利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

45 条记录 (耗时 0.034 秒)

    METHOD AND APPARATUS FOR THERMAL JET PRINTING
    3.
    发明申请
    METHOD AND APPARATUS FOR THERMAL JET PRINTING 审中-公开
    热喷涂印刷方法与装置

    公开(公告)号：US20120076925A1

    公开(公告)日：2012-03-29

    申请号：US13311409

    申请日：2011-12-05

    申请人： Vladimir Bulovic ,  Jianglong Chen ,  Conor Francis Madigan ,  Martin A. Schmidt

    发明人： Vladimir Bulovic ,  Jianglong Chen ,  Conor Francis Madigan ,  Martin A. Schmidt

    IPC分类号： B41J29/38 ,  B05D5/06

    CPC分类号： B41J2/04588 ,  B05B17/0638 ,  B41J2/04581 ,  B41J2/07 ,  B41J2/14 ,  B41J2202/09 ,  B41J2202/16 ,  H01L51/0005 ,  H01L51/56 ,  H05B33/10

    摘要： The disclosure relates to a method for depositing films on a substrate which may form part of an LED or other types of display. In one embodiment, the disclosure relates to an apparatus for depositing ink on a substrate. The apparatus includes a chamber for receiving ink; a discharge nozzle having an inlet port and an outlet port, the discharge nozzle receiving a quantity of ink from the chamber at the inlet port and dispensing the quantity of ink from the outlet port; and a dispenser for metering the quantity of ink from the chamber to the inlet port of the discharge nozzle; wherein the chamber receives ink in liquid form having a plurality of suspended particles and the quantity of ink is pulsatingly metered from the chamber to the discharge nozzle; and the discharge nozzle evaporates the carrier liquid and deposits the solid particles on the substrate.

    摘要翻译： 本公开涉及一种用于在可以形成LED或其他类型的显示器的一部分的衬底上沉积膜的方法。 在一个实施例中，本公开涉及一种用于在基底上沉积墨的装置。 该装置包括用于接收墨水的腔室; 具有入口和出口的排出喷嘴，所述排出喷嘴从所述入口处的所述室接收一定量的墨，并从所述出口分配墨水量; 以及分配器，用于计量从所述腔室到所述排放喷嘴的入口的墨水量; 其中所述腔室容纳具有多个悬浮颗粒的液体形式的墨水，并且所述墨水量从所述腔室脉动地计量到所述排放喷嘴; 并且排出喷嘴使载液蒸发并将固体颗粒沉积在基板上。

    Backside contact of sensor microstructures
    7.
    发明授权
    Backside contact of sensor microstructures 失效
    传感器微结构背面接触

    公开(公告)号：US5511428A

    公开(公告)日：1996-04-30

    申请号：US257716

    申请日：1994-06-10

    申请人： Howard D. Goldberg ,  Martin A. Schmidt

    发明人： Howard D. Goldberg ,  Martin A. Schmidt

    IPC分类号： B81B7/00 ,  G01F1/684 ,  G01L9/00 ,  G01P15/08 ,  H01L29/96

    CPC分类号： B81B7/0061 ,  B81B7/007 ,  G01F1/6845 ,  G01L9/0042 ,  G01L9/0073 ,  G01P15/0802 ,  G01B2210/64

    摘要： A sensor microstructure contact scheme is provided for making backside electrical, mechanical, fluidic, or other contact to mechanical microstructures. The contact scheme is applicable to pressure sensors, shear stress sensors, flow rate sensors, temperature sensors, resonant microactuators, and other microsensors and microactuators. The contact scheme provides a microelectromechanical sensor body and support structure for backside contact of the sensor body, and features a support wafer substrate having one or more through-wafer vias each with a lateral span on the dimension of microns and a span that is more narrow at the wafer front surface than at the wafer back surface. An insulating film covers a portion of the support wafer substrate and sidewalls of the vias--with the lateral via span at the front surface being open. The front surface of the support wafer substrate is bonded to the front surface of a sensor body wafer substrate, such that contact of the front surface of the sensor body wafer substrate may be made through the support wafer substrate vias from the back surface of the support wafer substrate. The sensor body wafer substrate is adapted to define a mechanical sensor microstructure, and comprises a plurality of isolated substrate regions, each region corresponding to one of the support wafer substrate through-wafer vias. Each such region is circumscribed by an edge of the mechanical sensor microstructure and an isolating border region. Contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions is isolated and thereby prevented from making contact to any other sensor body substrate region.

    摘要翻译： 提供传感器微结构接触方案用于制造机械微观结构的背面电气，机械，流体或其他接触。 接触方案适用于压力传感器，剪切应力传感器，流量传感器，温度传感器，共振微致动器和其他微传感器和微型致动器。 接触方案提供了用于传感器主体的背侧接触的微机电传感器主体和支撑结构，其特征在于具有一个或多个贯穿晶片通孔的支撑晶片基板，每个通孔具有微米尺寸上的横向跨度和更窄的跨度 在晶片正面与晶片背面相比。 绝缘膜覆盖支撑晶片基板的一部分和通孔的侧壁，其中在前表面处的横向通孔跨度是敞开的。 支撑晶片基板的前表面结合到传感器体晶片基板的前表面，使得传感器体晶片基板的前表面可以通过支撑晶片基板通孔从支撑体的后表面 晶圆基板。 传感器体晶片衬底适于限定机械传感器微结构，并且包括多个隔离的衬底区域，每个区域对应于支撑晶片衬底通晶片通孔之一。 每个这样的区域被机械传感器微结构的边缘和隔离边界区域限定。 通过支撑晶片衬底通过晶片通孔中的一个到相应的一个传感器主体衬底区域的接触被隔离，从而防止与任何其它传感器主体衬底区域接触。

    Method and apparatus for forming structures of polymer nanobeads
    9.
    发明授权
    Method and apparatus for forming structures of polymer nanobeads 有权
    用于形成聚合物纳米棒结构的方法和装置

    公开(公告)号：US09195004B2

    公开(公告)日：2015-11-24

    申请号：US12746044

    申请日：2009-01-05

    申请人： Vladimir Bulovic ,  Murali Chaparala ,  Jianglong Chen ,  Eric Wing-Jing Lam ,  Valerie Leblanc ,  Martin A. Schmidt

    发明人： Vladimir Bulovic ,  Murali Chaparala ,  Jianglong Chen ,  Eric Wing-Jing Lam ,  Valerie Leblanc ,  Martin A. Schmidt

    IPC分类号： G02B6/138 ,  B05D3/10 ,  B05D3/04 ,  G03F7/16 ,  G02B6/12

    CPC分类号： G02B6/138 ,  B05D3/04 ,  B05D3/0453 ,  B05D3/107 ,  G02B2006/12071 ,  G03F7/168

    摘要： The disclosure relates to providing printed structures of polymer that have substantially flat printed surfaces. In one embodiment, the disclosure relates to a post-printing treatment apparatus for receiving a substrate supporting a polymer printing thereon. The polymer can be PMMA or other suitable polymer. In a related embodiment, the polymer defines a thermoplastic polymer having a glass transition temperature. The apparatus can comprise of a chamber, and input manifold, an exhaust manifold, a solvent reservoir and a gas reservoir. The solvent reservoir provides one or more solvent systems adapted to chemically bind, and potentially react, with the polymer. The gas reservoir provides one or more gases for drying the substrate and printed polymer after the solvent treatment step. In one application, a substrate having printed surface thereon is placed in the chamber and exposed to the solvent system for sufficient period of time to provide substantially flat print surfaces.

    摘要翻译： 本公开涉及提供具有基本平坦的印刷表面的聚合物的印刷结构。 在一个实施例中，本公开涉及一种用于接收支撑其上的聚合物印刷的基板的后印刷处理设备。 聚合物可以是PMMA或其它合适的聚合物。 在相关实施方案中，聚合物限定了具有玻璃化转变温度的热塑性聚合物。 该装置可以包括腔室，输入歧管，排气歧管，溶剂储存器和气体储存器。 溶剂储存器提供一种或多种溶剂体系，其适于与聚合物化学结合并潜在地与聚合物反应。 在溶剂处理步骤之后，气体储存器提供用于干燥基底和印刷聚合物的一种或多种气体。 在一个应用中，其上具有印刷表面的基板放置在室中并暴露于溶剂系统足够的时间以提供基本平坦的印刷表面。

    Method and Apparatus for Depositing LED Organic Film
    10.
    发明申请
    Method and Apparatus for Depositing LED Organic Film 审中-公开
    用于沉积LED有机膜的方法和装置

    公开(公告)号：US20120015104A1

    公开(公告)日：2012-01-19

    申请号：US13088323

    申请日：2011-04-15

    申请人： Vladimir Bulovic ,  Marc A. Baldo ,  Martin A. Schmidt ,  Valerie LeBlanc ,  Jianglong Chen

    发明人： Vladimir Bulovic ,  Marc A. Baldo ,  Martin A. Schmidt ,  Valerie LeBlanc ,  Jianglong Chen

    IPC分类号： C23C16/448 ,  C23C16/455 ,  B05C5/00 ,  B05C13/00 ,  B05C11/00

    CPC分类号： H01L51/0011 ,  B05D1/12 ,  H01L51/56

    摘要： In one embodiment the disclosure relates to an apparatus for depositing an organic material on a substrate, including a source heater for heating organic particles to form suspended organic particles; a transport stream for delivering the suspended organic particles to a discharge nozzle, the discharge nozzle having a plurality of micro-pores, the micro-pores providing a conduit for passage of the suspended organic particles; and a nozzle heater for pulsatingly heating the micro-pores nozzle to discharge the suspended organic particles from the discharge nozzle.

    摘要翻译： 在一个实施方案中，本公开涉及一种用于在基底上沉积有机材料的装置，包括用于加热有机颗粒以形成悬浮的有机颗粒的源加热器; 用于将悬浮的有机颗粒输送到排出喷嘴的输送流，排出喷嘴具有多个微孔，微孔提供用于悬浮的有机颗粒通过的导管; 以及喷嘴加热器，用于脉动地加热微孔喷嘴以从排出喷嘴排出悬浮的有机颗粒。