公开(公告)号：US5708939A

公开(公告)日：1998-01-13

申请号：US438491

申请日：1995-05-10

申请人： Akiko Oikawa ,  Toshiya Satoh ,  Toru Miyasaka

发明人： Akiko Oikawa ,  Toshiya Satoh ,  Toru Miyasaka

IPC分类号： G03G9/08 ,  G03G15/08

CPC分类号： G03G15/0887 ,  G03G15/0855 ,  G03G15/0865 ,  G03G15/0877 ,  G03G15/0891

摘要： An image forming apparatus for an electrophotographic process utilizes an agglomerate of toner powder so as to avoid scattering of toner powder. When the agglomerate is crushed or de-agglomerated to fine toner powder, only toner powder having a proper particle size for electrophotography is selected by a mesh member through which the toner must pass. The process can be utilized for a single component toner developing system and a component toner developing system.

摘要翻译： 用于电子照相方法的图像形成装置利用调色剂粉末的附聚物，以避免调色剂粉末的散射。 当附聚物被粉碎或去聚集成细调色剂粉末时，仅通过调色剂必须通过的网状构件选择具有用于电子照相术的适当粒度的调色剂粉末。 该方法可用于单组分调色剂显影系统和组分调色剂显影系统。

公开(公告)号：US5481349A

公开(公告)日：1996-01-02

申请号：US164799

申请日：1993-12-10

申请人： Toshiya Satoh ,  Akiko Oikawa ,  Katsuyoshi Onose ,  Keijiro Yagi ,  Tomoji Kitagishi

发明人： Toshiya Satoh ,  Akiko Oikawa ,  Katsuyoshi Onose ,  Keijiro Yagi ,  Tomoji Kitagishi

IPC分类号： G03G15/01 ,  G03G15/20

CPC分类号： G03G15/2053 ,  G03G15/2057 ,  G03G15/206 ,  G03G15/2064 ,  G03G2215/2074

摘要： An electrophotographic image fixing device having preventing offsetting and affording images of high quality is provided. The electrophotographic image fixing device has a heating roller 1, made up of a mandrel 5 and an elastic layer 4 of 40-60.degree. in hardness, as measured by a spring type hardness meter of JIS K6301, provided on the mandrel, and a pressure roller 2, arranged in contact with the heating roller 1 and having a surface layer 6 the hardness of which is equal to or higher than the hardness of the elastic layer 4 of the heating roller 1. A heater 8 is provided for heating and fusion-depositing a toner image onto a toner substrate 3, by passing through the nip portion between the two rollers the toner substrate 3 on which the toner image has been formed. The linear speed of the surface of the pressure roller is 1.005-1.05 times that of the surface of the heating roller.

摘要翻译： 提供了一种防止偏移和提供高质量图像的电子照相图像定影装置。 电子照相图像定影装置具有加热辊1，其由心轴5和硬度为40-60度的弹性层4组成，通过设置在心轴上的JIS K6301的弹簧型硬度计测量，并且压力 辊2与加热辊1接触并具有其硬度等于或高于加热辊1的弹性层4的硬度的表面层6.加热器8用于加热和熔化， 将调色剂图像沉积到调色剂基板3上，通过在两个辊之间的辊隙部分上形成调色剂图像的调色剂基板3。 加压辊表面的线速度为加热辊表面的线速度的1.005-1.05倍。

公开(公告)号：US5504567A

公开(公告)日：1996-04-02

申请号：US253493

申请日：1994-06-03

申请人： Toshiya Satoh ,  Akiko Oikawa ,  Katsuyoshi Onose ,  Keiziro Yagi ,  Tomoji Kitagishi

发明人： Toshiya Satoh ,  Akiko Oikawa ,  Katsuyoshi Onose ,  Keiziro Yagi ,  Tomoji Kitagishi

IPC分类号： B41J2/385 ,  G03G15/01 ,  G03G15/20 ,  G03G21/00

CPC分类号： G03G15/2039 ,  G03G15/205 ,  G03G2215/2074

摘要： A roller fixing unit for a color electrophotographic apparatus having a fixing roller and a pressing roller rotating in contact with each other, at least one of the rollers acting as a heating roller, as well as a control unit for connecting a power source to the heating device for only a predicted time duration based on a detected surface temperature of the heating roller so that the surface temperature of the heating roller reaches a setting temperature before the time when the top end of a first sheet of print medium having a color image arrives at the fixing roller in a case where the surface temperature of the heating roller in a standby state is lower than the setting temperature. The control unit is set to perform a power source connection for every sheet of print media coming out from an intermediate transfer unit in the color electrophotographic apparatus.

摘要翻译： 一种用于彩色电子照相设备的辊定影单元，具有定影辊和相互旋转的加压辊，至少一个作为加热辊的辊以及用于将电源连接到加热器的控制单元 装置，仅基于检测到的加热辊的表面温度预测的持续时间，使得加热辊的表面温度在具有彩色图像的第一张打印介质的顶端到达之前达到设定温度 在待机状态的加热辊的表面温度低于设定温度的情况下的定影辊。 控制单元被设置为对于从彩色电子照相设备中的中间转印单元出来的每张打印介质执行电源连接。

公开(公告)号：US06081683A

公开(公告)日：2000-06-27

申请号：US642443

申请日：1996-05-03

申请人： Toru Miyasaka ,  Toshiya Satoh ,  Hiroyuki Tadokoro ,  Kazuhiro Wakamatsu ,  Masahiko Saito

发明人： Toru Miyasaka ,  Toshiya Satoh ,  Hiroyuki Tadokoro ,  Kazuhiro Wakamatsu ,  Masahiko Saito

IPC分类号： G03G15/00 ,  G03G15/01 ,  G03G15/06

CPC分类号： G03G15/0126 ,  G03G15/0173 ,  G03G2215/0174

摘要： A color electrophotographic apparatus includes a photosensitive belt arranged obliquely, and a plurality of developing machines arranged on one side of the photosensitive belt in a stacked manner so as to be displaced from one another in a horizontal direction. The photosensitive belt is movable from below to above in a direction opposite to a direction of gravity when in a developing position. The developing machines include a non-magnetic, one component contact developing system having a developing roll for adhering toner on the photosensitive belt and a blade disposed below the developing roll for controlling an amount of toner adhering to the developing roll.

摘要翻译： 彩色电子照相设备包括倾斜布置的感光带和多个显影机，它们以感光带一侧的方式布置成在水平方向上相互错开。 当处于显影位置时，感光带可以在与重力方向相反的方向上从下方移动到上方。 显影机包括非磁性单组分接触显影系统，其具有用于在感光带上粘附调色剂的显影辊和设置在显影辊下方的刮刀，用于控制附着在显影辊上的调色剂的量。

公开(公告)号：USD651170S1

公开(公告)日：2011-12-27

申请号：US29354621

申请日：2010-01-27

申请人： Masashi Yura ,  Shinichi Fujino ,  Yusuke Takagi ,  Toshiya Satoh ,  Kinya Nakatsu ,  Takeshi Tokuyama

设计人： Masashi Yura ,  Shinichi Fujino ,  Yusuke Takagi ,  Toshiya Satoh ,  Kinya Nakatsu ,  Takeshi Tokuyama

公开(公告)号：US20110299265A1

公开(公告)日：2011-12-08

申请号：US12920296

申请日：2009-10-30

申请人： Kinya Nakatsu ,  Hiroshi Hozoji ,  Takeshi Tokuyama ,  Yusuke Takagi ,  Toshiya Satoh ,  Taku Oyama ,  Takanori Ninomiya

发明人： Kinya Nakatsu ,  Hiroshi Hozoji ,  Takeshi Tokuyama ,  Yusuke Takagi ,  Toshiya Satoh ,  Taku Oyama ,  Takanori Ninomiya

IPC分类号： H05K7/00

CPC分类号： H02M7/003 ,  B60L11/14 ,  B60L11/18 ,  B60L11/1803 ,  B60L2200/26 ,  B60L2210/40 ,  H01L21/4882 ,  H01L23/36 ,  H01L23/473 ,  H01L24/33 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H02M7/44 ,  H02M7/5395 ,  H02M2001/327 ,  H02P27/08 ,  H05K7/20409 ,  H05K7/205 ,  H05K7/209 ,  H05K7/20927 ,  Y02T10/70 ,  Y02T10/7005 ,  Y02T10/7077 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.

摘要翻译： 包括功率模块的功率模块和功率转换器装置包括：两个基板，它们的主表面相互面对; 设置在所述两个基板之间的半导体电路单元; 连接构件，其连接到所述两个基板并形成容纳所述半导体电路单元的壳体区域; 以及绝缘构件，其设置在所述基板和所述半导体电路单元之间，并且确保所述基板和所述半导体电路单元的电绝缘。 连接构件的刚性或厚度小于基板的刚度或厚度。

公开(公告)号：US07542317B2

公开(公告)日：2009-06-02

申请号：US11501784

申请日：2006-08-10

申请人： Katsunori Azuma ,  Toshiaki Morita ,  Hiroshi Hozoji ,  Kazuhiro Suzuki ,  Toshiya Satoh ,  Osamu Otsuka

发明人： Katsunori Azuma ,  Toshiaki Morita ,  Hiroshi Hozoji ,  Kazuhiro Suzuki ,  Toshiya Satoh ,  Osamu Otsuka

IPC分类号： H02M7/537

CPC分类号： H05K7/1432 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/40091 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/45124 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2224/37099

摘要： The power conversion apparatus uses the semiconductor device. Said semiconductor device includes a first group of power semiconductor elements at least one of which is electrically connected between a first potential and a third potential, a second group of power semiconductor elements at least one of which is electrically connected between a second potential and the third potential, and a third group of power semiconductor elements at least one of which is electrically connected between the first potential and the third potential. The second group is disposed between the first group and third group.Thereby, a low-loss semiconductor device having both inductance reducibility and heat generation balancing capability and also an electric power conversion apparatus using the same is provided.

摘要翻译： 电力转换装置使用半导体装置。 所述半导体器件包括第一组功率半导体元件，其中至少一个功率半导体元件电连接在第一电位和第三电位之间，第二组功率半导体元件，其中至少一个功率半导体元件电连接在第二电位与第三电位之间 电位和第三组功率半导体元件，其中至少一个功率半导体元件电连接在第一电位和第三电位之间。 第二组置于第一组和第三组之间。 因此，提供了具有电感还原性和发热平衡能力的低损耗半导体器件以及使用其的电力转换装置。

公开(公告)号：US07217992B2

公开(公告)日：2007-05-15

申请号：US10861523

申请日：2004-06-07

申请人： Masahiko Ogino ,  Takumi Ueno ,  Shuji Eguchi ,  Akira Nagai ,  Toshiya Satoh ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Tadanori Segawa ,  Nobutake Tsuyuno ,  Asao Nishimura ,  Ichiro Anjoh

发明人： Masahiko Ogino ,  Takumi Ueno ,  Shuji Eguchi ,  Akira Nagai ,  Toshiya Satoh ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Tadanori Segawa ,  Nobutake Tsuyuno ,  Asao Nishimura ,  Ichiro Anjoh

IPC分类号： H01L23/02 ,  H01L23/28 ,  H01L21/00

CPC分类号： H01L23/3171 ,  H01L23/3114 ,  H01L23/3164 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2924/00012

摘要： Semiconductor devices,-semiconductor wafers, and semiconductor modules are provided: wherein the semiconductor device has a small warp; damages at chip edge and cracks in a dropping test are scarcely generated; and the semiconductor device is superior in mounting reliability and mass producibility.The semiconductor device 17 comprising: a semiconductor chip 64; a porous stress relaxing layer 3 provided on the plane, whereon circuits and electrodes are formed, of the semiconductor chip; a circuit layer 2 provided on the stress relaxing layer and connected to the electrodes; and external terminals 10 provided on the circuit layer; wherein an organic protecting film 7 is formed on the plane, opposite to the stress relaxing layer, of the semiconductor chip, and respective side planes of the stress relaxing layer, the semiconductor chip 6, and the protecting film 7 are exposed outside on a same plane.

摘要翻译： 提供半导体器件，半导体晶片和半导体模块：其中半导体器件具有小的翘曲; 几乎不产生芯片边缘的损坏和跌落试验中的裂纹; 半导体装置的安装可靠性和大规模生产性优异。 半导体器件17包括：半导体芯片64; 设置在半导体芯片的形成有电路和电极的平面上的多孔应力缓和层3; 设置在应力缓和层上并与电极连接的电路层2; 和设置在电路层上的外部端子10; 其中在半导体芯片的与应力缓和层相反的平面上形成有机保护膜7，并且应力缓和层，半导体芯片6和保护膜7的各个侧面在外部暴露在外部 飞机

公开(公告)号：US20070051974A1

公开(公告)日：2007-03-08

申请号：US11501784

申请日：2006-08-10

申请人： Katsunori Azuma ,  Toshiaki Morita ,  Hiroshi Hozoji ,  Kazuhiro Suzuki ,  Toshiya Satoh ,  Osamu Otsuka

发明人： Katsunori Azuma ,  Toshiaki Morita ,  Hiroshi Hozoji ,  Kazuhiro Suzuki ,  Toshiya Satoh ,  Osamu Otsuka

IPC分类号： H01L31/111

CPC分类号： H05K7/1432 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/40091 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/45124 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2224/37099

摘要： The power conversion apparatus uses the semiconductor device. Said semiconductor device includes a first group of power semiconductor elements at least one of which is electrically connected between a first potential and a third potential, a second group of power semiconductor elements at least one of which is electrically connected between a second potential and the third potential, and a third group of power semiconductor elements at least one of which is electrically connected between the first potential and the third potential. The second group is disposed between the first group and third group. Thereby, a low-loss semiconductor device having both inductance reducibility and heat generation balancing capability and also an electric power conversion apparatus using the same is provided.

摘要翻译： 电力转换装置使用半导体装置。 所述半导体器件包括第一组功率半导体元件，其中至少一个功率半导体元件电连接在第一电位和第三电位之间，第二组功率半导体元件，其中至少一个功率半导体元件电连接在第二电位与第三电位之间 电位和第三组功率半导体元件，其中至少一个功率半导体元件电连接在第一电位和第三电位之间。 第二组置于第一组和第三组之间。 因此，提供了具有电感还原性和发热平衡能力的低损耗半导体器件以及使用其的电力转换装置。

公开(公告)号：US06946723B2

公开(公告)日：2005-09-20

申请号：US09809181

申请日：2001-03-16

申请人： Toshiya Satoh ,  Masahiko Ogino ,  Tadanori Segawa ,  Yoshihide Yamaguchi ,  Hiroyuki Tenmei ,  Atsushi Kazama ,  Ichiro Anjo ,  Asao Nishimura

发明人： Toshiya Satoh ,  Masahiko Ogino ,  Tadanori Segawa ,  Yoshihide Yamaguchi ,  Hiroyuki Tenmei ,  Atsushi Kazama ,  Ichiro Anjo ,  Asao Nishimura

IPC分类号： H01L23/29 ,  H01L21/301 ,  H01L21/3205 ,  H01L21/56 ,  H01L21/60 ,  H01L21/768 ,  H01L23/31 ,  H01L23/485 ,  H01L23/52 ,  H01L23/522 ,  H01L23/495

CPC分类号： H01L24/11 ,  H01L23/3192 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor device having a semiconductor element is obtained by cutting a semiconductor wafer, having an electrode pad formed on one side thereof, along a scribe line. The semiconductor device has a semiconductor element protective layer on the semiconductor element so as to form an opening above the pad, a stress cushioning layer on the layer so as to form an opening on the pad, a lead wire portion reaching the layer from the electrode pad via the openings, external electrodes on the lead wire portion, and a conductor protective layer on the layer. The layer, the layer, and the conductor protective layer form respective end faces on the end surface of the semiconductor element inside the scribe line and expose a surface of the semiconductor element from the end face of the end surface to a point inside of the scribe line, thereby to expose the scribe line.

摘要翻译： 具有半导体元件的半导体器件通过沿着划线切割具有在其一侧形成的电极焊盘的半导体晶片来获得。 半导体器件在半导体元件上具有半导体元件保护层，以便在焊盘上形成开口，该层上的应力缓冲层在焊盘上形成开口，从电极到达该层的引线部分 通过开口焊盘，引线部分上的外部电极以及该层上的导体保护层。 层，层和导体保护层在划线内部的半导体元件的端面上形成相应的端面，并将半导体元件的表面从端表面的端面暴露于刻痕内侧 线，从而暴露划线。