公开(公告)号：USD834367S1

公开(公告)日：2018-11-27

申请号：US29563982

申请日：2016-05-10

申请人： Yu-Min Tsai

设计人： Yu-Min Tsai

公开(公告)号：US07436526B2

公开(公告)日：2008-10-14

申请号：US11669165

申请日：2007-01-31

申请人： Wen-Li Tsai ,  Yu-Min Tsai ,  Hsiao-Che Wu

发明人： Wen-Li Tsai ,  Yu-Min Tsai ,  Hsiao-Che Wu

IPC分类号： B29C65/00 ,  B29C65/02 ,  B32B37/00 ,  B32B38/00 ,  C23C16/52 ,  C23C14/54 ,  G01B11/14 ,  G01B11/28

CPC分类号： C23C14/544 ,  G01B11/0625 ,  G01B11/0675 ,  G01B11/0683 ,  H01L22/12 ,  H01L22/20

摘要： A real-time system adapted to a PVD apparatus for monitoring and controlling film uniformity is described. The system includes a shielding plate, a monitoring device, and a data processing program. The shielding plate is disposed on an inner wall of a reaction chamber above a wafer stage. An opening in the center of the shielding plate exposes the wafer. The monitoring device including a scanner and a sensor respectively disposed on opposite sidewalls of the reaction chamber between the shielding plate and the wafer stage is used for measuring the flux of the particles on every portion of the wafer to acquire real-time uniformity data including a function of the wafer position and the flux. The data processing program compares the real-time uniformity data and reference uniformity data, and a feedback signal is outputted to the PVD apparatus to adjust the process parameter thereof for controlling film uniformity.

摘要翻译： 描述了适用于监测和控制膜均匀性的PVD设备的实时系统。 该系统包括屏蔽板，监视装置和数据处理程序。 屏蔽板设置在晶片台上方的反应室的内壁上。 屏蔽板中心的开口露出晶片。 包括扫描仪和分别设置在屏蔽板和晶片台之间的反应室的相对侧壁上的传感器的监视装置用于测量晶片每一部分上的颗粒的通量，以获得实时均匀性数据，包括 晶圆位置和通量的功能。 数据处理程序比较实时均匀性数据和参考均匀性数据，并且将反馈信号输出到PVD装置以调整其处理参数以控制膜均匀性。

公开(公告)号：US20080118631A1

公开(公告)日：2008-05-22

申请号：US11669165

申请日：2007-01-31

申请人： Wen-Li Tsai ,  Yu-Min Tsai ,  Hsiao-Che Wu

发明人： Wen-Li Tsai ,  Yu-Min Tsai ,  Hsiao-Che Wu

IPC分类号： B05C11/00 ,  C23C14/54

CPC分类号： C23C14/544 ,  G01B11/0625 ,  G01B11/0675 ,  G01B11/0683 ,  H01L22/12 ,  H01L22/20

摘要： A real-time system adapted to a PVD apparatus for monitoring and controlling film uniformity is described. The system includes a shielding plate, a monitoring device, and a data processing program. The shielding plate is disposed on an inner wall of a reaction chamber above a wafer stage. An opening in the center of the shielding plate exposes the wafer. The monitoring device including a scanner and a sensor respectively disposed on opposite sidewalls of the reaction chamber between the shielding plate and the wafer stage is used for measuring the flux of the particles on every portion of the wafer to acquire real-time uniformity data including a function of the wafer position and the flux. The data processing program compares the real-time uniformity data and reference uniformity data, and a feedback signal is outputted to the PVD apparatus to adjust the process parameter thereof for controlling film uniformity.

摘要翻译： 描述了适用于监测和控制膜均匀性的PVD设备的实时系统。 该系统包括屏蔽板，监视装置和数据处理程序。 屏蔽板设置在晶片台上方的反应室的内壁上。 屏蔽板中心的开口露出晶片。 包括扫描仪和分别设置在屏蔽板和晶片台之间的反应室的相对侧壁上的传感器的监视装置用于测量晶片每一部分上的颗粒的通量，以获得实时均匀性数据，包括 晶圆位置和通量的功能。 数据处理程序比较实时均匀性数据和参考均匀性数据，并且将反馈信号输出到PVD装置以调整其处理参数以控制膜均匀性。

公开(公告)号：US06554149B2

公开(公告)日：2003-04-29

申请号：US09911349

申请日：2001-07-23

申请人： Paul A. Schneider ,  Yu-Min Tsai

发明人： Paul A. Schneider ,  Yu-Min Tsai

IPC分类号： B65D626

CPC分类号： A45C7/0077 ,  B65D37/00 ,  D06F95/002

摘要： A collapsible container includes a cylindrical sidewall extending between a top and a bottom of the container. The sidewall is formed of a flexible material which enables the container to be opened to an expanded configuration or closed to a collapsed configuration. A coil spring biases the container to the open configuration. The coil spring has a top coil adjacent the top of the container and a bottom coil adjacent the bottom of the container. A durable bottom layer is affixed to the bottom of the container by at least one clamp.

摘要翻译： 可折叠容器包括在容器的顶部和底部之间延伸的圆柱形侧壁。 侧壁由柔性材料形成，其使得容器能够被打开到膨胀构型或者闭合到收缩构型。 螺旋弹簧将容器偏压到打开构型。 螺旋弹簧具有邻近容器顶部的顶部线圈和邻近容器底部的底部线圈。 耐用的底层通过至少一个夹具固定到容器的底部。

公开(公告)号：US20080132053A1

公开(公告)日：2008-06-05

申请号：US11566166

申请日：2006-12-01

申请人： Hsiao Che Wu ,  Yu Min Tsai ,  Wen Li Tsai

发明人： Hsiao Che Wu ,  Yu Min Tsai ,  Wen Li Tsai

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/522 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/0517 ,  H01L2224/05176 ,  H01L2224/05178 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/0567 ,  H01L2224/05676 ,  H01L2224/05678 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05686 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/0476 ,  H01L2924/0479 ,  H01L2924/0475 ,  H01L2924/0474 ,  H01L2924/0483 ,  H01L2924/0496 ,  H01L2924/01014 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2924/048

摘要： An integrated circuit device comprises a substrate, a stack structure including circuit structure having conductive lines positioned on the substrate, a reinforcement structure including at least one supporting member positioned on the substrate and a roof covering the circuit structure and the supporting member and at least one bonding pad positioned on the roof and electrically connected to the conductive lines. A method for preparing an integrated circuit device comprises forming a stack structure including circuit structure having conductive lines on a substrate, forming a reinforcement structure including at least one supporting member on the substrate and a roof covering the supporting member and the circuit structure and forming at least one bonding pad on the roof and electrically connecting to the conductive lines.

摘要翻译： 集成电路装置包括基板，包括具有位于基板上的导线的电路结构的堆叠结构，包括位于基板上的至少一个支撑构件和覆盖电路结构和支撑构件的顶板的加强结构以及至少一个 接合垫定位在屋顶上并电连接到导电线。 一种集成电路器件的制造方法，其特征在于，在基板上形成具有导线的电路结构的堆叠结构，形成包括所述基板上的至少一个支撑部件的加强结构以及覆盖所述支撑部件和所述电路结构的屋顶， 至少一个焊盘在屋顶上并且电连接到导电线。

公开(公告)号：US20080102207A1

公开(公告)日：2008-05-01

申请号：US11715619

申请日：2007-03-08

申请人： Yu-Min Tsai ,  Hsiao-Che Wu ,  Wen-Li Tsai

发明人： Yu-Min Tsai ,  Hsiao-Che Wu ,  Wen-Li Tsai

IPC分类号： C23C16/00 ,  F16K21/00

CPC分类号： C23C16/45565 ,  C23C16/45572 ,  C23C16/481 ,  H01L21/67109 ,  H01L21/67115 ,  Y10T137/9464

摘要： A gas delivering system for an in situ thermal treatment, a thin film deposition and a use of the same are provided. The gas delivering system integrates a thermal treatment system therein so that a thin film deposition and a by rapid thermal annealing can be performed alternatively on a wafer in a reaction chamber. Accordingly, the density of the thin film can be improved and the thermal budget of the process can be reduced.

摘要翻译： 提供了一种用于原位热处理，薄膜沉积及其使用的气体输送系统。 气体输送系统将其中的热处理系统集成在一起，可以在反应室中的晶片上交替地进行薄膜沉积和快速热退火。 因此，可以提高薄膜的密度，并且可以降低该方法的热预算。

公开(公告)号：US20080128892A1

公开(公告)日：2008-06-05

申请号：US11566160

申请日：2006-12-01

申请人： Hsiao Che Wu ,  Yu Min Tsai ,  Wen Li Tsai

发明人： Hsiao Che Wu ,  Yu Min Tsai ,  Wen Li Tsai

IPC分类号： H01L23/48

CPC分类号： H01L24/11 ,  H01L23/522 ,  H01L23/5329 ,  H01L23/53295 ,  H01L23/562 ,  H01L23/585 ,  H01L24/03 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/00

摘要： An integrated circuit device comprises a substrate, a stack structure including circuit structure having conductive lines positioned on the substrate, a reinforcement structure including at least one supporting member positioned on the substrate and a roof covering the circuit structure and the supporting member and at least one bonding pad positioned on the roof and electrically connected to the conductive lines. A method for preparing an integrated circuit device comprises forming a stack structure including circuit structure having conductive lines on a substrate, forming a reinforcement structure including at least one supporting member on the substrate and a roof covering the supporting member and the circuit structure and forming at least one bonding pad on the roof and electrically connecting to the conductive lines.

摘要翻译： 集成电路装置包括基板，包括具有位于基板上的导线的电路结构的堆叠结构，包括位于基板上的至少一个支撑构件和覆盖电路结构和支撑构件的顶板的加强结构以及至少一个 接合垫定位在屋顶上并电连接到导电线。 一种集成电路器件的制造方法，其特征在于，在基板上形成具有导线的电路结构的堆叠结构，形成包括所述基板上的至少一个支撑部件的加强结构以及覆盖所述支撑部件和所述电路结构的屋顶， 至少一个焊盘在屋顶上并且电连接到导电线。