates the punch pin shank over the pre-drilled hole in the punch pin holding plate while holding the punch perpendicular and coaxial to the hole and pushes the punch into the punch pin holding plate. A vision system is used to align the hole in the punch pin holding plate and to verify that the punch pin is properly loaded into the holding plate. The above sequence for individual punches is repeated until the desired number of punch pins are transferred from the preloaded holder to the punch pin holding plate.
摘要:
A punched slug removal system for punching a slug from a workpiece and removing the punched slug. The system includes a punch having a reciprocating travel path with a transition point where the punch changes direction. A die plate has an aperture into which a die bushing may be disposed. The die bushing provides support for the workpiece and has an opening through which the punch and a slug pass. A manifold supports the die plate and (if present) the die bushing and has a distribution channel and an orifice which direct a gas flow onto a slug attached to the punch in a direction perpendicular to the reciprocating travel path of the punch to remove the slug from the punch. The distribution channel is tapered to increase the velocity of the gas flow. The orifice is positioned at the top of the manifold adjacent the transition point of the reciprocating travel path of the punch. The manifold extends into the aperture of the die plate, reducing the cross sectional area of the aperture, and has a step formed under the punch. The system also includes a vacuum, offset relative to the punch and applied to the side of the punch opposite the orifice, to enhance removal of slugs from the punch.
摘要:
A method to repair Aluminum Nitride (AlN) substrates is disclosed wherein a frequency doubled Q-switched Nd:YAG laser is used to remove unwanted metallurgy. The substrate is place in a liquid filled work chamber which acts to prevent metallic species of AlN from forming. The repair site can be sealed with a novel polymer coating to prevent contamination or corrosion. Repairs can be made to buried or surface metallurgy.