-
1.发明申请公开(公告)号：US20050118845A1
公开(公告)日：2005-06-02
申请号：US10496558
申请日：2002-11-21
IPC分类号： C09J7/00 , C09J9/02 , C09J121/00 , C09J183/04 , H01B5/16 , H01B13/00 , H01L21/48 , H01L21/60 , H01L23/498 , H01R11/01 , H05K3/32 , H01R4/58
CPC分类号： H01L24/83 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2483/00 , H01L21/486 , H01L23/49827 , H01L24/29 , H01L2224/05573 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01058 , H01L2924/01061 , H01L2924/0107 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/12042 , H01L2924/351 , H05K3/321 , H05K2201/0133 , H05K2201/0314 , H05K2201/10378 , H05K2201/10674 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599
摘要： An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.
摘要翻译： 各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量 在150℃下不大于100MPa。 制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体 填充通孔。 一种半导体器件，其特征在于通过上述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。
-
2.发明授权公开(公告)号：US07056129B2
公开(公告)日：2006-06-06
申请号：US10496558
申请日：2002-11-21
IPC分类号： H01R9/09
CPC分类号： H01L24/83 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2483/00 , H01L21/486 , H01L23/49827 , H01L24/29 , H01L2224/05573 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01058 , H01L2924/01061 , H01L2924/0107 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/12042 , H01L2924/351 , H05K3/321 , H05K2201/0133 , H05K2201/0314 , H05K2201/10378 , H05K2201/10674 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599
摘要： An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.
摘要翻译： 各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量 在150℃下不大于100MPa。 制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体 填充通孔。 一种半导体器件，其特征在于通过上述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。
-
公开(公告)号：US06518204B2
公开(公告)日：2003-02-11
申请号：US10094231
申请日：2002-03-07
申请人： Kimio Yamakawa , Kazumi Nakayoshi , Hiroki Ishikawa , Ryoto Shima , Junji Nakanishi , Tomoko Kato , Minoru Isshiki , Katsutoshi Mine
发明人： Kimio Yamakawa , Kazumi Nakayoshi , Hiroki Ishikawa , Ryoto Shima , Junji Nakanishi , Tomoko Kato , Minoru Isshiki , Katsutoshi Mine
IPC分类号： H01L2131
CPC分类号： H01L23/3135 , C08F283/12 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/3122 , H01L23/293 , H01L2224/48091 , H01L2924/1301 , H01L2924/19041 , C08F230/08 , H01L2924/00014 , H01L2924/00
摘要： A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.
-
4.发明申请SILVER-BASED POWDER, METHOD OF PREPARATION THEREOF, AND CURABLE SILICONE COMPOSITION 审中-公开基于SILVER的粉末，其制备方法和可固化的硅酮组合物公开(公告)号：US20100155653A1
公开(公告)日：2010-06-24
申请号：US12714174
申请日：2010-02-26
摘要： A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.
摘要翻译： 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。
-
5.发明申请Silver-based powder, method of preparation thereof, and curable silicone composition 失效银粉，其制备方法和可固化的有机硅组合物公开(公告)号：US20060047043A1
公开(公告)日：2006-03-02
申请号：US10536669
申请日：2003-11-17
IPC分类号： C08K3/22
摘要： A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.
摘要翻译： 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。
-
6.发明授权Silver-based powder, method of preparation thereof, and curable silicone composition 失效银粉，其制备方法和可固化的有机硅组合物公开(公告)号：US07700678B2
公开(公告)日：2010-04-20
申请号：US10536669
申请日：2003-11-17
摘要： A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.
摘要翻译： 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。
-
7.发明申请Metal Base Circuit Substrate For An Optical Device And Method Manufacturing The Aforementioned Substrate 审中-公开用于光学装置的金属基底电路基板和方法制造前述基板公开(公告)号：US20070292697A1
公开(公告)日：2007-12-20
申请号：US10598967
申请日：2005-03-08
IPC分类号： H01L33/00
CPC分类号： H05K1/056 , H01L33/64 , H05K2201/0162 , H05K2201/10106
摘要： A metal base circuit substrate for an optical device, which effectively reflects the generated light and radiates heat from the substrate, comprises a metal base substrate made from aluminum or aluminum alloy that supports an electric circuit via an insulation layer, wherein the insulation layer is formed from a transparent cross-linked silicone body, and the electric circuit is formed directly on the insulation layer. And an efficient method for manufacturing the aforementioned substrate comprises the steps of: a) applying a cross-linkable silicone onto the surface of a metal base substrate made from aluminum or aluminum alloy, b) cross-link
摘要翻译： 一种用于光学器件的金属基底电路基板，其有效地反射所产生的光并从基板辐射热量，包括由铝或铝合金制成的金属基底，其通过绝缘层支撑电路，其中形成绝缘层 由透明的交联硅氧烷体构成，电路直接形成在绝缘层上。 并且制造上述基板的有效方法包括以下步骤：a）将可交联的硅氧烷涂覆在由铝或铝合金制成的金属基底的表面上，b）交联
-
公开(公告)号：US07537712B2
公开(公告)日：2009-05-26
申请号：US10509267
申请日：2003-03-03
申请人： Ryoto Shima , Kazumi Nakayoshi , Hiroki Ishikawa
发明人： Ryoto Shima , Kazumi Nakayoshi , Hiroki Ishikawa
IPC分类号： H01B1/02
摘要： An electrically conductive silicone rubber composition comprises, at least, (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule (an amount sufficient to cure the present composition), (C) a platinum based catalyst (an amount sufficient to promote the cure of the present composition), (D) 50 parts by weight to 5,000 parts by weight of a metal based electrically conductive filler, and (E) 5 parts by weight to 500 parts by weight of spherical silicone rubber particles with a surface active agent content of not more than 0.3 wt %.
摘要翻译： 导电硅橡胶组合物至少包含（A）100重量份每分子具有至少两个烯基的有机聚硅氧烷，（B）每分子具有至少两个与硅键合的氢原子的有机聚硅氧烷（足够的量 固化本组合物），（C）铂类催化剂（足以促进本发明组合物固化的量），（D）50重量份至5,000重量份的金属基导电填料和（ E）5重量份至500重量份的表面活性剂含量不超过0.3重量％的球形硅橡胶颗粒。
-
公开(公告)号：US06513680B2
公开(公告)日：2003-02-04
申请号：US09841895
申请日：2001-04-25
申请人： Kazumi Nakayoshi , Hiroki Ishikawa , Ryoto Shima , Junji Nakanishi , Tomoko Kato , Minoru Isshiki , Kimio Yamakawa
发明人： Kazumi Nakayoshi , Hiroki Ishikawa , Ryoto Shima , Junji Nakanishi , Tomoko Kato , Minoru Isshiki , Kimio Yamakawa
IPC分类号： G01F1100
CPC分类号： B65D81/2023 , B65D83/0005
摘要： A paste dispensing container comprising a cylindrical container having positioned therein a piston slidable along the walls of the container, a first end closed with a cap to seal paste within the container, a connecting portion at a second end of the container for connection with a pressurized fluid supply, and a leakage preventing cover having an air orifice covering the second end of the container. The paste dispensing container can be vacuum packaged in a gas-impermeable film for shipping and storage to prevent exposure of the paste contained therein to air.
-
公开(公告)号：US20050239940A1
公开(公告)日：2005-10-27
申请号：US10509267
申请日：2003-03-03
申请人： Ryoto Shima , Kazumi Nakayoshi , Hiroki Ishikawa
发明人： Ryoto Shima , Kazumi Nakayoshi , Hiroki Ishikawa
摘要： An electrically conductive silicone rubber composition comprises, at least, (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule (an amount sufficient to cure the present composition), (C) a platinum based catalyst (an amount sufficient to promote the cure of the present composition), (D) 50 parts by weight to 5,000 parts by weight of a metal based electrically conductive filler, and (E) 5 parts by weight to 500 parts by weight of spherical silicone rubber particles with a surface active agent content of not more than 0.3 wt %.
摘要翻译： 导电硅橡胶组合物至少包含（A）100重量份每分子具有至少两个烯基的有机聚硅氧烷，（B）每分子具有至少两个与硅键合的氢原子的有机聚硅氧烷（足够的量 固化本组合物），（C）铂类催化剂（足以促进本发明组合物固化的量），（D）50重量份至5,000重量份的金属基导电填料和（ E）5重量份至500重量份的表面活性剂含量不超过0.3重量％的球形硅橡胶颗粒。
-
-
-
-
-
-
-
-
-
搜索结果
38 条记录 (耗时 0.023 秒)