摘要:
A semiconductor device includes a plurality of core chips and an interface chip that controls the core chips. Each of the core chips and the interface chip includes plural through silicon vias that penetrate a semiconductor substrate and plural pads respectively connected to the through silicon vias. The through silicon vias include a through silicon via of a power source system to which a power source potential or a ground potential is supplied, and a through silicon via of a signal system to which various signals are supplied. Among the pads, at least an size of a pad connected to the through silicon via of the power source system is larger than a size of a pad connected to the through silicon via of the signal system. Therefore, a larger parasitic capacitance can be secured.
摘要:
A method for designing a semiconductor package is disclosed, wherein the semiconductor package comprises a semiconductor chip and an adjustment target. A first target variable is calculated in consideration of a first transition state where an output level of the semiconductor chip changes from a low level to a high level. A second target variable is calculated in consideration of a second transition state where an output level of the semiconductor chip changes from the high level to the low level. Inferior one of the first and the second target variables is selected as a main target variable. The main target variable and a predetermined constraint represented in frequency domain are compared to decide design guidelines for the adjustment target.
摘要:
Correction circuit models are acquired for correcting electrical characteristic parameters that change upon mounting on a board. The correction circuit models are added to a separate model that represents a separate semiconductor device in isolation to create a semiconductor device model that represents the semiconductor device in a board-mounted state. An equivalent circuit model that represents an adjustment-object system is connected to the semiconductor device model that was created, and based on the semiconductor device model to which the equivalent circuit model is connected, adjustment-object values relating to the adjustment-object system are calculated. These adjustment-object values are compared with limit values that were determined in advance, and based on the results of comparison, a design guide is determined for adjusting the adjustment-object system.
摘要:
A semiconductor device reduces the impedance of a wiring for supplying the circuit excluding a data output circuit with a power source voltage or a ground voltage and of speedup of data signal transmission in the data output circuit. Additional substrates 2a, 2b are on the upper surface of semiconductor chip 1. First additional wiring layer for power source 10d and first additional wiring layer for ground 10s formed on respective additional substrates 2a, 2b form prescribed conductive areas on semiconductor chip 1. First power source wiring 40C1d or first ground wiring 40C1s are interconnected through additional wiring layers 10d and 10s. Second power source wiring 40C2d and second ground wiring 40C2s, which is extended in the same direction as with DQ system signal wiring 40CDQ, forms a feedback current path. Second power source wiring 40C2d and second ground wiring 40C2s are disposed adjacent to DQ system signal wiring 40CDQ.
摘要:
The fixing device according to the embodiment includes a fixing member which is heated at predetermined temperature for a fixing, a press member which is configured to move relative to the fixing member and to contact with the fixing member so as to transport an image bearing medium by cooperating with the fixing member during a fixing, driving member which moves the fixing member and press member in a plurality of speeds including predetermined speed for during the fixing, pressure change member which is configured to change a pressure between the fixing member and the press member, and control member which controls the driving member and the pressure change member, when the fixing member and the press member are idle for fixing, to reduce the pressure and the speed of the fixing member and the press member compared with during the fixing.
摘要:
An embodiment provides an image forming apparatus including: a job acquiring unit that acquires an image forming job that gives instructions for performing forming of an image; an image forming process control unit that controls performance of the image forming job that the job acquiring unit acquires; a temperature information acquiring unit that acquires information showing temperature of the heating rotary body; a determining unit that determines whether the temperature of the heating rotary body which is acquired by the temperature information acquiring unit is equal to or higher than a predetermined stand-by temperature set as a temperature in a stand-by state that stands by to perform the image forming process, when the image forming process is completed, based on the image forming job by the image forming process control unit; and a fixing device control unit, which controls the fixing device, performs a first stand-by control process that increases the temperature of the heating rotary body to the stand-by temperature by heating the heating rotary body with the heating member while rotating the heating rotary body with the heating rotary body and the pressing body in contact, when the determining unit determines that the temperature of the heating rotary body is lower than the stand-by temperature. Further, the fixing device control unit stops the rotation of the heating rotary body and performs a second stand-by control process that makes the fixing device stand by, without heating the heating rotary body with the heating member, when the determining unit determines that the temperature of the heating rotary body is the stand-by temperature or higher.
摘要:
A method for designing a semiconductor package is disclosed, wherein the semiconductor package comprises a semiconductor chip and an adjustment target. A first target variable is calculated in consideration of a first transition state where an output level of the semiconductor chip changes from a low level to a high level. A second target variable is calculated in consideration of a second transition state where an output level of the semiconductor chip changes from the high level to the low level. Inferior one of the first and the second target variables is selected as a main target variable. The main target variable and a predetermined constraint represented in frequency domain are compared to decide design guidelines for the adjustment target.
摘要:
An image-forming apparatus includes a rotary developing device including a casing having absolute value of the surface potential of not larger than 300 V.
摘要:
Disclosed is an image-forming apparatus comprising a rotary developing device including a casing having absolute value of the surface potential of not larger than 300 V.
摘要:
A wiring substrate and a semiconductor chip mounted on the wiring substrate are connected together via a bonding wire. The distance from each end of the semiconductor chip to a wire bond pad provided on the wiring substrate is smaller than the height of the semiconductor chip.