公开(公告)号：US20240421169A1

公开(公告)日：2024-12-19

申请号：US18820297

申请日：2024-08-30

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey PUNZALAN ,  IL Kwon SHIM

IPC: H01L27/146

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die region with a die attached thereto. An encapsulant is disposed to cover encapsulation region of the package substrate. A protective cover is disposed over the die and attached to the encapsulant by a cover adhesive. The protective cover is supported by a lower portion of step shaped inner encapsulant sidewalls.

公开(公告)号：US12166050B2

公开(公告)日：2024-12-10

申请号：US17478978

申请日：2021-09-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Il Kwon Shim

IPC: H01L27/146 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover with a cover adhesive is disposed over a sensor region of the die and attached to the die by the cover adhesive. The cover adhesive is disposed in a cap bonding region of the protective cover.

公开(公告)号：US20240136217A1

公开(公告)日：2024-04-25

申请号：US18490741

申请日：2023-10-18

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Hua Hong Tan ,  Chee Kay Chow ,  Zong Xiang Cai ,  Wei Ming Xian ,  Yao Hong Wu ,  Wing Keung Lam

IPC: H01L21/683 ,  H01L21/48 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/6838 ,  H01L21/4867 ,  H01L21/6715 ,  H01L21/67259 ,  H01L21/67736 ,  H01L21/67742 ,  H01L21/67766

Abstract: A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.

公开(公告)号：US20230377896A1

公开(公告)日：2023-11-23

申请号：US18319452

申请日：2023-05-17

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jackson Fernandez Rosario ,  Enrique E. Sarile Jr ,  Dzafir Bin Mohd Shariff ,  Ronnie M. De Villa ,  Chan Loong Neo ,  Phongsak Sawasdee

IPC: H01L21/3065 ,  H01L21/683 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/3065 ,  H01L21/6836 ,  H01L23/3107 ,  H01L23/4952 ,  H01L24/48 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/48247 ,  H01L2924/181

Abstract: Disclosed is a plasma diced die from the backside of the wafer using a back surface mask layer. The back surface mask layer remains on the backside of the die, serving as backside protection for the die. The plasma dicing may dice the wafer completely or partially. In the case of partial dicing, the partially diced wafer is expanded to singulate the wafer into individual dies by lateral force.

公开(公告)号：US11804416B2

公开(公告)日：2023-10-31

申请号：US17444611

申请日：2021-08-06

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Saravuth Sirinorakul ,  Preecha Joymak ,  Natawat Kasikornrungroj ,  Wasu Aingkaew ,  Kawin Saiubol ,  Thanawat Jaengkrajarng

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/3185 ,  H01L21/565 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32155 ,  H01L2924/10157

Abstract: A semiconductor device has a semiconductor die with a sensor and a cavity formed into a first surface of the semiconductor die to provide access to the sensor. A protective layer is formed on the first surface of the semiconductor die around the cavity. An encapsulant is deposited around the semiconductor die. The protective layer blocks the encapsulant from entering the cavity. With the cavity clear of encapsulant, liquid or gas has unobstructed entry into cavity during operation of the semiconductor die. The clear entry for the cavity provides reliable sensor detection and measurement. The semiconductor die is disposed over a leadframe. The semiconductor die has a sensor. The protective layer can be a film. The protective layer can have a beveled surface. A surface of the leadframe can be exposed from the encapsulant. A second surface of the semiconductor die can be exposed from the encapsulant.

公开(公告)号：US11710681B2

公开(公告)日：2023-07-25

申请号：US17495788

申请日：2021-10-06

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Tanawan Chaowasakoo ,  Hua Hong Tan ,  Alexander Lucero Laylo ,  Thanawat Jaengkrajarng

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L25/07 ,  H01L21/56

CPC classification number: H01L23/49513 ,  H01L23/3128 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/49 ,  H01L24/83 ,  H01L24/84 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/50 ,  H01L21/56 ,  H01L23/3107 ,  H01L2224/32245 ,  H01L2224/8384 ,  H01L2224/83815 ,  H01L2224/8484 ,  H01L2224/84815 ,  H01L2924/181

Abstract: An embodiment related to a device. The device includes a first die with first and second die surfaces. The second die surface is bonded to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad. The device also includes a first clip bond including a first clip bond horizontal planar portion attached to the first die contact pad on the first die surface, and a first clip bond vertical portion disposed on an edge of the first clip bond horizontal planar portion. The first clip bond vertical portion is attached to a first substrate bond pad on the first substrate surface. The device further includes a first conductive clip-die bonding layer with spacers on the first die contact pad of the first die. The first conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the first die contact pad, and the spacers maintain a uniform Bond Line Thickness (BLT) of the first conductive clip-die bonding layer.

公开(公告)号：US20230192478A1

公开(公告)日：2023-06-22

申请号：US18058565

申请日：2022-11-23

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Phongsak Sawasdee

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0061 ,  B81B7/0064 ,  B81B7/0074 ,  B81C1/00309 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/07 ,  B81C2203/0145

Abstract: A semiconductor device includes a substrate. A first semiconductor die including a microelectromechanical system (MEMS) is disposed over the substrate. A lid is disposed on the substrate around the first semiconductor die. A first encapsulant is deposited over the substrate and lid. A second encapsulant is deposited into the lid.

公开(公告)号：US20230154795A1

公开(公告)日：2023-05-18

申请号：US18054547

申请日：2022-11-11

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Dzafir Bin Mohd Shariff ,  IL KWON SHIM ,  Enrique Jr Sarile ,  Jackson Fernandez Rosario ,  Ronnie M. De Villa ,  Chan Loong Neo

IPC: H01L21/78 ,  H01L21/308

CPC classification number: H01L21/78 ,  H01L21/3086 ,  H01L21/3085 ,  H01L21/3081

Abstract: The present disclosure relates to plasma dicing of wafer. More specifically, the present disclosure is directed to frame masks and methods for plasma dicing wafers utilizing frame masks. The frame mask includes a mask frame, wherein the mask frame includes a top ring mask support and a side ring mask support. A plurality of mask segments suspended from the top ring mask support by segment supports, the mask segments are configured to define dicing channels on a blank wafer. The frame mask is configured to removably sit onto a frame lift assembly in a plasma chamber of a plasma dicing tool, when fitted onto the frame lift assembly, the mask segments are disposed above a wafer on a wafer ring frame for plasma dicing. The mask frame is configured to enable flow of plasma therethrough to the wafer to etch the wafer to form dicing channels defined by the mask segments.

公开(公告)号：US20220208686A1

公开(公告)日：2022-06-30

申请号：US17643244

申请日：2021-12-08

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Natawat Kasikornrungroj ,  Phongsak Sawasdee ,  Wannasat Panphrom

IPC: H01L23/538 ,  H01L23/495 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor device has a leadframe and a first electrical component including a first surface disposed on the leadframe. A first clip bond is disposed over a second surface of the first electrical component. The first clip bond extends vertically through the semiconductor device. The first clip bond has a vertical member, horizontal member connected to the vertical member, die contact integrated with the horizontal member, and clip foot extending from the vertical member. A second electrical component has a first surface disposed on the first clip bond. A second clip bond is disposed over a second surface of the second electrical component opposite the first surface of the second electrical component. An encapsulant is deposited around the first electrical component and first clip bond. A second electrical component is disposed over the encapsulant. The clip foot is exposed from the encapsulant.

公开(公告)号：US20220028762A1

公开(公告)日：2022-01-27

申请号：US17495788

申请日：2021-10-06

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Tanawan CHAOWASAKOO ,  Hua Hong TAN ,  Alexander Lucero LAYLO ,  Thanawat JAENGKRAJARNG

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/00 ,  H01L25/07 ,  H01L25/065

Abstract: An embodiment related to a device. The device includes a first die with first and second die surfaces. The second die surface is bonded to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad. The device also includes a first clip bond including a first clip bond horizontal planar portion attached to the first die contact pad on the first die surface, and a first clip bond vertical portion disposed on an edge of the first clip bond horizontal planar portion. The first clip bond vertical portion is attached to a first substrate bond pad on the first substrate surface. The device further includes a first conductive clip-die bonding layer with spacers on the first die contact pad of the first die. The first conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the first die contact pad, and the spacers maintain a uniform Bond Line Thickness (BLT) of the first conductive clip-die bonding layer.