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公开(公告)号：USD321338S
公开(公告)日：1991-11-05
申请号：US443410
申请日：1989-11-30
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公开(公告)号：US08941804B2
公开(公告)日：2015-01-27
申请号：US13990891
申请日：2011-12-21
IPC分类号： G02F1/136 , G02F1/1343 , G02F1/1362
CPC分类号： G02F1/134336 , G02F1/136227 , G02F2201/40
摘要： Arbitrary one pixel P (contact hole pixel (13)) is selected in a predetermined demarcated area (20) of the liquid crystal display device of the present invention. The pixel P is (i) any of four pixels Q1 through Q4 (contact hole pixels (13)) closest to another pixel P or (ii) (a) contained in a quadrangle whose vertices correspond to respective four pixels Q1 through Q4 closest to the pixel P and (b) any of four pixels Q1 through Q4 closest to another pixel P. Further, two diagonal lines of a quadrangle formed by four pixels Q1 through Q4 are inclined at respective two angles with respect to a gate bus line (line segment A-B), and a difference between the two angles is smaller than 30 degrees. Moreover, the contact hole pixels (13) are provided for respective source bus lines in the predetermined demarcated area (20).
摘要翻译： 在本发明的液晶显示装置的预定分界区域（20）中选择任意一个像素P（接触孔像素（13））。 像素P是（i）最靠近另一个像素P或（ii）（a）的四个像素Q1至Q4（接触孔像素（13））中的任一个，其包含在四边形中，其顶点对应于最接近于的四个像素Q1至Q4 像素P和（b）最靠近另一个像素P的四个像素Q1至Q4中的任何一个。另外，由四个像素Q1至Q4形成的四边形的两个对角线相对于栅极总线（线路）以相应的两个角度倾斜 段AB），并且两个角度之间的差小于30度。 此外，为预定的划定区域（20）中的各个源极总线设置接触孔像素（13）。
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公开(公告)号：US20130271715A1
公开(公告)日：2013-10-17
申请号：US13990891
申请日：2011-12-21
IPC分类号： G02F1/1343
CPC分类号： G02F1/134336 , G02F1/136227 , G02F2201/40
摘要： Arbitrary one pixel P (contact hole pixel (13)) is selected in a predetermined demarcated area (20) of the liquid crystal display device of the present invention. The pixel P is (i) any of four pixels Q1 through Q4 (contact hole pixels (13)) closest to another pixel P or (ii) (a) contained in a quadrangle whose vertices correspond to respective four pixels Q1 through Q4 closest to the pixel P and (b) any of four pixels Q1 through Q4 closest to another pixel P. Further, two diagonal lines of a quadrangle formed by four pixels Q1 through Q4 are inclined at respective two angles with respect to a gate bus line (line segment A-B), and a difference between the two angles is smaller than 30 degrees. Moreover, the contact hole pixels (13) are provided for respective source bus lines in the predetermined demarcated area (20).
摘要翻译： 在本发明的液晶显示装置的预定分界区域（20）中选择任意一个像素P（接触孔像素（13））。 像素P是（i）最靠近另一个像素P或（ii）（a）的四个像素Q1至Q4（接触孔像素（13））中的任一个，其包含在四边形中，其顶点对应于最接近于的四个像素Q1至Q4 像素P和（b）最靠近另一个像素P的四个像素Q1至Q4中的任何一个。另外，由四个像素Q1至Q4形成的四边形的两个对角线相对于栅极总线（线路）以相应的两个角度倾斜 段AB），并且两个角度之间的差小于30度。 此外，为预定的划定区域（20）中的各个源极总线设置接触孔像素（13）。
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公开(公告)号：US06756252B2
公开(公告)日：2004-06-29
申请号：US10197165
申请日：2002-07-17
申请人： Noboru Nakanishi
发明人： Noboru Nakanishi
IPC分类号： H01L2144
CPC分类号： H01L23/5389 , H01L24/11 , H01L24/24 , H01L24/25 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/13099 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/73267 , H01L2224/82007 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00015 , H01L2924/00011 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method for creating electrical interconnects between a semiconductor die and package. In the preferred embodiment, an insulating material is applied over the die and extends to the substrate contact pads, leaving a portion of each contact pad exposed. Holes are then trimmed through the insulating material, exposing at least a portion of each die bond pad. A conductive material is then applied over the die, flowing into the holes, contacting the die bond pads, and extending out to contact at least a portion of each substrate contact pad. In another preferred embodiment, an electrically conductive bump may be formed on each die bond pad, protruding through said non-conductive material and at least partially through said conductive material. The conductive layer is then laser trimmed, forming conductive patches that serve as electrical interconnects between the die and package substrate.
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公开(公告)号：US5996921A
公开(公告)日：1999-12-07
申请号：US035581
申请日：1998-03-05
IPC分类号： A01K89/0155 , A01K89/02
CPC分类号： A01K89/0155
摘要： A centrifugal braking apparatus for a baitcasting reel comprises a spool, pivot shafts, brake levers, and a ring-shaped braking member. The spool is rotatably supported between both side plates of a reel main body. Each of the pivot shafts is disposed on the spool so as to be arranged apart from a rotation axis of the spool in a radius direction thereof and extended at right angles to a straight line parallel with the rotation axis of the spool. Each of the brake levers has a tip end portion and a root end portion that is pivotably supported by the pivot shaft so that the tip end portion of the brake lever is movable toward a standard plane, which includes a central axis of the pivot shaft and is perpendicular to the rotation axis of the spool, under a function of centrifugal force produced by rotation of the spool. The ring-shaped braking member is provided on the reel main body so that the tip end portion of the brake lever can be brought into contact with the ring-shaped braking member.
摘要翻译： 用于诱饵卷轴的离心式制动装置包括一个线轴，枢轴，制动杆和一个环形制动部件。 线轴可旋转地支撑在卷轴主体的两个侧板之间。 每个枢转轴设置在卷轴上，以便在卷轴的径向方向上与卷轴的旋转轴线分开，并且与卷轴的旋转轴线平行的直线成直角地延伸。 每个制动杆具有尖端部分和根部端部，其由枢轴可枢转地支撑，使得制动杆的前端部分能够朝向包括枢转轴的中心轴线的标准平面移动，并且 垂直于阀芯的旋转轴线，在由阀芯旋转产生的离心力的作用下。 环形制动构件设置在卷轴主体上，使得制动杆的前端部能够与环形制动构件接触。
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公开(公告)号：US5952308A
公开(公告)日：1999-09-14
申请号：US919543
申请日：1992-07-24
申请人： Noboru Nakanishi , Yoshio Kitada
发明人： Noboru Nakanishi , Yoshio Kitada
CPC分类号： C07H3/06 , C08B37/0045
摘要： A mineral absorption promoting agent containing oligouronic acid, e. g. oligogalacturonic acid or oligomannuronic acid �degree of polymerization (n)=1 to 9! is described. Since this oligouronic acid �polymerization degree (n)=1 to 9! forms a complex with mineral, it promotes absorption of minerals into living organisms by simply adding it to foods, drinks or pharmacentical compositions for oral use. Since the agent has no problem with safety, the agent is suitable for repeated eating, drinking or taking, and the agent is very effective.
摘要翻译： 含有寡聚酸的矿物吸收促进剂， G。 寡聚半乳糖醛酸或寡聚乙醛酸[聚合度（n）= 1〜9]。 由于这种寡聚酸[聚合度（n）= 1〜9]与矿物形成复合物，所以通过简单地将其添加到口服使用的食品，饮料或药物组合物中，可以促进矿物质对生物体的吸收。 由于代理商安全无问题，代理商适合重复饮食，服用，代理人非常有效。
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公开(公告)号：USD327669S
公开(公告)日：1992-07-07
申请号：US481463
申请日：1990-02-15
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公开(公告)号：US20100269333A1
公开(公告)日：2010-10-28
申请号：US12766679
申请日：2010-04-23
IPC分类号： H05K3/30
CPC分类号： H05K3/328 , H01L23/49838 , H01L24/13 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/97 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81205 , H01L2224/81801 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/111 , H05K2201/09418 , H05K2201/10674 , H05K2203/0285 , Y02P70/611 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The objective of this invention is to provide an ultrasonic flip-chip mounting method with little variance in the formed electrode joints between a semiconductor chip and a substrate. The ultrasonic method for mounting a flip chip of the present invention may include a step for forming several bump electrodes (106) on the main surface of one side of a semiconductor chip (100) and a step for respectively bringing several projecting electrodes (106) into contact with the corresponding conductor patterns (132) on a substrate and for applying ultrasonic vibration to the semiconductor chip, where the ultrasonic vibration direction is oriented in a direction oblique to the electrode patterns (132). In this way, an effective width for joining formation W1 is greater than the width of the conductor patterns W of the electrode patterns (132).
摘要翻译： 本发明的目的是提供一种在半导体芯片和基板之间的形成的电极接头中几乎没有差异的超声波倒装芯片安装方法。 用于安装本发明的倒装芯片的超声波方法可以包括在半导体芯片（100）的一侧的主表面上形成多个凸起电极（106）的步骤和分别带有几个突出电极（106）的步骤， 与基板上的相应的导体图案（132）接触并且用于对半导体芯片施加超声波振动，其中超声波振动方向在与电极图案（132）相反的方向上取向。 以这种方式，用于接合结构W1的有效宽度大于电极图案（132）的导体图案W的宽度。
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公开(公告)号：US20100255641A1
公开(公告)日：2010-10-07
申请号：US12756053
申请日：2010-04-07
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L24/75 , H01L24/81 , H01L24/83 , H01L25/105 , H01L2224/0401 , H01L2224/05568 , H01L2224/05624 , H01L2224/1134 , H01L2224/13082 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/16225 , H01L2224/16237 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/75611 , H01L2224/7565 , H01L2224/81092 , H01L2224/81097 , H01L2224/81191 , H01L2224/81193 , H01L2224/81205 , H01L2224/814 , H01L2224/8309 , H01L2224/83097 , H01L2224/83104 , H01L2225/1023 , H01L2225/1058 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2924/3512 , H01L2224/05552 , H01L2924/00012
摘要： The objective of this invention is to present a semiconductor device manufacturing method with which the formation of voids inside an underfill resin can be prevented using a simple configuration. The semiconductor device manufacturing method of the present invention involves a step in which multiple electrodes formed on one principal surface of each semiconductor chip 20 are flip-chip bonded to corresponding conductive areas formed on a substrate, a step (condition 1) in which liquid underfill resin 40 is supplied along the circumferences of semiconductor chips 20 mounted on the substrate in the atmospheric pressure so as to form air pocket 110 between each semiconductor chip 20 and substrate 30, a step (conditions 2, 3, 4) in which the substrate is transferred from the atmospheric pressure into a vacuum atmosphere in order to discharge the air from air pockets 110, and a step (conditions 5, 6, 7, 8) in which the substrate is transferred from the vacuum atmosphere into the atmospheric pressure in order to let underfill resin 40 advance deep in the semiconductor chips.
摘要翻译： 本发明的目的是提供一种半导体器件制造方法，利用该半导体器件制造方法，可以使用简单的构造来防止底部填充树脂内的空隙的形成。 本发明的半导体器件制造方法涉及将形成在各半导体芯片20的一个主面上的多个电极倒装贴合在形成于基板上的相应的导电区域的步骤，其中液体底部填充的步骤（条件1） 树脂40沿着大气压下安装在基板上的半导体芯片20的周边供给，以便在每个半导体芯片20和基板30之间形成气袋110，其中基板为 从空气压力转移到真空气氛中以从气穴110排出空气，以及将基板从真空气氛转移到大气压中的步骤（条件5,6,7,8），以便 让底部填充树脂40在半导体芯片中深入。
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公开(公告)号：USD321337S
公开(公告)日：1991-11-05
申请号：US444332
申请日：1989-12-01
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